JP2004523653A5 - - Google Patents
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- Publication number
- JP2004523653A5 JP2004523653A5 JP2002564069A JP2002564069A JP2004523653A5 JP 2004523653 A5 JP2004523653 A5 JP 2004523653A5 JP 2002564069 A JP2002564069 A JP 2002564069A JP 2002564069 A JP2002564069 A JP 2002564069A JP 2004523653 A5 JP2004523653 A5 JP 2004523653A5
- Authority
- JP
- Japan
- Prior art keywords
- refractory metal
- consumed
- sputtering target
- powder
- tantalum sputtering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005477 sputtering target Methods 0.000 claims 13
- 229910052715 tantalum Inorganic materials 0.000 claims 13
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims 13
- 239000000843 powder Substances 0.000 claims 12
- 239000003870 refractory metal Substances 0.000 claims 12
- 238000004544 sputter deposition Methods 0.000 claims 8
- 238000000034 method Methods 0.000 claims 6
- 239000002245 particle Substances 0.000 claims 5
- 239000002923 metal particle Substances 0.000 claims 3
- 239000011248 coating agent Substances 0.000 claims 2
- 238000000576 coating method Methods 0.000 claims 2
- 239000011261 inert gas Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 230000001172 regenerating effect Effects 0.000 claims 1
- 238000011069 regeneration method Methods 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US26874201P | 2001-02-14 | 2001-02-14 | |
| PCT/US2002/004306 WO2002064287A2 (en) | 2001-02-14 | 2002-02-14 | Rejuvenation of refractory metal products |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004523653A JP2004523653A (ja) | 2004-08-05 |
| JP2004523653A5 true JP2004523653A5 (https=) | 2005-12-22 |
Family
ID=23024267
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002564069A Pending JP2004523653A (ja) | 2001-02-14 | 2002-02-14 | 耐火性金属の再生 |
Country Status (24)
| Country | Link |
|---|---|
| US (1) | US20020112955A1 (https=) |
| EP (1) | EP1362132B1 (https=) |
| JP (1) | JP2004523653A (https=) |
| CN (1) | CN1221684C (https=) |
| AT (1) | ATE325906T1 (https=) |
| AU (1) | AU2002250075B2 (https=) |
| BG (1) | BG64959B1 (https=) |
| BR (1) | BR0207202A (https=) |
| CA (1) | CA2437713A1 (https=) |
| CZ (1) | CZ20032186A3 (https=) |
| DE (1) | DE60211309T2 (https=) |
| DK (1) | DK1362132T3 (https=) |
| ES (1) | ES2261656T3 (https=) |
| HU (1) | HUP0400730A2 (https=) |
| IS (1) | IS6911A (https=) |
| MX (1) | MXPA03007293A (https=) |
| NO (1) | NO20033567L (https=) |
| NZ (1) | NZ527503A (https=) |
| PL (1) | PL363521A1 (https=) |
| PT (1) | PT1362132E (https=) |
| RU (1) | RU2304633C2 (https=) |
| SK (1) | SK10062003A3 (https=) |
| WO (1) | WO2002064287A2 (https=) |
| ZA (1) | ZA200306259B (https=) |
Families Citing this family (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003025244A2 (en) * | 2001-09-17 | 2003-03-27 | Heraeus, Inc. | Refurbishing spent sputtering targets |
| RU2333086C2 (ru) * | 2002-01-24 | 2008-09-10 | Х.Ц. Щтарк, Инк. | Очищенный лазерной обработкой и плавлением тугоплавкий металл и его сплав |
| US20040016635A1 (en) * | 2002-07-19 | 2004-01-29 | Ford Robert B. | Monolithic sputtering target assembly |
| US20040065546A1 (en) * | 2002-10-04 | 2004-04-08 | Michaluk Christopher A. | Method to recover spent components of a sputter target |
| US7504008B2 (en) * | 2004-03-12 | 2009-03-17 | Applied Materials, Inc. | Refurbishment of sputtering targets |
