KR100676331B1 - 폴리이미드 혼성 접착제 - Google Patents

폴리이미드 혼성 접착제 Download PDF

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Publication number
KR100676331B1
KR100676331B1 KR1020037000107A KR20037000107A KR100676331B1 KR 100676331 B1 KR100676331 B1 KR 100676331B1 KR 1020037000107 A KR1020037000107 A KR 1020037000107A KR 20037000107 A KR20037000107 A KR 20037000107A KR 100676331 B1 KR100676331 B1 KR 100676331B1
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KR
South Korea
Prior art keywords
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epoxy
polyimide
oligomer
minutes
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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KR1020037000107A
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English (en)
Korean (ko)
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KR20040030387A (ko
Inventor
그레고리 제이. 앤더슨
스코트 비. 챨스
마이클 에이. 크로프
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 캄파니
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Publication of KR20040030387A publication Critical patent/KR20040030387A/ko
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
    • C08G73/1014—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents in the form of (mono)anhydrid
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
KR1020037000107A 2000-07-06 2000-11-10 폴리이미드 혼성 접착제 Expired - Fee Related KR100676331B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/611,450 2000-07-06
US09/611,450 US6294259B1 (en) 2000-07-06 2000-07-06 Polyimide hybrid adhesives
PCT/US2000/030829 WO2002004572A1 (en) 2000-07-06 2000-11-10 Polyimide hybrid adhesives

Publications (2)

Publication Number Publication Date
KR20040030387A KR20040030387A (ko) 2004-04-09
KR100676331B1 true KR100676331B1 (ko) 2007-02-05

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KR1020037000107A Expired - Fee Related KR100676331B1 (ko) 2000-07-06 2000-11-10 폴리이미드 혼성 접착제

Country Status (9)

Country Link
US (1) US6294259B1 (enExample)
EP (1) EP1303571B1 (enExample)
JP (1) JP2004502859A (enExample)
KR (1) KR100676331B1 (enExample)
AT (1) ATE267858T1 (enExample)
AU (1) AU2001217593A1 (enExample)
DE (1) DE60011150T2 (enExample)
TW (1) TWI288773B (enExample)
WO (1) WO2002004572A1 (enExample)

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WO2004109403A1 (ja) * 2003-06-02 2004-12-16 Toray Industries, Inc. 感光性樹脂組成物およびそれを用いた電子部品ならびに表示装置
WO2005100433A1 (ja) * 2004-04-19 2005-10-27 Kaneka Corporation 熱硬化性樹脂組成物、及びそれを用いてなる積層体、回路基板
US7816487B2 (en) * 2004-09-30 2010-10-19 Intel Corporation Die-attach films for chip-scale packaging, packages made therewith, and methods of assembling same
US20060116476A1 (en) * 2004-12-01 2006-06-01 3M Innovative Properties Company Hybrid thermosetting composition
US20060116492A1 (en) * 2004-12-01 2006-06-01 3M Innovative Properties Company Branched polymer
JP5014587B2 (ja) * 2005-04-28 2012-08-29 株式会社カネカ 活性エステル化合物およびその利用
TWI416671B (zh) * 2005-05-31 2013-11-21 住友電木股份有限公司 A pre-coated encapsulated resin composition, a semiconductor device using the same, and a method for manufacturing the same
SG177608A1 (en) * 2009-07-10 2012-02-28 Toray Industries Adhesive composition, adhesive sheet, circuit board and semiconductor device both produced using these, and processes for producing these
CN109415509A (zh) * 2017-01-27 2019-03-01 积水化学工业株式会社 固化性树脂组合物、粘接剂、酰亚胺低聚物、酰亚胺低聚物组合物以及固化剂
TWI823848B (zh) * 2017-01-27 2023-12-01 日商積水化學工業股份有限公司 硬化性樹脂組成物、硬化物、接著劑、接著膜、覆蓋膜、可撓性覆銅積層板、及電路基板
JP7207863B2 (ja) * 2017-05-31 2023-01-18 積水化学工業株式会社 硬化性樹脂組成物、硬化物、接着剤、及び、接着フィルム
WO2018221217A1 (ja) * 2017-05-31 2018-12-06 積水化学工業株式会社 硬化性樹脂組成物、硬化物、接着剤、接着フィルム、カバーレイフィルム、及び、プリント配線板
JP7144182B2 (ja) * 2017-05-31 2022-09-29 積水化学工業株式会社 硬化性樹脂組成物、硬化物、接着剤、及び、接着フィルム
JP7211715B2 (ja) * 2017-05-31 2023-01-24 積水化学工業株式会社 硬化性樹脂組成物、硬化物、接着剤、接着フィルム、カバーレイフィルム、及び、プリント配線板
CN110691805A (zh) * 2017-05-31 2020-01-14 积水化学工业株式会社 固化性树脂组合物、固化物、粘接剂、粘接膜、覆盖层膜和印制电路布线板
TWI770178B (zh) * 2017-05-31 2022-07-11 日商積水化學工業股份有限公司 硬化性樹脂組成物、硬化物、接著劑、接著膜、覆蓋膜及印刷配線板
CN111263782A (zh) * 2017-10-27 2020-06-09 积水化学工业株式会社 固化性树脂组合物、固化物、粘接剂和粘接膜
CN111417683B (zh) * 2018-03-20 2023-07-25 积水化学工业株式会社 固化性树脂组合物、粘接剂、粘接膜、覆盖膜及柔性覆铜层叠板
JP7018942B2 (ja) 2018-03-28 2022-02-14 積水化学工業株式会社 硬化性樹脂組成物、接着剤、接着フィルム、回路基板、層間絶縁材料、及び、プリント配線板
CN108865047A (zh) * 2018-06-12 2018-11-23 山东科思姆特种材料技术开发有限公司 耐高温抗辐射胶黏剂及其制备方法
TW202233794A (zh) * 2020-12-23 2022-09-01 日商積水化學工業股份有限公司 硬化性樹脂組成物、硬化物、接著劑、及接著膜
CN114276654B (zh) * 2021-11-24 2023-10-17 久耀电子科技（江苏）有限公司 一种树脂组合物、半固化片以及高cti覆铜板
CN115536816B (zh) * 2022-10-28 2024-02-20 中国科学院兰州化学物理研究所 一种热固性环氧树脂形状记忆聚合物及其制备方法

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Also Published As

Publication number Publication date
KR20040030387A (ko) 2004-04-09
EP1303571B1 (en) 2004-05-26
WO2002004572A1 (en) 2002-01-17
US6294259B1 (en) 2001-09-25
AU2001217593A1 (en) 2002-01-21
EP1303571A1 (en) 2003-04-23
TWI288773B (en) 2007-10-21
DE60011150D1 (de) 2004-07-01
DE60011150T2 (de) 2005-06-16
JP2004502859A (ja) 2004-01-29
ATE267858T1 (de) 2004-06-15

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