NO20034070L - Elektronisk modul som omfatter et kjöleunderlag med fluid- dissosierende elektroder, samt tilhörende fremgangsmåter - Google Patents

Elektronisk modul som omfatter et kjöleunderlag med fluid- dissosierende elektroder, samt tilhörende fremgangsmåter

Info

Publication number
NO20034070L
NO20034070L NO20034070A NO20034070A NO20034070L NO 20034070 L NO20034070 L NO 20034070L NO 20034070 A NO20034070 A NO 20034070A NO 20034070 A NO20034070 A NO 20034070A NO 20034070 L NO20034070 L NO 20034070L
Authority
NO
Norway
Prior art keywords
dissociating
electrodes
fluid
electronic module
associated methods
Prior art date
Application number
NO20034070A
Other languages
English (en)
Norwegian (no)
Other versions
NO20034070D0 (no
Inventor
Steven Robert Snyder
Charles Michael Newton
Michael Ray Lange
Original Assignee
Harris Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harris Corp filed Critical Harris Corp
Publication of NO20034070D0 publication Critical patent/NO20034070D0/no
Publication of NO20034070L publication Critical patent/NO20034070L/no

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
NO20034070A 2001-03-19 2003-09-15 Elektronisk modul som omfatter et kjöleunderlag med fluid- dissosierende elektroder, samt tilhörende fremgangsmåter NO20034070L (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/811,815 US6418019B1 (en) 2001-03-19 2001-03-19 Electronic module including a cooling substrate with fluid dissociation electrodes and related methods
PCT/US2002/007312 WO2002076164A2 (en) 2001-03-19 2002-03-12 Electronic module with fluid dissociation electrodes and methods

Publications (2)

Publication Number Publication Date
NO20034070D0 NO20034070D0 (no) 2003-09-15
NO20034070L true NO20034070L (no) 2003-11-19

Family

ID=25207668

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20034070A NO20034070L (no) 2001-03-19 2003-09-15 Elektronisk modul som omfatter et kjöleunderlag med fluid- dissosierende elektroder, samt tilhörende fremgangsmåter

Country Status (9)

Country Link
US (1) US6418019B1 (https=)
EP (1) EP1378154B1 (https=)
JP (1) JP3899034B2 (https=)
KR (1) KR100553172B1 (https=)
CN (1) CN1253063C (https=)
AU (1) AU2002306686B2 (https=)
CA (1) CA2441124C (https=)
NO (1) NO20034070L (https=)
WO (1) WO2002076164A2 (https=)

