JP2004503769A - ディスク形状物体の位置決め装置 - Google Patents
ディスク形状物体の位置決め装置 Download PDFInfo
- Publication number
- JP2004503769A JP2004503769A JP2002510916A JP2002510916A JP2004503769A JP 2004503769 A JP2004503769 A JP 2004503769A JP 2002510916 A JP2002510916 A JP 2002510916A JP 2002510916 A JP2002510916 A JP 2002510916A JP 2004503769 A JP2004503769 A JP 2004503769A
- Authority
- JP
- Japan
- Prior art keywords
- holder
- frame
- shaped
- fork
- axis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
- Details Of Measuring And Other Instruments (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10028569A DE10028569A1 (de) | 2000-06-09 | 2000-06-09 | Vorrichtung zum Positionieren scheibenförmiger Objekte |
| PCT/US2001/015193 WO2001096836A1 (en) | 2000-06-09 | 2001-05-10 | Device for positioning disk-shaped objects |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004503769A true JP2004503769A (ja) | 2004-02-05 |
| JP2004503769A5 JP2004503769A5 (https=) | 2005-02-24 |
Family
ID=7645228
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002510916A Pending JP2004503769A (ja) | 2000-06-09 | 2001-05-10 | ディスク形状物体の位置決め装置 |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP1311826A1 (https=) |
| JP (1) | JP2004503769A (https=) |
| AU (1) | AU2001263048A1 (https=) |
| DE (1) | DE10028569A1 (https=) |
| WO (1) | WO2001096836A1 (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013228214A (ja) * | 2012-04-24 | 2013-11-07 | Atel Corp | マクロ観察装置 |
| KR101654844B1 (ko) * | 2016-02-12 | 2016-09-06 | (주)삼영엠아이텍 | 링형 검사대상물의 x-ray 검사용 지그장치 |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10160521B4 (de) * | 2001-12-05 | 2004-09-30 | HSEB Heinze & Süllau Entwicklungsbüro Dresden GmbH | Positioniereinrichtungen für Halbleiterobjekte |
| DE102004017114B4 (de) * | 2004-04-07 | 2012-03-15 | Integrated Dynamics Engineering Gmbh | Vorrichtung zur Handhabung eines scheibenartigen Elements, insbesondere zur Handhabung eines Wafers |
| GB0423399D0 (en) * | 2004-10-22 | 2004-11-24 | Hamilton & Royce Ltd | Display device |
| DE102005035199A1 (de) * | 2005-07-27 | 2007-02-08 | Mattson Thermal Products Gmbh | Verfahren zum Ermitteln der Ist-Lage einer Drehachse eines Transportmechanismus |
| KR102003729B1 (ko) * | 2017-11-15 | 2019-07-29 | 주식회사 고영테크놀러지 | 검사 장치 |
| CN114054397B (zh) * | 2021-11-26 | 2023-07-07 | 山东融跃肉制品有限公司 | 一种猪头清洗传送装置 |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63299354A (ja) * | 1987-05-29 | 1988-12-06 | Tokyo Electron Ltd | ウエハプローバ |
| JPH0325949A (ja) * | 1989-06-15 | 1991-02-04 | Wacker Chemitronic Ges Elektron Grundstoffe Mbh | 薄板状の物体を受容するための保持装置および半導体ウェーハを処理する方法 |
| JPH03101247A (ja) * | 1988-11-30 | 1991-04-26 | Tokyo Electron Ltd | 処理装置 |
| JPH04372150A (ja) * | 1991-06-20 | 1992-12-25 | Toshiba Corp | ウェーハシールリング着脱装置 |
| US5372612A (en) * | 1993-06-28 | 1994-12-13 | Motorola, Inc. | Semiconductor material contacting member |
| JPH07288276A (ja) * | 1994-02-22 | 1995-10-31 | Nikon Corp | 基板の位置決め装置 |
| JPH10247680A (ja) * | 1997-03-04 | 1998-09-14 | Tokyo Electron Ltd | 高温炉への搬送用フォークおよび熱処理装置 |
| JPH10249782A (ja) * | 1997-02-14 | 1998-09-22 | Applied Materials Inc | 機械的にクランプするロボットリスト |
| JPH1197515A (ja) * | 1997-09-22 | 1999-04-09 | Toshiba Corp | ウエハ支持用回転テーブル |
| JP2000028538A (ja) * | 1998-07-10 | 2000-01-28 | Nidek Co Ltd | ウェーハ検査装置 |
| JP2000049098A (ja) * | 1998-07-27 | 2000-02-18 | Super Silicon Kenkyusho:Kk | エピタキシャル成長炉 |
| WO2000026943A1 (en) * | 1998-10-30 | 2000-05-11 | Tokyo Electron Limited | Vacuum processing apparatus with low particle generating wafer holder |
| WO2000033359A2 (en) * | 1998-12-02 | 2000-06-08 | Kensington Laboratories, Inc. | Specimen holding robotic arm end effector |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5096291A (en) * | 1990-05-16 | 1992-03-17 | Irvine Optical Corporation | Inspection systems having rotating motion |
| US5880828A (en) * | 1996-07-26 | 1999-03-09 | Hitachi Electronics Engineering Co., Ltd. | Surface defect inspection device and shading correction method therefor |
