AU2001217593A1 - Polyimide hybrid adhesives - Google Patents

Polyimide hybrid adhesives

Info

Publication number
AU2001217593A1
AU2001217593A1 AU2001217593A AU1759301A AU2001217593A1 AU 2001217593 A1 AU2001217593 A1 AU 2001217593A1 AU 2001217593 A AU2001217593 A AU 2001217593A AU 1759301 A AU1759301 A AU 1759301A AU 2001217593 A1 AU2001217593 A1 AU 2001217593A1
Authority
AU
Australia
Prior art keywords
polyimide
polyimide hybrid
adhesives
hybrid adhesives
epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001217593A
Inventor
Gregory J. Anderson
Scott B. Charles
Michael A Kropp
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of AU2001217593A1 publication Critical patent/AU2001217593A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
    • C08G73/1014—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents in the form of (mono)anhydrid
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)

Abstract

This invention relates to a polyimide hybrid adhesive comprised of an epoxy component, an epoxy curing agent, and a polyimide oligomer of molecular weight of up to about 8,000 (Mn) having repeating units of Formula (1):The adhesives are particularly useful in applications where thermal stability and high adhesive strength are required.
AU2001217593A 2000-07-06 2000-11-10 Polyimide hybrid adhesives Abandoned AU2001217593A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09611450 2000-07-06
US09/611,450 US6294259B1 (en) 2000-07-06 2000-07-06 Polyimide hybrid adhesives
PCT/US2000/030829 WO2002004572A1 (en) 2000-07-06 2000-11-10 Polyimide hybrid adhesives

Publications (1)

Publication Number Publication Date
AU2001217593A1 true AU2001217593A1 (en) 2002-01-21

Family

ID=24449066

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001217593A Abandoned AU2001217593A1 (en) 2000-07-06 2000-11-10 Polyimide hybrid adhesives

Country Status (9)

Country Link
US (1) US6294259B1 (en)
EP (1) EP1303571B1 (en)
JP (1) JP2004502859A (en)
KR (1) KR100676331B1 (en)
AT (1) ATE267858T1 (en)
AU (1) AU2001217593A1 (en)
DE (1) DE60011150T2 (en)
TW (1) TWI288773B (en)
WO (1) WO2002004572A1 (en)

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CN100555078C (en) * 2003-06-02 2009-10-28 东丽株式会社 Photosensitive resin composition and with the electronic component and the display device of its preparation
JP5019874B2 (en) * 2004-04-19 2012-09-05 株式会社カネカ Thermosetting resin composition, laminated body using the same, and circuit board
US7816487B2 (en) * 2004-09-30 2010-10-19 Intel Corporation Die-attach films for chip-scale packaging, packages made therewith, and methods of assembling same
US20060116476A1 (en) * 2004-12-01 2006-06-01 3M Innovative Properties Company Hybrid thermosetting composition
US20060116492A1 (en) * 2004-12-01 2006-06-01 3M Innovative Properties Company Branched polymer
JP5014587B2 (en) * 2005-04-28 2012-08-29 株式会社カネカ Active ester compounds and use thereof
US8169090B2 (en) * 2005-05-31 2012-05-01 Sumitomo Bakelite Company, Ltd. Encapsulating resin composition for preapplication, semiconductor device made with the same, and process for producing the same
KR101635659B1 (en) * 2009-07-10 2016-07-01 도레이 카부시키가이샤 Adhesive composition, adhesive sheet, circuit board and semiconductor device both produced using these, and processes for producing these
TWI821171B (en) * 2017-01-27 2023-11-11 日商積水化學工業股份有限公司 Curable resin composition, adhesive, imine oligomer, imine oligomer composition, and hardener
TWI823848B (en) * 2017-01-27 2023-12-01 日商積水化學工業股份有限公司 Curable resin compositions, cured products, adhesives, adhesive films, cover films, flexible copper-clad laminates, and circuit boards
JP7207863B2 (en) * 2017-05-31 2023-01-18 積水化学工業株式会社 Curable resin composition, cured product, adhesive and adhesive film
TWI770178B (en) * 2017-05-31 2022-07-11 日商積水化學工業股份有限公司 Curable resin composition, cured product, adhesive, adhesive film, coverlay, and printed wiring board
JP7144182B2 (en) * 2017-05-31 2022-09-29 積水化学工業株式会社 Curable resin composition, cured product, adhesive and adhesive film
JP7211715B2 (en) * 2017-05-31 2023-01-24 積水化学工業株式会社 Curable resin composition, cured product, adhesive, adhesive film, coverlay film, and printed wiring board
CN110691805A (en) * 2017-05-31 2020-01-14 积水化学工业株式会社 Curable resin composition, cured product, adhesive film, cover lay film, and printed wiring board
WO2018221217A1 (en) * 2017-05-31 2018-12-06 積水化学工業株式会社 Curable resin composition, cured product, adhesive agent, adhesive film, coverlay film and printed wiring board
CN111263782A (en) * 2017-10-27 2020-06-09 积水化学工业株式会社 Curable resin composition, cured product, adhesive, and adhesive film
EP3778693A4 (en) 2018-03-28 2021-12-22 Sekisui Chemical Co., Ltd. Curable resin composition, adhesive agent, adhesive film, circuit substrate, interlayer insulating material, and printed wiring board
CN108865047A (en) * 2018-06-12 2018-11-23 山东科思姆特种材料技术开发有限公司 Anti-radiation adhesive of high temperature resistant and preparation method thereof
WO2022138407A1 (en) * 2020-12-23 2022-06-30 積水化学工業株式会社 Curable resin composition, cured product, adhesive agent, and adhesion film
CN114276654B (en) * 2021-11-24 2023-10-17 久耀电子科技（江苏）有限公司 Resin composition, prepreg and high CTI copper-clad plate
CN115536816B (en) * 2022-10-28 2024-02-20 中国科学院兰州化学物理研究所 Thermosetting epoxy resin shape memory polymer and preparation method thereof

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Also Published As

Publication number Publication date
EP1303571A1 (en) 2003-04-23
JP2004502859A (en) 2004-01-29
WO2002004572A1 (en) 2002-01-17
TWI288773B (en) 2007-10-21
KR100676331B1 (en) 2007-02-05
DE60011150D1 (en) 2004-07-01
US6294259B1 (en) 2001-09-25
ATE267858T1 (en) 2004-06-15
EP1303571B1 (en) 2004-05-26
DE60011150T2 (en) 2005-06-16
KR20040030387A (en) 2004-04-09

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