CN1221684C - 高熔点金属制品的再生 - Google Patents

高熔点金属制品的再生 Download PDF

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Publication number
CN1221684C
CN1221684C CNB028048210A CN02804821A CN1221684C CN 1221684 C CN1221684 C CN 1221684C CN B028048210 A CNB028048210 A CN B028048210A CN 02804821 A CN02804821 A CN 02804821A CN 1221684 C CN1221684 C CN 1221684C
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CN
China
Prior art keywords
sputtering target
consumes
refractory metal
regeneration
tantalum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB028048210A
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English (en)
Chinese (zh)
Other versions
CN1491294A (zh
Inventor
P·艾蒙尼
P·库马尔
P·R·杰普森
H·乌伦胡特
H·V·戈尔德贝格
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Materion Newton Inc
Original Assignee
HC Starck Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HC Starck Inc filed Critical HC Starck Inc
Publication of CN1491294A publication Critical patent/CN1491294A/zh
Application granted granted Critical
Publication of CN1221684C publication Critical patent/CN1221684C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3488Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3491Manufacturing of targets
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/062Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/3407Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/062Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts
    • B22F2007/068Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts repairing articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2999/00Aspects linked to processes or compositions used in powder metallurgy
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00Technologies related to metal processing
    • Y02P10/25Process efficiency

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Composite Materials (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Alloys Or Alloy Compounds (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Furnace Housings, Linings, Walls, And Ceilings (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Inorganic Insulating Materials (AREA)
  • Inorganic Compounds Of Heavy Metals (AREA)
  • Catalysts (AREA)
  • Arc-Extinguishing Devices That Are Switches (AREA)
  • Solid-Sorbent Or Filter-Aiding Compositions (AREA)
CNB028048210A 2001-02-14 2002-02-14 高熔点金属制品的再生 Expired - Fee Related CN1221684C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US26874201P 2001-02-14 2001-02-14
US60/268,742 2001-02-14

Publications (2)

Publication Number Publication Date
CN1491294A CN1491294A (zh) 2004-04-21
CN1221684C true CN1221684C (zh) 2005-10-05

Family

ID=23024267

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB028048210A Expired - Fee Related CN1221684C (zh) 2001-02-14 2002-02-14 高熔点金属制品的再生

Country Status (24)

Country Link
US (1) US20020112955A1 (https=)
EP (1) EP1362132B1 (https=)
JP (1) JP2004523653A (https=)
CN (1) CN1221684C (https=)
AT (1) ATE325906T1 (https=)
AU (1) AU2002250075B2 (https=)
BG (1) BG64959B1 (https=)
BR (1) BR0207202A (https=)
CA (1) CA2437713A1 (https=)
CZ (1) CZ20032186A3 (https=)
DE (1) DE60211309T2 (https=)
DK (1) DK1362132T3 (https=)
ES (1) ES2261656T3 (https=)
HU (1) HUP0400730A2 (https=)
IS (1) IS6911A (https=)
MX (1) MXPA03007293A (https=)
NO (1) NO20033567L (https=)
NZ (1) NZ527503A (https=)
PL (1) PL363521A1 (https=)
PT (1) PT1362132E (https=)
RU (1) RU2304633C2 (https=)
SK (1) SK10062003A3 (https=)
WO (1) WO2002064287A2 (https=)
ZA (1) ZA200306259B (https=)

Families Citing this family (37)

