JPS61270852A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS61270852A
JPS61270852A JP60112870A JP11287085A JPS61270852A JP S61270852 A JPS61270852 A JP S61270852A JP 60112870 A JP60112870 A JP 60112870A JP 11287085 A JP11287085 A JP 11287085A JP S61270852 A JPS61270852 A JP S61270852A
Authority
JP
Japan
Prior art keywords
epoxy resin
resin
hardening accelerator
sealing
hardener
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP60112870A
Other languages
Japanese (ja)
Inventor
Yoshinobu Nakamura
Mitsuru Shimizu
Haruo Tabata
Shinjiro Uenishi
Original Assignee
Nitto Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Ind Co Ltd filed Critical Nitto Electric Ind Co Ltd
Priority to JP60112870A priority Critical patent/JPS61270852A/en
Publication of JPS61270852A publication Critical patent/JPS61270852A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293Organic, e.g. plastic
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PURPOSE:To seal the titled device with resin with high reliability by a method wherein a semiconductor sealing material composed of an epoxy resin, phenolic resin, a chain molecule with proper viscosity of 0.5 or less with both ends comprising polyimide oligomer of acid anhydride group as a hardening accelerator is utilized. CONSTITUTION:A specific epoxy resin sealing material is composed of conven tional sealing epoxy resin; phenol novolak resin as a hardener; 3rd-class amine (triethanol amine etc.) 4th-class ammonium salt (dodecyl trimethyl ammonium aiodide etc.) imidasols (dimethyl imidasol etc.) B compound (tetraphenyl boron) added thereto as a hardening accelerator; and polyimide oligomer (Formula X represents tetracharbonic acid radical) of acid anhydride group added to both ends of chain molecule with proper viscosity of 0.5 or less as a part of hardener with the consumption of hardening accelerator restricted to 0.05-0.7wt% of total constituent. Such a specific epoxy resin compound with excellent moisture resistance, thermal resistance and electric characteristics can be used to produce a highly reliable semiconductor device.
JP60112870A 1985-05-24 1985-05-24 Semiconductor device Pending JPS61270852A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60112870A JPS61270852A (en) 1985-05-24 1985-05-24 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60112870A JPS61270852A (en) 1985-05-24 1985-05-24 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS61270852A true JPS61270852A (en) 1986-12-01

Family

ID=14597584

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60112870A Pending JPS61270852A (en) 1985-05-24 1985-05-24 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS61270852A (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0234656A (en) * 1988-07-23 1990-02-05 Matsushita Electric Works Ltd Molding resin material for sealing
JPH037724A (en) * 1989-03-30 1991-01-14 Toray Ind Inc Epoxy resin composition
US6294259B1 (en) 2000-07-06 2001-09-25 3M Innovative Properties Company Polyimide hybrid adhesives
JP2013032522A (en) * 2011-07-29 2013-02-14 Namics Corp Liquid epoxy resin composition for semiconductor encapsulation, and semiconductor device using the same
JP2014218651A (en) * 2013-04-08 2014-11-20 Jnc株式会社 Heat-curable composition
CN109415509A (en) * 2017-01-27 2019-03-01 积水化学工业株式会社 Hardening resin composition, bonding agent, acid imide oligomer, acid imide oligomeric composition and curing agent
KR20190104130A (en) 2017-01-27 2019-09-06 세키스이가가쿠 고교가부시키가이샤 Curable resin composition, hardened | cured material, adhesive agent, an adhesive film, a coverlay film, a flexible copper clad laminated board, and a circuit board
WO2019188436A1 (en) 2018-03-28 2019-10-03 積水化学工業株式会社 Curable resin composition, adhesive agent, adhesive film, circuit substrate, interlayer insulating material, and printed wiring board
KR20200013649A (en) 2017-05-31 2020-02-07 세키스이가가쿠 고교가부시키가이샤 Curable resin composition, hardened | cured material, adhesive agent, an adhesive film, a coverlay film, and a printed wiring board
KR20200071060A (en) 2017-10-27 2020-06-18 세키스이가가쿠 고교가부시키가이샤 Curable resin composition, cured product, adhesive, and adhesive film

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0234656A (en) * 1988-07-23 1990-02-05 Matsushita Electric Works Ltd Molding resin material for sealing
JPH0520448B2 (en) * 1988-07-23 1993-03-19 Matsushita Electric Works Ltd
JPH037724A (en) * 1989-03-30 1991-01-14 Toray Ind Inc Epoxy resin composition
US6294259B1 (en) 2000-07-06 2001-09-25 3M Innovative Properties Company Polyimide hybrid adhesives
WO2002004572A1 (en) * 2000-07-06 2002-01-17 3M Innovative Properties Company Polyimide hybrid adhesives
JP2013032522A (en) * 2011-07-29 2013-02-14 Namics Corp Liquid epoxy resin composition for semiconductor encapsulation, and semiconductor device using the same
JP2014218651A (en) * 2013-04-08 2014-11-20 Jnc株式会社 Heat-curable composition
CN109415509A (en) * 2017-01-27 2019-03-01 积水化学工业株式会社 Hardening resin composition, bonding agent, acid imide oligomer, acid imide oligomeric composition and curing agent
KR20190103939A (en) 2017-01-27 2019-09-05 세키스이가가쿠 고교가부시키가이샤 Curable resin composition, adhesive agent, imide oligomer, imide oligomer composition, and hardening | curing agent
KR20190104130A (en) 2017-01-27 2019-09-06 세키스이가가쿠 고교가부시키가이샤 Curable resin composition, hardened | cured material, adhesive agent, an adhesive film, a coverlay film, a flexible copper clad laminated board, and a circuit board
KR20200013649A (en) 2017-05-31 2020-02-07 세키스이가가쿠 고교가부시키가이샤 Curable resin composition, hardened | cured material, adhesive agent, an adhesive film, a coverlay film, and a printed wiring board
KR20200071060A (en) 2017-10-27 2020-06-18 세키스이가가쿠 고교가부시키가이샤 Curable resin composition, cured product, adhesive, and adhesive film
WO2019188436A1 (en) 2018-03-28 2019-10-03 積水化学工業株式会社 Curable resin composition, adhesive agent, adhesive film, circuit substrate, interlayer insulating material, and printed wiring board
KR20200138165A (en) 2018-03-28 2020-12-09 세키스이가가쿠 고교가부시키가이샤 Curable resin composition, adhesive, adhesive film, circuit board, interlayer insulating material, and printed wiring board

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