| JPH11142126A (ja) * | 1997-04-15 | 1999-05-28 | Matsushita Seiki Kk | フォトマスク等の表面検査装置 |
| US6204917B1 (en) * | 1998-09-22 | 2001-03-20 | Kla-Tencor Corporation | Backside contamination inspection device |
-
2000
- 2000-06-09 DE DE10028569A patent/DE10028569A1/de not_active Withdrawn
-
2001
- 2001-05-10 EP EP01937297A patent/EP1311826A1/en not_active Withdrawn
- 2001-05-10 AU AU2001263048A patent/AU2001263048A1/en not_active Abandoned
- 2001-05-10 JP JP2002510916A patent/JP2004503769A/ja active Pending
- 2001-05-10 WO PCT/US2001/015193 patent/WO2001096836A1/en not_active Ceased
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63299354A (ja) * | 1987-05-29 | 1988-12-06 | Tokyo Electron Ltd | ウエハプローバ |
| JPH03101247A (ja) * | 1988-11-30 | 1991-04-26 | Tokyo Electron Ltd | 処理装置 |
| JPH0325949A (ja) * | 1989-06-15 | 1991-02-04 | Wacker Chemitronic Ges Elektron Grundstoffe Mbh | 薄板状の物体を受容するための保持装置および半導体ウェーハを処理する方法 |
| JPH04372150A (ja) * | 1991-06-20 | 1992-12-25 | Toshiba Corp | ウェーハシールリング着脱装置 |
| US5372612A (en) * | 1993-06-28 | 1994-12-13 | Motorola, Inc. | Semiconductor material contacting member |
| JPH07288276A (ja) * | 1994-02-22 | 1995-10-31 | Nikon Corp | 基板の位置決め装置 |
| JPH10249782A (ja) * | 1997-02-14 | 1998-09-22 | Applied Materials Inc | 機械的にクランプするロボットリスト |
| JPH10247680A (ja) * | 1997-03-04 | 1998-09-14 | Tokyo Electron Ltd | 高温炉への搬送用フォークおよび熱処理装置 |
| JPH1197515A (ja) * | 1997-09-22 | 1999-04-09 | Toshiba Corp | ウエハ支持用回転テーブル |
| JP2000028538A (ja) * | 1998-07-10 | 2000-01-28 | Nidek Co Ltd | ウェーハ検査装置 |
| JP2000049098A (ja) * | 1998-07-27 | 2000-02-18 | Super Silicon Kenkyusho:Kk | エピタキシャル成長炉 |
| WO2000026943A1 (en) * | 1998-10-30 | 2000-05-11 | Tokyo Electron Limited | Vacuum processing apparatus with low particle generating wafer holder |
| WO2000033359A2 (en) * | 1998-12-02 | 2000-06-08 | Kensington Laboratories, Inc. | Specimen holding robotic arm end effector |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013228214A (ja) * | 2012-04-24 | 2013-11-07 | Atel Corp | マクロ観察装置 |
| KR101654844B1 (ko) * | 2016-02-12 | 2016-09-06 | (주)삼영엠아이텍 | 링형 검사대상물의 x-ray 검사용 지그장치 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1311826A1 (en) | 2003-05-21 |
| WO2001096836A1 (en) | 2001-12-20 |
| AU2001263048A1 (en) | 2001-12-24 |
| DE10028569A1 (de) | 2001-12-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6986636B2 (en) | Device for positioning disk-shaped objects | |
| US6214692B1 (en) | Method and apparatus for the aligned joining of disk-shaped semiconductor substrates | |
| JPH081922B2 (ja) | ウェハ−保持装置 | |
| KR950034662A (ko) | 워크피 스위치 결정방법 및 그 장치 | |
| JP2002277502A (ja) | 基板検査装置及び基板検査方法 | |
| US20150017782A1 (en) | Bonding device and bonding method | |
| JPH07111987B2 (ja) | プロ−ブ装置 | |
| JP2004334220A (ja) | 統合された大型ガラス取り扱いシステム | |
| KR20030074374A (ko) | 박판재의 이동적재방법 및 장치 | |
| EP1544897B1 (en) | Surface inspection apparatus | |
| JPH0828205B2 (ja) | ウエハ搬送装置 | |
| JP2004503769A (ja) | ディスク形状物体の位置決め装置 | |
| JP5730664B2 (ja) | 電子部品実装機 | |
| TW202246155A (zh) | 對準裝置及對準方法 | |
| JPH09293772A (ja) | ウエハの位置合わせ装置 | |
| JP2004503769A5 (https=) | ||
| CN117405040A (zh) | 一种晶圆检测装置 | |
| JP2001351958A (ja) | 半導体製造装置 | |
| US6310685B1 (en) | Apparatus and method for holding a green sheet and system and method for inspecting a green sheet | |
| JP2003167355A (ja) | マスクのたわみ補正方法およびたわみ補正機構を備えた露光装置 | |
| JPH0541423A (ja) | プローブ装置 | |
| JP2000156391A (ja) | 半導体ウェーハ検査装置 | |
| JP2010032738A (ja) | マスク用基板検査装置 | |
| JP3249003U (ja) | ウエハー用自動光学検査装置 | |
| TWI920771B (zh) | 晶圓輸送量測系統 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20080502 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110531 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20110829 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20110905 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20111130 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20120904 |