JP2004180301A - 音響バッキング材料を介して超音波変換器に電気的に接続する方法 - Google Patents
音響バッキング材料を介して超音波変換器に電気的に接続する方法 Download PDFInfo
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- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
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- G—PHYSICS
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Abstract
【解決手段】 変換器素子(12)は、音響バッキング層(14)内のスルーホール(26)を介してパルサと電気的に接続される。導電性材料(28)が、音響バッキング層の前面上に被着された後にダイス加工されて導電性パッドを形成し、またスルーホール又はバイアの壁上に被着され、プリント回路(16)に接続されることになる露出端部を有する導電性トレースを形成する。音響バッキング層の孔は、音響減衰材料(30)で充填される。変換器素子の後面上の信号電極は、音響バッキング層の導電性パッドと導電性トレースとを介してプリント回路に電気的に接続される。変換器パレットの側面から出る共通の接地接続部材が、変換器素子の前面と音響インピーダンス整合層(20)との間に配置される。
【選択図】 図1
Description
12 圧電変換器素子
14 音響バッキング層
26 バイア
28 導電性材料
30 音響減衰材料
Claims (10)
- 一方の側面から他方の側面まで貫通する孔(26)のアレイを有する音響バッキング材料の母材(24)を形成する段階と、
前記音響バッキング母材の少なくとも一方の面上と、該音響バッキング材料にわたる孔の表面上とに導電性フィルム(28)を被着させる段階と、
前記孔内部の残りの容積を音響バッキング材料(30)で充填する段階と、
結果として得られる音響バッキング材料の層を変換器アレイ(10)上に取り付ける段階と、
個別の電気的接続を可能にするように各変換器素子を電気的に分離する段階と、を含む製造方法。 - 前面と後面とを有する比較的厚い音響減衰材料層(24)に、前記前面から前記後面までの厚さにわたる孔(26)のアレイを形成する段階と、
前記比較的厚い層の少なくとも前記前面と前記孔の表面上とに、第1の比較的薄い導電性材料層(28)を被着させる段階と、
前記孔の残りの容積を音響減衰材料(30)で充填する段階と、
圧電材料の層(12)の後面上に、第2の比較的薄い導電性材料層を被着させる段階と、
前記比較的厚い音響減衰材料層を前記圧電材料層に積層して、前記第1と第2の比較的薄い導電性材料層を電気的に接続する段階と、
前記圧電材料層と前記比較的厚い音響減衰材料層の一部分とを、前記第1と第2の比較的薄い層の複数の領域を互いに電気的に絶縁する複数の切り溝(32)を形成するのに十分な深さまで、互いに平行な第1の複数の平面に沿ってダイス加工する段階と、
を含む超音波変換器を製造する方法。 - 前記圧電材料層の前面上に第3の比較的薄い導電性材料層を被着させる段階と、
比較的厚い音響インピーダンス整合材料層の後面上に第4の比較的薄い導電性材料層を被着させる段階と、
前記第3と第4の比較的薄い導電性材料層を互いに接触させた状態で前記第1の比較的厚い音響インピーダンス整合材料層を前記圧電材料層に取り付ける段階と、
前記第1と第2の比較的薄い導電性材料層の電気的に絶縁された各領域の複数の小領域が、前記第1の複数の切り溝にほぼ直交する第2の複数の切り溝(34)によって電気的に絶縁されるのに十分な深さまで、互いに平行な複数の第2の平面に沿って、前記比較的厚い音響インピーダンス整合材料層と、前記圧電材料層と、前記比較的厚い音響減衰材料層の一部分とをダイス加工する段階と、
を更に含む請求項2に記載の方法。 - 前記互いに平行な第1の平面に沿って、前記第3の比較的薄い導電性材料層がダイス加工されない深さまで前記比較的厚い音響インピーダンス整合材料層の少なくとも一部分をダイス加工する段階を更に含む請求項3に記載の方法。
- 前記孔のアレイが、第1と第2の孔の列を備え、
第1と第2の印刷回路(16)を前記比較的厚い音響減衰材料層に取り付けて、前記第1の印刷回路の導電性トレースを前記第1の列のそれぞれの孔に被着させた前記比較的薄い導電性材料層と接触させ、前記第2の印刷回路の導電性トレースを前記第2の列のそれぞれの孔に被着させた比較的薄い導電性材料層と接触させる段階を更に含む請求項2に記載の方法。 - 前記第1と第2の比較的薄い導電性材料層の前記電気的に絶縁された各領域の複数の小領域が、前記第1の複数の切り溝にほぼ直交する第2の複数の切り溝によって電気的に絶縁されるのに十分な深さまで、互いに平行な複数の第2の平面に沿って、前記圧電材料層と前記比較的厚い音響減衰材料層の一部分とをダイス加工する段階を更に含む請求項2に記載の方法。
