TW200505775A - Conveyor system - Google Patents

Conveyor system

Info

Publication number
TW200505775A
TW200505775A TW092134561A TW92134561A TW200505775A TW 200505775 A TW200505775 A TW 200505775A TW 092134561 A TW092134561 A TW 092134561A TW 92134561 A TW92134561 A TW 92134561A TW 200505775 A TW200505775 A TW 200505775A
Authority
TW
Taiwan
Prior art keywords
workpiece
plate
shaped member
chucking
lifting
Prior art date
Application number
TW092134561A
Other languages
English (en)
Inventor
Akihiro Miyamoto
Original Assignee
Shinko Electric Ind Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Ind Co filed Critical Shinko Electric Ind Co
Publication of TW200505775A publication Critical patent/TW200505775A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
TW092134561A 2002-12-09 2003-12-08 Conveyor system TW200505775A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002356495A JP2004193195A (ja) 2002-12-09 2002-12-09 搬送装置

Publications (1)

Publication Number Publication Date
TW200505775A true TW200505775A (en) 2005-02-16

Family

ID=32322056

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092134561A TW200505775A (en) 2002-12-09 2003-12-08 Conveyor system

Country Status (5)

Country Link
US (1) US7063499B2 (zh)
EP (1) EP1429373B1 (zh)
JP (1) JP2004193195A (zh)
DE (1) DE60313279T2 (zh)
TW (1) TW200505775A (zh)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4526316B2 (ja) * 2004-07-16 2010-08-18 株式会社ディスコ 被加工物搬送装置
JP4495552B2 (ja) * 2004-09-09 2010-07-07 萩原エンジニアリング株式会社 搬送装置
JP4580327B2 (ja) * 2005-11-21 2010-11-10 東京エレクトロン株式会社 被処理体の取り出し方法及びプログラム記憶媒体並びに載置機構
US7228957B1 (en) * 2005-12-09 2007-06-12 Tna Australia Pty Limited Slip conveyor assembly
JP4746012B2 (ja) * 2007-07-04 2011-08-10 リンテック株式会社 貼付装置及び貼付方法
US8231157B2 (en) * 2008-08-28 2012-07-31 Corning Incorporated Non-contact manipulating devices and methods
JP4723009B2 (ja) * 2009-04-20 2011-07-13 中外炉工業株式会社 ワークの吸着パッド装置
JP2010253567A (ja) * 2009-04-21 2010-11-11 Seiko Epson Corp 吸引保持ハンド、吸引保持方法、及び搬送装置
ITUD20090214A1 (it) * 2009-11-24 2011-05-25 Applied Materials Inc Effettore d'estremita' per la manipolazione di substrati
JP5449856B2 (ja) * 2009-05-15 2014-03-19 リンテック株式会社 半導体ウエハの搬送方法
JP5449857B2 (ja) * 2009-05-15 2014-03-19 リンテック株式会社 板状部材の搬送装置及び搬送方法
DE102009047083C5 (de) * 2009-11-24 2013-09-12 J. Schmalz Gmbh Druckluftbetriebener Unterdruckerzeuger oder Unterdruckgreifer
JP5543813B2 (ja) * 2010-03-23 2014-07-09 日東電工株式会社 ワーク搬送方法およびワーク搬送装置
NL2006514A (en) * 2010-05-11 2011-11-14 Asml Netherlands Bv Apparatus and method for contactless handling of an object.
JP4582820B1 (ja) * 2010-06-08 2010-11-17 智雄 松下 基板入替装置
JP5877005B2 (ja) * 2011-07-29 2016-03-02 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、基板保持装置、および、基板保持方法
CN103764537A (zh) 2011-09-07 2014-04-30 J.施迈茨有限公司 抓取或夹紧设备以及用于处理物件的方法
US9190307B2 (en) * 2012-02-16 2015-11-17 Asm Technology Singapore Pte Ltd Apparatus for transferring a solar wafer or solar cell during its fabrication
JP5934542B2 (ja) * 2012-03-29 2016-06-15 株式会社Ｓｃｒｅｅｎホールディングス 基板保持装置、および、基板処理装置
JP5869943B2 (ja) * 2012-04-04 2016-02-24 東京エレクトロン株式会社 基板保持装置および基板保持方法
DE102012215798B4 (de) 2012-09-06 2016-08-11 J. Schmalz Gmbh Flächensauggreifer
DE102012019839B4 (de) * 2012-10-09 2017-08-24 Grenzebach Maschinenbau Gmbh Verfahren und Vorrichtung für das Befördern großflächiger Platten in extremer Übergröße
JP2014130899A (ja) * 2012-12-28 2014-07-10 Olympus Corp 基板搬送装置、基板検査装置及び基板搬送方法
JP5652832B2 (ja) * 2013-01-08 2015-01-14 レーザーテック株式会社 チャック装置、及びチャック方法
JP6086777B2 (ja) * 2013-03-25 2017-03-01 オリンパス株式会社 基板検査装置及び基板受け渡し方法
JP2014197651A (ja) * 2013-03-29 2014-10-16 オリンパス株式会社 基板検査装置及び基板受け渡し方法
KR20180003900A (ko) * 2016-07-01 2018-01-10 현대자동차주식회사 연료전지 스택 컴포넌트 공급장치 및 그 공급방법
DE102016011618A1 (de) * 2016-09-28 2018-03-29 Broetje-Automation Gmbh Endeffektoranordnung
US20180190860A1 (en) * 2017-01-05 2018-07-05 Solarcity Corporation System and method for cleaving photovoltaic structures
US11254014B2 (en) * 2017-07-21 2022-02-22 Electro Scientific Industries, Inc. Non-contact handler and method of handling workpieces using the same
CN113751368A (zh) * 2021-09-30 2021-12-07 深圳市优界科技有限公司 一种晶圆自动分选机

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3220723A (en) * 1963-09-25 1965-11-30 Control Data Corp Suction pick up with air bearing
US4185814A (en) * 1977-12-12 1980-01-29 International Business Machines Corporation Pick up and placement head for green sheet and spacer
US4566726A (en) * 1984-06-13 1986-01-28 At&T Technologies, Inc. Method and apparatus for handling semiconductor wafers
US6254155B1 (en) * 1999-01-11 2001-07-03 Strasbaugh, Inc. Apparatus and method for reliably releasing wet, thin wafers

Also Published As

Publication number Publication date
DE60313279T2 (de) 2007-12-27
US20040112715A1 (en) 2004-06-17
JP2004193195A (ja) 2004-07-08
US7063499B2 (en) 2006-06-20
EP1429373A2 (en) 2004-06-16
EP1429373B1 (en) 2007-04-18
DE60313279D1 (de) 2007-05-31
EP1429373A3 (en) 2005-02-16

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