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JP2003110076A (ja) * 2001-10-01 2003-04-11 Fujitsu Ltd 熱拡散器および放熱器
US20040011509A1 (en) * 2002-05-15 2004-01-22 Wing Ming Siu Vapor augmented heatsink with multi-wick structure
US6639798B1 (en) * 2002-06-24 2003-10-28 Delphi Technologies, Inc. Automotive electronics heat exchanger
JP2004037039A (ja) 2002-07-05 2004-02-05 Sony Corp 冷却装置、電子機器装置、表示装置及び冷却装置の製造方法
US7108056B1 (en) * 2002-10-18 2006-09-19 Atec Advanced Thermal And Environmental Concepts Slit-type restrictor for controlling flow delivery to electrohydrodynamic thin film evaporator
JP3896961B2 (ja) * 2002-12-12 2007-03-22 ソニー株式会社 熱輸送装置および熱輸送装置の製造方法
US20060196640A1 (en) * 2004-12-01 2006-09-07 Convergence Technologies Limited Vapor chamber with boiling-enhanced multi-wick structure
DE102006011333A1 (de) * 2006-03-09 2007-09-13 Behr Industry Gmbh & Co. Kg Vorrichtung zur Kühlung, insbesondere elektronischer Bauelemente
TW200848683A (en) * 2007-03-08 2008-12-16 Convergence Technologies Ltd Heat transfer device
KR100891520B1 (ko) * 2007-05-15 2009-04-06 주식회사 하이닉스반도체 열 순환 매체를 구비한 인쇄회로기판 및 그의 제조방법
CN102423653A (zh) * 2007-09-14 2012-04-25 株式会社爱德万测试 高级热控接口
US8195118B2 (en) 2008-07-15 2012-06-05 Linear Signal, Inc. Apparatus, system, and method for integrated phase shifting and amplitude control of phased array signals
KR200451800Y1 (ko) * 2008-09-25 2011-01-12 홍순열 전자석을 이용한 핫 런너 밸브 게이트 장치의 와류방지 장치
US8872719B2 (en) 2009-11-09 2014-10-28 Linear Signal, Inc. Apparatus, system, and method for integrated modular phased array tile configuration
JPWO2011145618A1 (ja) * 2010-05-19 2013-07-22 日本電気株式会社 沸騰冷却器
US9360514B2 (en) * 2012-04-05 2016-06-07 Board Of Regents, The University Of Texas System Thermal reliability testing systems with thermal cycling and multidimensional heat transfer
WO2017143587A1 (zh) 2016-02-26 2017-08-31 华为技术有限公司 光组件封装结构、光组件、光模块及相关装置和系统
CN113712333A (zh) 2016-04-18 2021-11-30 史赛克公司 包括带有透明面罩及该面罩上的控制按钮的头罩的个人防护系统
US10622282B2 (en) * 2017-07-28 2020-04-14 Qualcomm Incorporated Systems and methods for cooling an electronic device
EP3454370B1 (en) * 2017-09-11 2020-09-09 Nokia Technologies Oy Package, and method of manufacturing a package comprising an enclosure and an integrated circuit
US20190191589A1 (en) * 2017-12-15 2019-06-20 Google Llc Three-Dimensional Electronic Structure with Integrated Phase-Change Cooling
DE102020103028A1 (de) * 2019-03-06 2020-09-10 GM Global Technology Operations LLC Verbundanordnungen zur thermischen kühlung von elektronischen bauteilen

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SU883643A2 (ru) * 1979-03-19 1981-11-23 Институт Прикладной Физики Ан Мсср Теплова труба с электрогидродинамическим генератором
US4220195A (en) * 1979-05-24 1980-09-02 The United States Of America As Represented By The Secretary Of The Navy Ion drag pumped heat pipe
US4519447A (en) 1980-08-04 1985-05-28 Fine Particle Technology Corporation Substrate cooling
US4833567A (en) 1986-05-30 1989-05-23 Digital Equipment Corporation Integral heat pipe module
US5199165A (en) 1991-12-13 1993-04-06 Hewlett-Packard Company Heat pipe-electrical interconnect integration method for chip modules
US5216580A (en) 1992-01-14 1993-06-01 Sun Microsystems, Inc. Optimized integral heat pipe and electronic circuit module arrangement
US5308920A (en) * 1992-07-31 1994-05-03 Itoh Research & Development Laboratory Co., Ltd. Heat radiating device
US6056044A (en) * 1996-01-29 2000-05-02 Sandia Corporation Heat pipe with improved wick structures
EP0833116A4 (en) * 1996-04-15 2001-09-12 Mitsubishi Electric Corp WATER EVAPORATION COOLER WITH ELECTROLYTIC REACTION
TW346566B (en) * 1996-08-29 1998-12-01 Showa Aluminiun Co Ltd Radiator for portable electronic apparatus

Also Published As

Publication number Publication date
KR20030087646A (ko) 2003-11-14
NO20034070D0 (no) 2003-09-15
EP1378154A2 (en) 2004-01-07
JP2004523919A (ja) 2004-08-05
EP1378154A4 (en) 2009-05-06
WO2002076164A2 (en) 2002-09-26
WO2002076164A3 (en) 2002-11-14
CN1498522A (zh) 2004-05-19
CN1253063C (zh) 2006-04-19
CA2441124C (en) 2011-10-04
JP3899034B2 (ja) 2007-03-28
CA2441124A1 (en) 2002-09-26
KR100553172B1 (ko) 2006-02-21
EP1378154B1 (en) 2011-09-21
US6418019B1 (en) 2002-07-09
AU2002306686B2 (en) 2004-05-20

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