JP3899034B2 - 流体解離電極を備えた冷却基板を含む電子モジュール及び関連する方法 - Google Patents

流体解離電極を備えた冷却基板を含む電子モジュール及び関連する方法 Download PDF

Info

Publication number
JP3899034B2
JP3899034B2 JP2002573498A JP2002573498A JP3899034B2 JP 3899034 B2 JP3899034 B2 JP 3899034B2 JP 2002573498 A JP2002573498 A JP 2002573498A JP 2002573498 A JP2002573498 A JP 2002573498A JP 3899034 B2 JP3899034 B2 JP 3899034B2
Authority
JP
Japan
Prior art keywords
cooling
evaporator
cooling fluid
chamber
condenser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2002573498A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004523919A5 (https=
JP2004523919A (ja
Inventor
スナイダー，スティーヴン
ニュートン，チャールズ
ランジ，マイケル
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Harris Corp
Original Assignee
Harris Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harris Corp filed Critical Harris Corp
Publication of JP2004523919A publication Critical patent/JP2004523919A/ja
Publication of JP2004523919A5 publication Critical patent/JP2004523919A5/ja
Application granted granted Critical
Publication of JP3899034B2 publication Critical patent/JP3899034B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2002573498A 2001-03-19 2002-03-12 流体解離電極を備えた冷却基板を含む電子モジュール及び関連する方法 Expired - Fee Related JP3899034B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/811,815 US6418019B1 (en) 2001-03-19 2001-03-19 Electronic module including a cooling substrate with fluid dissociation electrodes and related methods
PCT/US2002/007312 WO2002076164A2 (en) 2001-03-19 2002-03-12 Electronic module with fluid dissociation electrodes and methods

Publications (3)

Publication Number Publication Date
JP2004523919A JP2004523919A (ja) 2004-08-05
JP2004523919A5 JP2004523919A5 (https=) 2005-06-02
JP3899034B2 true JP3899034B2 (ja) 2007-03-28

Family

ID=25207668

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002573498A Expired - Fee Related JP3899034B2 (ja) 2001-03-19 2002-03-12 流体解離電極を備えた冷却基板を含む電子モジュール及び関連する方法

Country Status (9)

Country Link
US (1) US6418019B1 (https=)
EP (1) EP1378154B1 (https=)
JP (1) JP3899034B2 (https=)
KR (1) KR100553172B1 (https=)
CN (1) CN1253063C (https=)
AU (1) AU2002306686B2 (https=)
CA (1) CA2441124C (https=)
NO (1) NO20034070L (https=)
WO (1) WO2002076164A2 (https=)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003110076A (ja) * 2001-10-01 2003-04-11 Fujitsu Ltd 熱拡散器および放熱器
US20040011509A1 (en) * 2002-05-15 2004-01-22 Wing Ming Siu Vapor augmented heatsink with multi-wick structure
US6639798B1 (en) * 2002-06-24 2003-10-28 Delphi Technologies, Inc. Automotive electronics heat exchanger
JP2004037039A (ja) 2002-07-05 2004-02-05 Sony Corp 冷却装置、電子機器装置、表示装置及び冷却装置の製造方法
US7108056B1 (en) * 2002-10-18 2006-09-19 Atec Advanced Thermal And Environmental Concepts Slit-type restrictor for controlling flow delivery to electrohydrodynamic thin film evaporator
JP3896961B2 (ja) * 2002-12-12 2007-03-22 ソニー株式会社 熱輸送装置および熱輸送装置の製造方法
US20060196640A1 (en) * 2004-12-01 2006-09-07 Convergence Technologies Limited Vapor chamber with boiling-enhanced multi-wick structure
DE102006011333A1 (de) * 2006-03-09 2007-09-13 Behr Industry Gmbh & Co. Kg Vorrichtung zur Kühlung, insbesondere elektronischer Bauelemente
TW200848683A (en) * 2007-03-08 2008-12-16 Convergence Technologies Ltd Heat transfer device
KR100891520B1 (ko) * 2007-05-15 2009-04-06 주식회사 하이닉스반도체 열 순환 매체를 구비한 인쇄회로기판 및 그의 제조방법
CN102423653A (zh) * 2007-09-14 2012-04-25 株式会社爱德万测试 高级热控接口
US8195118B2 (en) 2008-07-15 2012-06-05 Linear Signal, Inc. Apparatus, system, and method for integrated phase shifting and amplitude control of phased array signals
KR200451800Y1 (ko) * 2008-09-25 2011-01-12 홍순열 전자석을 이용한 핫 런너 밸브 게이트 장치의 와류방지 장치
US8872719B2 (en) 2009-11-09 2014-10-28 Linear Signal, Inc. Apparatus, system, and method for integrated modular phased array tile configuration
JPWO2011145618A1 (ja) * 2010-05-19 2013-07-22 日本電気株式会社 沸騰冷却器
US9360514B2 (en) * 2012-04-05 2016-06-07 Board Of Regents, The University Of Texas System Thermal reliability testing systems with thermal cycling and multidimensional heat transfer
WO2017143587A1 (zh) 2016-02-26 2017-08-31 华为技术有限公司 光组件封装结构、光组件、光模块及相关装置和系统
CN113712333A (zh) 2016-04-18 2021-11-30 史赛克公司 包括带有透明面罩及该面罩上的控制按钮的头罩的个人防护系统
US10622282B2 (en) * 2017-07-28 2020-04-14 Qualcomm Incorporated Systems and methods for cooling an electronic device
EP3454370B1 (en) * 2017-09-11 2020-09-09 Nokia Technologies Oy Package, and method of manufacturing a package comprising an enclosure and an integrated circuit
US20190191589A1 (en) * 2017-12-15 2019-06-20 Google Llc Three-Dimensional Electronic Structure with Integrated Phase-Change Cooling
DE102020103028A1 (de) * 2019-03-06 2020-09-10 GM Global Technology Operations LLC Verbundanordnungen zur thermischen kühlung von elektronischen bauteilen

