KR100553172B1 - 유체 분리전극을 갖는 냉각기판을 포함하는 전자모듈 및그에 따른 방법 - Google Patents

유체 분리전극을 갖는 냉각기판을 포함하는 전자모듈 및그에 따른 방법 Download PDF

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KR100553172B1
KR100553172B1 KR1020037012176A KR20037012176A KR100553172B1 KR 100553172 B1 KR100553172 B1 KR 100553172B1 KR 1020037012176 A KR1020037012176 A KR 1020037012176A KR 20037012176 A KR20037012176 A KR 20037012176A KR 100553172 B1 KR100553172 B1 KR 100553172B1
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South Korea
Prior art keywords
cooling
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cooling fluid
condenser
chamber
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Korean (ko)
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KR20030087646A (ko
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스티븐 신더
챨스 뉴톤
마이클 랭
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해리스 코포레이션
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state

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  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
KR1020037012176A 2001-03-19 2002-03-12 유체 분리전극을 갖는 냉각기판을 포함하는 전자모듈 및그에 따른 방법 Expired - Lifetime KR100553172B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/811,815 2001-03-19
US09/811,815 US6418019B1 (en) 2001-03-19 2001-03-19 Electronic module including a cooling substrate with fluid dissociation electrodes and related methods
PCT/US2002/007312 WO2002076164A2 (en) 2001-03-19 2002-03-12 Electronic module with fluid dissociation electrodes and methods

Publications (2)

Publication Number Publication Date
KR20030087646A KR20030087646A (ko) 2003-11-14
KR100553172B1 true KR100553172B1 (ko) 2006-02-21

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KR1020037012176A Expired - Lifetime KR100553172B1 (ko) 2001-03-19 2002-03-12 유체 분리전극을 갖는 냉각기판을 포함하는 전자모듈 및그에 따른 방법

Country Status (9)

Country Link
US (1) US6418019B1 (https=)
EP (1) EP1378154B1 (https=)
JP (1) JP3899034B2 (https=)
KR (1) KR100553172B1 (https=)
CN (1) CN1253063C (https=)
AU (1) AU2002306686B2 (https=)
CA (1) CA2441124C (https=)
NO (1) NO20034070L (https=)
WO (1) WO2002076164A2 (https=)

