KR100553171B1 - 냉각기판을 포함하는 전자모듈 및 그 제조방법 - Google Patents

냉각기판을 포함하는 전자모듈 및 그 제조방법 Download PDF

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Publication number
KR100553171B1
KR100553171B1 KR1020037012147A KR20037012147A KR100553171B1 KR 100553171 B1 KR100553171 B1 KR 100553171B1 KR 1020037012147 A KR1020037012147 A KR 1020037012147A KR 20037012147 A KR20037012147 A KR 20037012147A KR 100553171 B1 KR100553171 B1 KR 100553171B1
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South Korea
Prior art keywords
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evaporator
condenser
chamber
electronic module
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KR1020037012147A
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Korean (ko)
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KR20030087643A (ko
Inventor
스티븐 신더
챨스 뉴톤
마이클 랭
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해리스 코포레이션
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/06—Control arrangements therefor

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
KR1020037012147A 2001-03-19 2002-03-12 냉각기판을 포함하는 전자모듈 및 그 제조방법 Expired - Lifetime KR100553171B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/811,827 2001-03-19
US09/811,827 US6483705B2 (en) 2001-03-19 2001-03-19 Electronic module including a cooling substrate and related methods
PCT/US2002/007417 WO2002076165A1 (en) 2001-03-19 2002-03-12 Electronic module including a cooling substrate and related methods

Publications (2)

Publication Number Publication Date
KR20030087643A KR20030087643A (ko) 2003-11-14
KR100553171B1 true KR100553171B1 (ko) 2006-02-22

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Application Number Title Priority Date Filing Date
KR1020037012147A Expired - Lifetime KR100553171B1 (ko) 2001-03-19 2002-03-12 냉각기판을 포함하는 전자모듈 및 그 제조방법

Country Status (9)

Country Link
US (1) US6483705B2 (https=)
EP (1) EP1378153B1 (https=)
JP (1) JP4004963B2 (https=)
KR (1) KR100553171B1 (https=)
CN (1) CN1333627C (https=)
AU (1) AU2002254176B2 (https=)
CA (1) CA2440522C (https=)
NO (1) NO20034071L (https=)
WO (1) WO2002076165A1 (https=)

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Also Published As

Publication number Publication date
WO2002076165A1 (en) 2002-09-26
CA2440522C (en) 2010-05-11
CN1333627C (zh) 2007-08-22
NO20034071D0 (no) 2003-09-15
AU2002254176B2 (en) 2004-05-20
NO20034071L (no) 2003-11-18
US20020131237A1 (en) 2002-09-19
CA2440522A1 (en) 2002-09-26
US6483705B2 (en) 2002-11-19
EP1378153A1 (en) 2004-01-07
JP4004963B2 (ja) 2007-11-07
JP2004523920A (ja) 2004-08-05
CN1507767A (zh) 2004-06-23
EP1378153A4 (en) 2009-05-06
EP1378153B1 (en) 2011-08-10
KR20030087643A (ko) 2003-11-14

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