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WO2003025244A2 (en) * 2001-09-17 2003-03-27 Heraeus, Inc. Refurbishing spent sputtering targets
RU2333086C2 (ru) * 2002-01-24 2008-09-10 Х.Ц. Щтарк, Инк. Очищенный лазерной обработкой и плавлением тугоплавкий металл и его сплав
US20040016635A1 (en) * 2002-07-19 2004-01-29 Ford Robert B. Monolithic sputtering target assembly
US20040065546A1 (en) * 2002-10-04 2004-04-08 Michaluk Christopher A. Method to recover spent components of a sputter target
US7504008B2 (en) * 2004-03-12 2009-03-17 Applied Materials, Inc. Refurbishment of sputtering targets
US20060021870A1 (en) * 2004-07-27 2006-02-02 Applied Materials, Inc. Profile detection and refurbishment of deposition targets
US20060081459A1 (en) * 2004-10-18 2006-04-20 Applied Materials, Inc. In-situ monitoring of target erosion
JP5065248B2 (ja) 2005-05-05 2012-10-31 ハー.ツェー.スタルク ゲゼルシャフト ミット ベシュレンクテル ハフツング 基材表面の被覆法及び被覆製品
AU2006243448B2 (en) * 2005-05-05 2011-09-01 H.C. Starck Inc. Coating process for manufacture or reprocessing of sputter targets and X-ray anodes
US9127362B2 (en) 2005-10-31 2015-09-08 Applied Materials, Inc. Process kit and target for substrate processing chamber
JPWO2007052743A1 (ja) * 2005-11-07 2009-04-30 株式会社東芝 スパッタリングターゲットおよびその製造方法
DE102005055255A1 (de) * 2005-11-19 2007-05-31 Applied Materials Gmbh & Co. Kg Verfahren zum Herstellen eines Targets
US8647484B2 (en) 2005-11-25 2014-02-11 Applied Materials, Inc. Target for sputtering chamber
US20080078268A1 (en) * 2006-10-03 2008-04-03 H.C. Starck Inc. Process for preparing metal powders having low oxygen content, powders so-produced and uses thereof
US20080145688A1 (en) 2006-12-13 2008-06-19 H.C. Starck Inc. Method of joining tantalum clade steel structures
US8197894B2 (en) 2007-05-04 2012-06-12 H.C. Starck Gmbh Methods of forming sputtering targets
US8968536B2 (en) 2007-06-18 2015-03-03 Applied Materials, Inc. Sputtering target having increased life and sputtering uniformity
WO2009019645A2 (en) * 2007-08-08 2009-02-12 Philips Intellectual Property & Standards Gmbh Method and apparatus for applying material to a surface of an anode of an x-ray source, anode and x-ray source
US8699667B2 (en) 2007-10-02 2014-04-15 General Electric Company Apparatus for x-ray generation and method of making same
US7901552B2 (en) 2007-10-05 2011-03-08 Applied Materials, Inc. Sputtering target with grooves and intersecting channels
US8246903B2 (en) 2008-09-09 2012-08-21 H.C. Starck Inc. Dynamic dehydriding of refractory metal powders
US8043655B2 (en) * 2008-10-06 2011-10-25 H.C. Starck, Inc. Low-energy method of manufacturing bulk metallic structures with submicron grain sizes
FR2953747B1 (fr) * 2009-12-14 2012-03-23 Snecma Procede de reparation d'une aube en titane par rechargement laser et compression hip moderee
DE102010004241A1 (de) * 2010-01-08 2011-07-14 H.C. Starck GmbH, 38642 Verfahren zur Herstellung von Funktionsschichten auf der Oberfläche von Werkstücken, eine so hergestellte Funktionsschicht und ein Werkstück
US8703233B2 (en) 2011-09-29 2014-04-22 H.C. Starck Inc. Methods of manufacturing large-area sputtering targets by cold spray
JP6532219B2 (ja) * 2013-11-25 2019-06-19 株式会社フルヤ金属 スパッタリングターゲットの再生方法及び再生スパッタリングターゲット
AT14301U1 (de) * 2014-07-09 2015-07-15 Plansee Se Verfahren zur Herstellung eines Bauteils
CN104439239B (zh) * 2014-11-06 2017-05-03 金堆城钼业股份有限公司 一种重复利用中频感应烧结炉钨钼废发热体的方法
DE102015008921A1 (de) * 2015-07-15 2017-01-19 Evobeam GmbH Verfahren zur additiven Herstellung von Bauteilen
US10844475B2 (en) * 2015-12-28 2020-11-24 Jx Nippon Mining & Metals Corporation Method for manufacturing sputtering target
CN105618753A (zh) * 2016-03-03 2016-06-01 中研智能装备有限公司 一种轧辊等离子3d打印再制造设备及再制造方法
DE102016121951A1 (de) * 2016-11-15 2018-05-17 Cl Schutzrechtsverwaltungs Gmbh Vorrichtung zur additiven Herstellung dreidimensionaler Objekte
JP6650141B1 (ja) * 2019-01-10 2020-02-19 株式会社ティー・オール 使用済み成膜用ターゲットの充填式再生方法
WO2020169847A1 (en) * 2019-02-22 2020-08-27 Oerlikon Surface Solutions Ag, Pfäffikon Method for producing targets for physical vapor deposition (pvd)
CN110523987B (zh) * 2019-09-27 2021-02-05 华中科技大学 一种用于致密材料制备的激光烧结同步压制增材制造系统
CN111940745B (zh) * 2019-12-30 2024-01-19 宁夏东方钽业股份有限公司 大松装冶金级钽粉的制造方法
CN112522698B (zh) * 2020-11-26 2023-04-25 江苏科技大学 一种超声振动辅助激光熔覆钨钽铌合金装置及方法