| US20060021870A1 (en) * | 2004-07-27 | 2006-02-02 | Applied Materials, Inc. | Profile detection and refurbishment of deposition targets |
| US20060081459A1 (en) * | 2004-10-18 | 2006-04-20 | Applied Materials, Inc. | In-situ monitoring of target erosion |
| JP5065248B2 (ja) | 2005-05-05 | 2012-10-31 | ハー．ツェー．スタルク ゲゼルシャフト ミット ベシュレンクテル ハフツング | 基材表面の被覆法及び被覆製品 |
| AU2006243448B2 (en) * | 2005-05-05 | 2011-09-01 | H.C. Starck Inc. | Coating process for manufacture or reprocessing of sputter targets and X-ray anodes |
| US9127362B2 (en) | 2005-10-31 | 2015-09-08 | Applied Materials, Inc. | Process kit and target for substrate processing chamber |
| JPWO2007052743A1 (ja) * | 2005-11-07 | 2009-04-30 | 株式会社東芝 | スパッタリングターゲットおよびその製造方法 |
| DE102005055255A1 (de) * | 2005-11-19 | 2007-05-31 | Applied Materials Gmbh & Co. Kg | Verfahren zum Herstellen eines Targets |
| US8647484B2 (en) | 2005-11-25 | 2014-02-11 | Applied Materials, Inc. | Target for sputtering chamber |
| US20080078268A1 (en) * | 2006-10-03 | 2008-04-03 | H.C. Starck Inc. | Process for preparing metal powders having low oxygen content, powders so-produced and uses thereof |
| US20080145688A1 (en) | 2006-12-13 | 2008-06-19 | H.C. Starck Inc. | Method of joining tantalum clade steel structures |
| US8197894B2 (en) | 2007-05-04 | 2012-06-12 | H.C. Starck Gmbh | Methods of forming sputtering targets |
| US8968536B2 (en) | 2007-06-18 | 2015-03-03 | Applied Materials, Inc. | Sputtering target having increased life and sputtering uniformity |
| WO2009019645A2 (en) * | 2007-08-08 | 2009-02-12 | Philips Intellectual Property & Standards Gmbh | Method and apparatus for applying material to a surface of an anode of an x-ray source, anode and x-ray source |
| US8699667B2 (en) | 2007-10-02 | 2014-04-15 | General Electric Company | Apparatus for x-ray generation and method of making same |
| US7901552B2 (en) | 2007-10-05 | 2011-03-08 | Applied Materials, Inc. | Sputtering target with grooves and intersecting channels |
| US8246903B2 (en) | 2008-09-09 | 2012-08-21 | H.C. Starck Inc. | Dynamic dehydriding of refractory metal powders |
| US8043655B2 (en) * | 2008-10-06 | 2011-10-25 | H.C. Starck, Inc. | Low-energy method of manufacturing bulk metallic structures with submicron grain sizes |
| FR2953747B1 (fr) * | 2009-12-14 | 2012-03-23 | Snecma | Procede de reparation d'une aube en titane par rechargement laser et compression hip moderee |
| DE102010004241A1 (de) * | 2010-01-08 | 2011-07-14 | H.C. Starck GmbH, 38642 | Verfahren zur Herstellung von Funktionsschichten auf der Oberfläche von Werkstücken, eine so hergestellte Funktionsschicht und ein Werkstück |
| US8703233B2 (en) | 2011-09-29 | 2014-04-22 | H.C. Starck Inc. | Methods of manufacturing large-area sputtering targets by cold spray |
| JP6532219B2 (ja) * | 2013-11-25 | 2019-06-19 | 株式会社フルヤ金属 | スパッタリングターゲットの再生方法及び再生スパッタリングターゲット |
| AT14301U1 (de) * | 2014-07-09 | 2015-07-15 | Plansee Se | Verfahren zur Herstellung eines Bauteils |
| CN104439239B (zh) * | 2014-11-06 | 2017-05-03 | 金堆城钼业股份有限公司 | 一种重复利用中频感应烧结炉钨钼废发热体的方法 |
| DE102015008921A1 (de) * | 2015-07-15 | 2017-01-19 | Evobeam GmbH | Verfahren zur additiven Herstellung von Bauteilen |
| US10844475B2 (en) * | 2015-12-28 | 2020-11-24 | Jx Nippon Mining & Metals Corporation | Method for manufacturing sputtering target |
| CN105618753A (zh) * | 2016-03-03 | 2016-06-01 | 中研智能装备有限公司 | 一种轧辊等离子3d打印再制造设备及再制造方法 |