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU883643A2 (ru) * 1979-03-19 1981-11-23 Институт Прикладной Физики Ан Мсср Теплова труба с электрогидродинамическим генератором
US4220195A (en) * 1979-05-24 1980-09-02 The United States Of America As Represented By The Secretary Of The Navy Ion drag pumped heat pipe
US4519447A (en) 1980-08-04 1985-05-28 Fine Particle Technology Corporation Substrate cooling
US4833567A (en) 1986-05-30 1989-05-23 Digital Equipment Corporation Integral heat pipe module
US5199165A (en) 1991-12-13 1993-04-06 Hewlett-Packard Company Heat pipe-electrical interconnect integration method for chip modules
US5216580A (en) 1992-01-14 1993-06-01 Sun Microsystems, Inc. Optimized integral heat pipe and electronic circuit module arrangement
US5308920A (en) * 1992-07-31 1994-05-03 Itoh Research & Development Laboratory Co., Ltd. Heat radiating device
US6056044A (en) * 1996-01-29 2000-05-02 Sandia Corporation Heat pipe with improved wick structures
EP0833116A4 (en) * 1996-04-15 2001-09-12 Mitsubishi Electric Corp WATER EVAPORATION COOLER WITH ELECTROLYTIC REACTION
TW346566B (en) * 1996-08-29 1998-12-01 Showa Aluminiun Co Ltd Radiator for portable electronic apparatus

Also Published As

Publication number Publication date
KR20030087646A (ko) 2003-11-14
NO20034070D0 (no) 2003-09-15
EP1378154A2 (en) 2004-01-07
JP2004523919A (ja) 2004-08-05
EP1378154A4 (en) 2009-05-06
NO20034070L (no) 2003-11-19
WO2002076164A2 (en) 2002-09-26
WO2002076164A3 (en) 2002-11-14
CN1498522A (zh) 2004-05-19
CN1253063C (zh) 2006-04-19
CA2441124C (en) 2011-10-04
CA2441124A1 (en) 2002-09-26
KR100553172B1 (ko) 2006-02-21
EP1378154B1 (en) 2011-09-21
US6418019B1 (en) 2002-07-09
AU2002306686B2 (en) 2004-05-20

Similar Documents

Publication Publication Date Title
KR100553171B1 (ko) 냉각기판을 포함하는 전자모듈 및 그 제조방법
JP3899034B2 (ja) 流体解離電極を備えた冷却基板を含む電子モジュール及び関連する方法
AU2002254176A1 (en) Electronic module including a cooling substrate and related methods
AU2002306686A1 (en) Electronic module with fluid dissociation electrodes and methods
US12322675B2 (en) Electronic module comprising a pulsating heat pipe
US8358000B2 (en) Double side cooled power module with power overlay
JP6050617B2 (ja) 電源モジュール用冷却装置及びそれに関連する方法
EP4109688B1 (en) Integrated heat spreader
US11895810B2 (en) Cooling arrangement
WO2002089539A1 (en) Integrated cooling of a printed circuit board structure
TW200416376A (en) Semiconductor integrated circuit device and semiconductor integrated circuit chip thereof
US7584622B2 (en) Localized refrigerator apparatus for a thermal management device
KR20240018621A (ko) 열전 모듈
JP4391351B2 (ja) 冷却装置
US20060262819A1 (en) Diode laser component with an integrated cooling element
CN221687527U (zh) 封装结构
Slingerlands et al. Beaupre et al.
Schulz-Harder et al. Hermetic packaging for power multichip modules
CHU RECENT DEVELOPMENTS IN THERMAL TECHNOLOGY

Legal Events

Date Code Title Description
A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20060711

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20061011

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20061128

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20061222

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110105

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120105

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130105

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130105

Year of fee payment: 6

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees