JP2004193195A - 搬送装置 - Google Patents

搬送装置 Download PDF

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Publication number
JP2004193195A
JP2004193195A JP2002356495A JP2002356495A JP2004193195A JP 2004193195 A JP2004193195 A JP 2004193195A JP 2002356495 A JP2002356495 A JP 2002356495A JP 2002356495 A JP2002356495 A JP 2002356495A JP 2004193195 A JP2004193195 A JP 2004193195A
Authority
JP
Japan
Prior art keywords
plate
work
wafer
nozzles
shaped member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002356495A
Other languages
English (en)
Japanese (ja)
Inventor
Akihiro Miyamoto
明宏 宮本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2002356495A priority Critical patent/JP2004193195A/ja
Priority to TW092134561A priority patent/TW200505775A/zh
Priority to US10/728,893 priority patent/US7063499B2/en
Priority to EP03257706A priority patent/EP1429373B1/fr
Priority to DE60313279T priority patent/DE60313279T2/de
Publication of JP2004193195A publication Critical patent/JP2004193195A/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
  • Specific Conveyance Elements (AREA)
JP2002356495A 2002-12-09 2002-12-09 搬送装置 Pending JP2004193195A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2002356495A JP2004193195A (ja) 2002-12-09 2002-12-09 搬送装置
TW092134561A TW200505775A (en) 2002-12-09 2003-12-08 Conveyor system
US10/728,893 US7063499B2 (en) 2002-12-09 2003-12-08 Conveyor system
EP03257706A EP1429373B1 (fr) 2002-12-09 2003-12-08 Système de convoyage
DE60313279T DE60313279T2 (de) 2002-12-09 2003-12-08 Transportsystem

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002356495A JP2004193195A (ja) 2002-12-09 2002-12-09 搬送装置

Publications (1)

Publication Number Publication Date
JP2004193195A true JP2004193195A (ja) 2004-07-08

Family

ID=32322056

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002356495A Pending JP2004193195A (ja) 2002-12-09 2002-12-09 搬送装置

Country Status (5)

Country Link
US (1) US7063499B2 (fr)
EP (1) EP1429373B1 (fr)
JP (1) JP2004193195A (fr)
DE (1) DE60313279T2 (fr)
TW (1) TW200505775A (fr)

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006032687A (ja) * 2004-07-16 2006-02-02 Disco Abrasive Syst Ltd 被加工物搬送装置
JP2006080289A (ja) * 2004-09-09 2006-03-23 Mitsubishi Electric Corp 搬送装置
JP2009016529A (ja) * 2007-07-04 2009-01-22 Lintec Corp 貼付装置及び貼付方法
WO2010024888A2 (fr) * 2008-08-28 2010-03-04 Corning Incorporated Dispositifs et procédés de manipulation sans contact
JP2010247304A (ja) * 2009-04-20 2010-11-04 Chugai Ro Co Ltd ワークの吸着パッド装置
WO2010127038A2 (fr) * 2009-04-29 2010-11-04 Applied Materials, Inc. Effecteur pour manipulation de substrats
JP4582820B1 (ja) * 2010-06-08 2010-11-17 智雄 松下 基板入替装置
JP2010264551A (ja) * 2009-05-15 2010-11-25 Lintec Corp 板状部材の搬送装置及び搬送方法
JP2010264552A (ja) * 2009-05-15 2010-11-25 Lintec Corp 板状部材の搬送装置及び搬送方法
JP2011199158A (ja) * 2010-03-23 2011-10-06 Nitto Denko Corp ワーク搬送方法およびワーク搬送装置
JP2013030677A (ja) * 2011-07-29 2013-02-07 Dainippon Screen Mfg Co Ltd 基板処理装置、基板保持装置、および、基板保持方法
JP2013207128A (ja) * 2012-03-29 2013-10-07 Dainippon Screen Mfg Co Ltd 基板保持装置、および、基板処理装置
JP2013219070A (ja) * 2012-04-04 2013-10-24 Tokyo Electron Ltd 基板保持装置および基板保持方法
JP2014130899A (ja) * 2012-12-28 2014-07-10 Olympus Corp 基板搬送装置、基板検査装置及び基板搬送方法
JP2014187301A (ja) * 2013-03-25 2014-10-02 Olympus Corp 基板検査装置及び基板受け渡し方法
JP2014197651A (ja) * 2013-03-29 2014-10-16 オリンパス株式会社 基板検査装置及び基板受け渡し方法

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4580327B2 (ja) * 2005-11-21 2010-11-10 東京エレクトロン株式会社 被処理体の取り出し方法及びプログラム記憶媒体並びに載置機構
US7228957B1 (en) * 2005-12-09 2007-06-12 Tna Australia Pty Limited Slip conveyor assembly
JP2010253567A (ja) * 2009-04-21 2010-11-11 Seiko Epson Corp 吸引保持ハンド、吸引保持方法、及び搬送装置
DE102009047083C5 (de) * 2009-11-24 2013-09-12 J. Schmalz Gmbh Druckluftbetriebener Unterdruckerzeuger oder Unterdruckgreifer
NL2006514A (en) * 2010-05-11 2011-11-14 Asml Netherlands Bv Apparatus and method for contactless handling of an object.
CN103764537A (zh) 2011-09-07 2014-04-30 J.施迈茨有限公司 抓取或夹紧设备以及用于处理物件的方法
US9190307B2 (en) * 2012-02-16 2015-11-17 Asm Technology Singapore Pte Ltd Apparatus for transferring a solar wafer or solar cell during its fabrication
DE102012215798B4 (de) 2012-09-06 2016-08-11 J. Schmalz Gmbh Flächensauggreifer
DE102012019839B4 (de) * 2012-10-09 2017-08-24 Grenzebach Maschinenbau Gmbh Verfahren und Vorrichtung für das Befördern großflächiger Platten in extremer Übergröße
JP5652832B2 (ja) * 2013-01-08 2015-01-14 レーザーテック株式会社 チャック装置、及びチャック方法
KR20180003900A (ko) * 2016-07-01 2018-01-10 현대자동차주식회사 연료전지 스택 컴포넌트 공급장치 및 그 공급방법
DE102016011618A1 (de) * 2016-09-28 2018-03-29 Broetje-Automation Gmbh Endeffektoranordnung
US20180190860A1 (en) * 2017-01-05 2018-07-05 Solarcity Corporation System and method for cleaving photovoltaic structures
US11254014B2 (en) * 2017-07-21 2022-02-22 Electro Scientific Industries, Inc. Non-contact handler and method of handling workpieces using the same
CN113751368A (zh) * 2021-09-30 2021-12-07 深圳市优界科技有限公司 一种晶圆自动分选机

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3220723A (en) * 1963-09-25 1965-11-30 Control Data Corp Suction pick up with air bearing
US4185814A (en) * 1977-12-12 1980-01-29 International Business Machines Corporation Pick up and placement head for green sheet and spacer
US4566726A (en) * 1984-06-13 1986-01-28 At&T Technologies, Inc. Method and apparatus for handling semiconductor wafers
US6254155B1 (en) * 1999-01-11 2001-07-03 Strasbaugh, Inc. Apparatus and method for reliably releasing wet, thin wafers

Cited By (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4526316B2 (ja) * 2004-07-16 2010-08-18 株式会社ディスコ 被加工物搬送装置
JP2006032687A (ja) * 2004-07-16 2006-02-02 Disco Abrasive Syst Ltd 被加工物搬送装置
JP2006080289A (ja) * 2004-09-09 2006-03-23 Mitsubishi Electric Corp 搬送装置
JP4495552B2 (ja) * 2004-09-09 2010-07-07 萩原エンジニアリング株式会社 搬送装置
JP2009016529A (ja) * 2007-07-04 2009-01-22 Lintec Corp 貼付装置及び貼付方法
JP4746012B2 (ja) * 2007-07-04 2011-08-10 リンテック株式会社 貼付装置及び貼付方法
US8590953B2 (en) 2008-08-28 2013-11-26 Corning Incorporated Non-contact manipulating devices and methods
CN102132394A (zh) * 2008-08-28 2011-07-20 康宁股份有限公司 非接触操作装置及其方法
KR101483406B1 (ko) 2008-08-28 2015-01-16 코닝 인코포레이티드 비접촉 조작 장치 및 방법
WO2010024888A2 (fr) * 2008-08-28 2010-03-04 Corning Incorporated Dispositifs et procédés de manipulation sans contact
US8231157B2 (en) 2008-08-28 2012-07-31 Corning Incorporated Non-contact manipulating devices and methods
WO2010024888A3 (fr) * 2008-08-28 2010-05-20 Corning Incorporated Dispositifs et procédés de manipulation sans contact
JP2010247304A (ja) * 2009-04-20 2010-11-04 Chugai Ro Co Ltd ワークの吸着パッド装置
WO2010127038A3 (fr) * 2009-04-29 2011-02-24 Applied Materials, Inc. Effecteur pour manipulation de substrats
WO2010127038A2 (fr) * 2009-04-29 2010-11-04 Applied Materials, Inc. Effecteur pour manipulation de substrats
JP2010264552A (ja) * 2009-05-15 2010-11-25 Lintec Corp 板状部材の搬送装置及び搬送方法
JP2010264551A (ja) * 2009-05-15 2010-11-25 Lintec Corp 板状部材の搬送装置及び搬送方法
JP2011199158A (ja) * 2010-03-23 2011-10-06 Nitto Denko Corp ワーク搬送方法およびワーク搬送装置
KR101768721B1 (ko) * 2010-03-23 2017-08-16 닛토덴코 가부시키가이샤 워크 반송 방법 및 워크 반송 장치
TWI512877B (zh) * 2010-03-23 2015-12-11 Nitto Denko Corp 工件搬運方法及工件搬運裝置
JP2011258682A (ja) * 2010-06-08 2011-12-22 Tomoo Matsushita 基板入替装置
JP4582820B1 (ja) * 2010-06-08 2010-11-17 智雄 松下 基板入替装置
US8832924B2 (en) 2011-07-29 2014-09-16 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus, substrate holding apparatus, and method of holding substrate
JP2013030677A (ja) * 2011-07-29 2013-02-07 Dainippon Screen Mfg Co Ltd 基板処理装置、基板保持装置、および、基板保持方法
JP2013207128A (ja) * 2012-03-29 2013-10-07 Dainippon Screen Mfg Co Ltd 基板保持装置、および、基板処理装置
JP2013219070A (ja) * 2012-04-04 2013-10-24 Tokyo Electron Ltd 基板保持装置および基板保持方法
JP2014130899A (ja) * 2012-12-28 2014-07-10 Olympus Corp 基板搬送装置、基板検査装置及び基板搬送方法
JP2014187301A (ja) * 2013-03-25 2014-10-02 Olympus Corp 基板検査装置及び基板受け渡し方法
JP2014197651A (ja) * 2013-03-29 2014-10-16 オリンパス株式会社 基板検査装置及び基板受け渡し方法

Also Published As

Publication number Publication date
DE60313279T2 (de) 2007-12-27
US20040112715A1 (en) 2004-06-17
US7063499B2 (en) 2006-06-20
EP1429373A2 (fr) 2004-06-16
TW200505775A (en) 2005-02-16
EP1429373B1 (fr) 2007-04-18
DE60313279D1 (de) 2007-05-31
EP1429373A3 (fr) 2005-02-16

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