- 音響減衰材料が前記孔を充填し、前記比較的厚い層の音響減衰材料がほぼ同じ組成を有することを特徴とする請求項2に記載の方法。
- 圧電変換器素子(12)のアレイ(10)と、該圧電変換器素子の各々の後面に音響的に結合された音響バッキング層(14)とを含み、該音響バッキング層が、複数のバイア形状の内部構造を備えた音響バッキング材料層を含み、各々の前記バイア形状の内部構造(26)が、該構造上に導電性材料(28)が被着され、音響減衰材料(30)で充填された容積を境界付けていることを特徴とする超音波変換器。
- 前記圧電変換器素子と、これと面する前記音響バッキング層の部分とが、高さ方向平面に平行に配置された互いに間隔を空けた複数の切り溝32により絶縁され、各圧電変換器素子が面上に電極を有し、前記音響バッキング層の各絶縁された部分が、前面上に導電性パッドを有し、各導電性パッドがそれぞれの電極と接触することを特徴とする請求項8に記載の超音波変換器。
- 前記音響減衰材料が、前記境界のある容積を充填し、前記音響減衰材料層がほぼ同じ組成を有することを特徴とする請求項8に記載の超音波変換器。
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US10/065,813 US7053530B2 (en) | 2002-11-22 | 2002-11-22 | Method for making electrical connection to ultrasonic transducer through acoustic backing material |
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JP2004180301A true JP2004180301A (ja) | 2004-06-24 |
JP2004180301A5 JP2004180301A5 (ja) | 2009-02-12 |
JP4433378B2 JP4433378B2 (ja) | 2010-03-17 |
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- 2003-11-21 JP JP2003391556A patent/JP4433378B2/ja not_active Expired - Fee Related
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JP4575108B2 (ja) * | 2004-10-15 | 2010-11-04 | 株式会社東芝 | 超音波プローブ |
JP2006129451A (ja) * | 2004-10-29 | 2006-05-18 | General Electric Co <Ge> | 再構成可能なセンサ・アレイのための一体型インタフェース電子回路 |
JP2008535643A (ja) * | 2005-03-02 | 2008-09-04 | リサーチ・トライアングル・インスティチュート | 空気に支持されたキャビティを有する圧電微小加工超音波振動子 |
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KR20150049067A (ko) * | 2013-10-29 | 2015-05-08 | 삼성메디슨 주식회사 | 초음파 프로브 및 이를 포함하는 초음파 영상 장치 |
KR102262231B1 (ko) | 2013-10-29 | 2021-06-08 | 삼성메디슨 주식회사 | 초음파 프로브 및 이를 포함하는 초음파 영상 장치 |
JP2017056030A (ja) * | 2015-09-17 | 2017-03-23 | 株式会社日立製作所 | 超音波プローブ |
Also Published As
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US7053530B2 (en) | 2006-05-30 |
US20040100163A1 (en) | 2004-05-27 |
JP4433378B2 (ja) | 2010-03-17 |
FR2847492A1 (fr) | 2004-05-28 |
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