JP2004502859A5 - - Google Patents

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Publication number
JP2004502859A5
JP2004502859A5 JP2002509429A JP2002509429A JP2004502859A5 JP 2004502859 A5 JP2004502859 A5 JP 2004502859A5 JP 2002509429 A JP2002509429 A JP 2002509429A JP 2002509429 A JP2002509429 A JP 2002509429A JP 2004502859 A5 JP2004502859 A5 JP 2004502859A5
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JP
Japan
Prior art keywords
carbon atoms
terminal group
epoxy resin
adhesive composition
oligomer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2002509429A
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English (en)
Japanese (ja)
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JP2004502859A (ja
Filing date
Publication date
Priority claimed from US09/611,450 external-priority patent/US6294259B1/en
Application filed filed Critical
Publication of JP2004502859A publication Critical patent/JP2004502859A/ja
Publication of JP2004502859A5 publication Critical patent/JP2004502859A5/ja
Withdrawn legal-status Critical Current

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JP2002509429A 2000-07-06 2000-11-10 ポリイミドハイブリッド接着剤 Withdrawn JP2004502859A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/611,450 US6294259B1 (en) 2000-07-06 2000-07-06 Polyimide hybrid adhesives
PCT/US2000/030829 WO2002004572A1 (en) 2000-07-06 2000-11-10 Polyimide hybrid adhesives

Publications (2)

Publication Number Publication Date
JP2004502859A JP2004502859A (ja) 2004-01-29
JP2004502859A5 true JP2004502859A5 (enExample) 2007-12-13

Family

ID=24449066

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002509429A Withdrawn JP2004502859A (ja) 2000-07-06 2000-11-10 ポリイミドハイブリッド接着剤

Country Status (9)

Country Link
US (1) US6294259B1 (enExample)
EP (1) EP1303571B1 (enExample)
JP (1) JP2004502859A (enExample)
KR (1) KR100676331B1 (enExample)
AT (1) ATE267858T1 (enExample)
AU (1) AU2001217593A1 (enExample)
DE (1) DE60011150T2 (enExample)
TW (1) TWI288773B (enExample)
WO (1) WO2002004572A1 (enExample)

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US20060116476A1 (en) * 2004-12-01 2006-06-01 3M Innovative Properties Company Hybrid thermosetting composition
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JP5014587B2 (ja) * 2005-04-28 2012-08-29 株式会社カネカ 活性エステル化合物およびその利用
TWI416671B (zh) * 2005-05-31 2013-11-21 住友電木股份有限公司 A pre-coated encapsulated resin composition, a semiconductor device using the same, and a method for manufacturing the same
SG177608A1 (en) * 2009-07-10 2012-02-28 Toray Industries Adhesive composition, adhesive sheet, circuit board and semiconductor device both produced using these, and processes for producing these
CN109415509A (zh) * 2017-01-27 2019-03-01 积水化学工业株式会社 固化性树脂组合物、粘接剂、酰亚胺低聚物、酰亚胺低聚物组合物以及固化剂
TWI823848B (zh) * 2017-01-27 2023-12-01 日商積水化學工業股份有限公司 硬化性樹脂組成物、硬化物、接著劑、接著膜、覆蓋膜、可撓性覆銅積層板、及電路基板
JP7207863B2 (ja) * 2017-05-31 2023-01-18 積水化学工業株式会社 硬化性樹脂組成物、硬化物、接着剤、及び、接着フィルム
WO2018221217A1 (ja) * 2017-05-31 2018-12-06 積水化学工業株式会社 硬化性樹脂組成物、硬化物、接着剤、接着フィルム、カバーレイフィルム、及び、プリント配線板
JP7144182B2 (ja) * 2017-05-31 2022-09-29 積水化学工業株式会社 硬化性樹脂組成物、硬化物、接着剤、及び、接着フィルム
JP7211715B2 (ja) * 2017-05-31 2023-01-24 積水化学工業株式会社 硬化性樹脂組成物、硬化物、接着剤、接着フィルム、カバーレイフィルム、及び、プリント配線板
CN110691805A (zh) * 2017-05-31 2020-01-14 积水化学工业株式会社 固化性树脂组合物、固化物、粘接剂、粘接膜、覆盖层膜和印制电路布线板
TWI770178B (zh) * 2017-05-31 2022-07-11 日商積水化學工業股份有限公司 硬化性樹脂組成物、硬化物、接著劑、接著膜、覆蓋膜及印刷配線板
CN111263782A (zh) * 2017-10-27 2020-06-09 积水化学工业株式会社 固化性树脂组合物、固化物、粘接剂和粘接膜
CN111417683B (zh) * 2018-03-20 2023-07-25 积水化学工业株式会社 固化性树脂组合物、粘接剂、粘接膜、覆盖膜及柔性覆铜层叠板
JP7018942B2 (ja) 2018-03-28 2022-02-14 積水化学工業株式会社 硬化性樹脂組成物、接着剤、接着フィルム、回路基板、層間絶縁材料、及び、プリント配線板
CN108865047A (zh) * 2018-06-12 2018-11-23 山东科思姆特种材料技术开发有限公司 耐高温抗辐射胶黏剂及其制备方法
TW202233794A (zh) * 2020-12-23 2022-09-01 日商積水化學工業股份有限公司 硬化性樹脂組成物、硬化物、接著劑、及接著膜
CN114276654B (zh) * 2021-11-24 2023-10-17 久耀电子科技（江苏）有限公司 一种树脂组合物、半固化片以及高cti覆铜板
CN115536816B (zh) * 2022-10-28 2024-02-20 中国科学院兰州化学物理研究所 一种热固性环氧树脂形状记忆聚合物及其制备方法

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