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JP2003110076A (ja) * 2001-10-01 2003-04-11 Fujitsu Ltd 熱拡散器および放熱器
US20040011509A1 (en) * 2002-05-15 2004-01-22 Wing Ming Siu Vapor augmented heatsink with multi-wick structure
US6639798B1 (en) * 2002-06-24 2003-10-28 Delphi Technologies, Inc. Automotive electronics heat exchanger
JP2004037039A (ja) 2002-07-05 2004-02-05 Sony Corp 冷却装置、電子機器装置、表示装置及び冷却装置の製造方法
US7108056B1 (en) * 2002-10-18 2006-09-19 Atec Advanced Thermal And Environmental Concepts Slit-type restrictor for controlling flow delivery to electrohydrodynamic thin film evaporator
JP3896961B2 (ja) * 2002-12-12 2007-03-22 ソニー株式会社 熱輸送装置および熱輸送装置の製造方法
US20060196640A1 (en) * 2004-12-01 2006-09-07 Convergence Technologies Limited Vapor chamber with boiling-enhanced multi-wick structure
DE102006011333A1 (de) * 2006-03-09 2007-09-13 Behr Industry Gmbh & Co. Kg Vorrichtung zur Kühlung, insbesondere elektronischer Bauelemente
TW200848683A (en) * 2007-03-08 2008-12-16 Convergence Technologies Ltd Heat transfer device
KR100891520B1 (ko) * 2007-05-15 2009-04-06 주식회사 하이닉스반도체 열 순환 매체를 구비한 인쇄회로기판 및 그의 제조방법
CN102423653A (zh) * 2007-09-14 2012-04-25 株式会社爱德万测试 高级热控接口
US8195118B2 (en) 2008-07-15 2012-06-05 Linear Signal, Inc. Apparatus, system, and method for integrated phase shifting and amplitude control of phased array signals
KR200451800Y1 (ko) * 2008-09-25 2011-01-12 홍순열 전자석을 이용한 핫 런너 밸브 게이트 장치의 와류방지 장치
US8872719B2 (en) 2009-11-09 2014-10-28 Linear Signal, Inc. Apparatus, system, and method for integrated modular phased array tile configuration
JPWO2011145618A1 (ja) * 2010-05-19 2013-07-22 日本電気株式会社 沸騰冷却器
US9360514B2 (en) * 2012-04-05 2016-06-07 Board Of Regents, The University Of Texas System Thermal reliability testing systems with thermal cycling and multidimensional heat transfer
WO2017143587A1 (zh) 2016-02-26 2017-08-31 华为技术有限公司 光组件封装结构、光组件、光模块及相关装置和系统
CN113712333A (zh) 2016-04-18 2021-11-30 史赛克公司 包括带有透明面罩及该面罩上的控制按钮的头罩的个人防护系统
US10622282B2 (en) * 2017-07-28 2020-04-14 Qualcomm Incorporated Systems and methods for cooling an electronic device
EP3454370B1 (en) * 2017-09-11 2020-09-09 Nokia Technologies Oy Package, and method of manufacturing a package comprising an enclosure and an integrated circuit
US20190191589A1 (en) * 2017-12-15 2019-06-20 Google Llc Three-Dimensional Electronic Structure with Integrated Phase-Change Cooling
DE102020103028A1 (de) * 2019-03-06 2020-09-10 GM Global Technology Operations LLC Verbundanordnungen zur thermischen kühlung von elektronischen bauteilen

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SU883643A2 (ru) * 1979-03-19 1981-11-23 Институт Прикладной Физики Ан Мсср Теплова труба с электрогидродинамическим генератором
US4220195A (en) * 1979-05-24 1980-09-02 The United States Of America As Represented By The Secretary Of The Navy Ion drag pumped heat pipe
US4519447A (en) 1980-08-04 1985-05-28 Fine Particle Technology Corporation Substrate cooling
US4833567A (en) 1986-05-30 1989-05-23 Digital Equipment Corporation Integral heat pipe module
US5199165A (en) 1991-12-13 1993-04-06 Hewlett-Packard Company Heat pipe-electrical interconnect integration method for chip modules
US5216580A (en) 1992-01-14 1993-06-01 Sun Microsystems, Inc. Optimized integral heat pipe and electronic circuit module arrangement
US5308920A (en) * 1992-07-31 1994-05-03 Itoh Research & Development Laboratory Co., Ltd. Heat radiating device
US6056044A (en) * 1996-01-29 2000-05-02 Sandia Corporation Heat pipe with improved wick structures
EP0833116A4 (en) * 1996-04-15 2001-09-12 Mitsubishi Electric Corp WATER EVAPORATION COOLER WITH ELECTROLYTIC REACTION
TW346566B (en) * 1996-08-29 1998-12-01 Showa Aluminiun Co Ltd Radiator for portable electronic apparatus

Also Published As

Publication number Publication date
KR20030087646A (ko) 2003-11-14
NO20034070D0 (no) 2003-09-15
EP1378154A2 (en) 2004-01-07
JP2004523919A (ja) 2004-08-05
EP1378154A4 (en) 2009-05-06
NO20034070L (no) 2003-11-19
WO2002076164A2 (en) 2002-09-26
WO2002076164A3 (en) 2002-11-14
CN1498522A (zh) 2004-05-19
CN1253063C (zh) 2006-04-19
CA2441124C (en) 2011-10-04
JP3899034B2 (ja) 2007-03-28
CA2441124A1 (en) 2002-09-26
EP1378154B1 (en) 2011-09-21
US6418019B1 (en) 2002-07-09
AU2002306686B2 (en) 2004-05-20

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