Family Cites Families (6)

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SU1494559A1 (ru) * 1986-05-28 1996-03-10 Ярославское научно-производственное объединение ЭЛЕКТРОНПРИБОР" Способ изготовления мишени для распыления в вакууме
US5643472A (en) * 1988-07-08 1997-07-01 Cauldron Limited Partnership Selective removal of material by irradiation
US6248291B1 (en) * 1995-05-18 2001-06-19 Asahi Glass Company Ltd. Process for producing sputtering targets
DE19626732B4 (de) * 1996-07-03 2009-01-29 W.C. Heraeus Gmbh Vorrichtung und Verfahren zum Herstellen und Recyclen von Sputtertargets
US6348113B1 (en) * 1998-11-25 2002-02-19 Cabot Corporation High purity tantalum, products containing the same, and methods of making the same
DE19925330A1 (de) * 1999-06-02 2000-12-07 Leybold Materials Gmbh Verfahren zur Herstellung oder zum Recyceln von Sputtertargets

Also Published As

Publication number Publication date
BG108059A (en) 2005-04-30
IS6911A (is) 2003-08-13
DE60211309T2 (de) 2007-05-24
CA2437713A1 (en) 2002-08-22
BR0207202A (pt) 2004-01-27
ZA200306259B (en) 2004-08-13
CZ20032186A3 (cs) 2004-02-18
WO2002064287A3 (en) 2002-10-10
PL363521A1 (en) 2004-11-29
NO20033567D0 (no) 2003-08-12
AU2002250075B2 (en) 2007-03-29
PT1362132E (pt) 2006-09-29
EP1362132A4 (en) 2004-07-28
US20020112955A1 (en) 2002-08-22
MXPA03007293A (es) 2005-09-08
SK10062003A3 (sk) 2004-03-02
DK1362132T3 (da) 2006-09-11
CN1491294A (zh) 2004-04-21
ATE325906T1 (de) 2006-06-15
WO2002064287A2 (en) 2002-08-22
NZ527503A (en) 2004-07-30
RU2003127947A (ru) 2005-04-10
BG64959B1 (bg) 2006-10-31
EP1362132B1 (en) 2006-05-10
HUP0400730A2 (en) 2004-08-30
HK1062902A1 (en) 2004-12-03
RU2304633C2 (ru) 2007-08-20
NO20033567L (no) 2003-08-12
ES2261656T3 (es) 2006-11-16
JP2004523653A (ja) 2004-08-05
EP1362132A2 (en) 2003-11-19
DE60211309D1 (de) 2006-06-14

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