| DE102016121951A1 (de) * | 2016-11-15 | 2018-05-17 | Cl Schutzrechtsverwaltungs Gmbh | Vorrichtung zur additiven Herstellung dreidimensionaler Objekte |
| JP6650141B1 (ja) * | 2019-01-10 | 2020-02-19 | 株式会社ティー・オール | 使用済み成膜用ターゲットの充填式再生方法 |
| WO2020169847A1 (en) * | 2019-02-22 | 2020-08-27 | Oerlikon Surface Solutions Ag, Pfäffikon | Method for producing targets for physical vapor deposition (pvd) |
| CN110523987B (zh) * | 2019-09-27 | 2021-02-05 | 华中科技大学 | 一种用于致密材料制备的激光烧结同步压制增材制造系统 |
| CN111940745B (zh) * | 2019-12-30 | 2024-01-19 | 宁夏东方钽业股份有限公司 | 大松装冶金级钽粉的制造方法 |
| CN112522698B (zh) * | 2020-11-26 | 2023-04-25 | 江苏科技大学 | 一种超声振动辅助激光熔覆钨钽铌合金装置及方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SU1494559A1 (ru) * | 1986-05-28 | 1996-03-10 | Ярославское научно-производственное объединение ЭЛЕКТРОНПРИБОР" | Способ изготовления мишени для распыления в вакууме |
| US5643472A (en) * | 1988-07-08 | 1997-07-01 | Cauldron Limited Partnership | Selective removal of material by irradiation |
| US6248291B1 (en) * | 1995-05-18 | 2001-06-19 | Asahi Glass Company Ltd. | Process for producing sputtering targets |
| DE19626732B4 (de) * | 1996-07-03 | 2009-01-29 | W.C. Heraeus Gmbh | Vorrichtung und Verfahren zum Herstellen und Recyclen von Sputtertargets |
| US6348113B1 (en) * | 1998-11-25 | 2002-02-19 | Cabot Corporation | High purity tantalum, products containing the same, and methods of making the same |
| DE19925330A1 (de) * | 1999-06-02 | 2000-12-07 | Leybold Materials Gmbh | Verfahren zur Herstellung oder zum Recyceln von Sputtertargets |
-
2002
- 2002-02-14 CN CNB028048210A patent/CN1221684C/zh not_active Expired - Fee Related
- 2002-02-14 US US10/075,709 patent/US20020112955A1/en not_active Abandoned
- 2002-02-14 EP EP02718966A patent/EP1362132B1/en not_active Expired - Lifetime
- 2002-02-14 WO PCT/US2002/004306 patent/WO2002064287A2/en not_active Ceased
- 2002-02-14 NZ NZ527503A patent/NZ527503A/en unknown
- 2002-02-14 PL PL02363521A patent/PL363521A1/xx not_active Application Discontinuation
- 2002-02-14 JP JP2002564069A patent/JP2004523653A/ja active Pending
- 2002-02-14 AT AT02718966T patent/ATE325906T1/de not_active IP Right Cessation
- 2002-02-14 ES ES02718966T patent/ES2261656T3/es not_active Expired - Lifetime
- 2002-02-14 HU HU0400730A patent/HUP0400730A2/hu unknown
- 2002-02-14 RU RU2003127947/02A patent/RU2304633C2/ru not_active IP Right Cessation
- 2002-02-14 PT PT02718966T patent/PT1362132E/pt unknown
- 2002-02-14 MX MXPA03007293A patent/MXPA03007293A/es active IP Right Grant
- 2002-02-14 DK DK02718966T patent/DK1362132T3/da active
- 2002-02-14 SK SK1006-2003A patent/SK10062003A3/sk not_active Application Discontinuation
- 2002-02-14 CA CA002437713A patent/CA2437713A1/en not_active Abandoned
- 2002-02-14 BR BR0207202-5A patent/BR0207202A/pt not_active IP Right Cessation
- 2002-02-14 DE DE60211309T patent/DE60211309T2/de not_active Expired - Lifetime
- 2002-02-14 AU AU2002250075A patent/AU2002250075B2/en not_active Ceased
- 2002-02-14 CZ CZ20032186A patent/CZ20032186A3/cs unknown
-
2003
- 2003-08-04 BG BG108059A patent/BG64959B1/bg unknown
- 2003-08-12 NO NO20033567A patent/NO20033567L/no not_active Application Discontinuation
- 2003-08-13 IS IS6911A patent/IS6911A/is unknown
- 2003-08-13 ZA ZA200306259A patent/ZA200306259B/en unknown
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