JP4503347B2 - 超音波探触子の製造方法 - Google Patents
超音波探触子の製造方法 Download PDFInfo
- Publication number
- JP4503347B2 JP4503347B2 JP2004132495A JP2004132495A JP4503347B2 JP 4503347 B2 JP4503347 B2 JP 4503347B2 JP 2004132495 A JP2004132495 A JP 2004132495A JP 2004132495 A JP2004132495 A JP 2004132495A JP 4503347 B2 JP4503347 B2 JP 4503347B2
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- JP
- Japan
- Prior art keywords
- ultrasonic probe
- lead wire
- manufacturing
- groove
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000523 sample Substances 0.000 title claims description 19
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 26
- 239000011521 glass Substances 0.000 claims description 8
- 238000005520 cutting process Methods 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 239000000463 material Substances 0.000 description 12
- 239000000919 ceramic Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000005411 Van der Waals force Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
- B06B1/0629—Square array
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49005—Acoustic transducer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Transducers For Ultrasonic Waves (AREA)
Description
超音波探触子は複数の圧電素子1を固定台2の表面上に二次元方向(長さ及び幅方向)に配列してなる。各圧電素子1は両主面(上面及び下面)に駆動電極3(ab)を有する。固定台2は一般には振動を抑制する制動機能を有して反射を防止する例えばゴム系のダンパー材2Aからなる。一般には、ダンパー材2Aはバッキング材と呼称される。そして、圧電素子1の下面の駆動電極3bにはリード線4が接続し、固定台2を挿通して背面側に導出される。ここでは、固定台2の背面側に露出し、図示しないコネクタによってケーブルに接続する。
Claims (4)
- 複数の圧電素子を固定台上に二次元方向に配列し、前記各圧電素子の下面から電気的に接続して前記固定台を挿入するリード線を導出した超音波探触子の製造方法において、板面を貫通する開口部及び板面の上下方向に並設した第1溝を有する複数の単位固定板を積層して第1固定台を形成する工程と、前記単位固定板の第1溝にリード線を挿入して第2固定台を形成する工程と、前記第2固定台の両主面を切除して前記リード線を露出して第3固定台を形成する工程と、前記第3固定台の上面に圧電板を固着して前記リード線間を切断して複数の圧電素子を形成する工程とからなる超音波探触子の製造方法。
- 請求項1において、前記単位固定板は直接接合によって積層された超音波探触子の製造方法。
- 請求項1において、前記単位固定板は前記第1溝間に設けられた第2溝に充填されたガラスによって積層された超音波探触子の製造方法。
- 請求項1において、前記第1溝に挿入されるリード線はすだれ状の一体型リード線である超音波探触子の製造方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004132495A JP4503347B2 (ja) | 2004-04-28 | 2004-04-28 | 超音波探触子の製造方法 |
US11/111,170 US7312556B2 (en) | 2004-04-28 | 2005-04-21 | Ultrasonic probe and manufacturing process thereof |
US11/891,106 US7913366B2 (en) | 2004-04-28 | 2007-08-09 | Ultrasonic probe and manufacturing process thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004132495A JP4503347B2 (ja) | 2004-04-28 | 2004-04-28 | 超音波探触子の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005318155A JP2005318155A (ja) | 2005-11-10 |
JP4503347B2 true JP4503347B2 (ja) | 2010-07-14 |
Family
ID=35186360
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004132495A Expired - Fee Related JP4503347B2 (ja) | 2004-04-28 | 2004-04-28 | 超音波探触子の製造方法 |
Country Status (2)
Country | Link |
---|---|
US (2) | US7312556B2 (ja) |
JP (1) | JP4503347B2 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU2009256236A1 (en) | 2008-06-04 | 2009-12-10 | Neovista, Inc. | Handheld radiation delivery system for advancing a radiation source wire |
KR100970948B1 (ko) * | 2009-10-28 | 2010-08-03 | 주식회사 로보젠 | 3차원 초음파 이미징을 위한 2차원 가상 배열형 탐촉자 |
JPWO2011162363A1 (ja) * | 2010-06-25 | 2013-08-22 | 日本発條株式会社 | プローブホルダ、プローブホルダおよびプローブユニットの製造方法 |
US11465177B2 (en) * | 2018-05-21 | 2022-10-11 | Fujifilm Sonosite, Inc. | PMUT ultrasound transducer with damping layer |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10512680A (ja) * | 1995-11-03 | 1998-12-02 | トムソン−セーエスエフ | 音響プローブおよびその製造プロセス |
JP2002027593A (ja) * | 2000-07-05 | 2002-01-25 | Hitachi Medical Corp | 超音波探触子 |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3854060A (en) * | 1973-10-12 | 1974-12-10 | Us Navy | Transducer for fm sonar application |
US4217684A (en) * | 1979-04-16 | 1980-08-19 | General Electric Company | Fabrication of front surface matched ultrasonic transducer array |
JPS6085699A (ja) * | 1983-10-17 | 1985-05-15 | Hitachi Ltd | 複合圧電材料の形成方法 |
US4556814A (en) * | 1984-02-21 | 1985-12-03 | Ngk Spark Plug Co., Ltd. | Piezoelectric ultrasonic transducer with porous plastic housing |
JP2794720B2 (ja) * | 1988-08-23 | 1998-09-10 | 松下電器産業株式会社 | 複合圧電振動子 |
US5327895A (en) * | 1991-07-10 | 1994-07-12 | Kabushiki Kaisha Toshiba | Ultrasonic probe and ultrasonic diagnosing system using ultrasonic probe |
CA2139151A1 (en) * | 1994-01-14 | 1995-07-15 | Amin M. Hanafy | Two-dimensional acoustic array and method for the manufacture thereof |
DE59503218D1 (de) * | 1994-02-07 | 1998-09-24 | Siemens Ag | Verfahren zur Herstellung einer kubisch integrierten Schaltungsanordnung |
US5559388A (en) * | 1995-03-03 | 1996-09-24 | General Electric Company | High density interconnect for an ultrasonic phased array and method for making |
US6020675A (en) * | 1995-09-13 | 2000-02-01 | Kabushiki Kaisha Toshiba | Ultrasonic probe |
FR2756447B1 (fr) * | 1996-11-26 | 1999-02-05 | Thomson Csf | Sonde acoustique multielements comprenant une electrode de masse commune |
JP3507655B2 (ja) | 1997-03-31 | 2004-03-15 | 日本電波工業株式会社 | 探触子用バッキング材及びこれを用いた超音波探触子の製造方法並びに超音波探触子 |
FR2770932B1 (fr) * | 1997-11-07 | 2001-11-16 | Thomson Csf | Procede de fabrication d'une sonde acoustique |
JP3178414B2 (ja) * | 1998-05-21 | 2001-06-18 | 株式会社村田製作所 | 積層型圧電体及び圧電アクチュエータ |
JP2000050391A (ja) * | 1998-07-31 | 2000-02-18 | Olympus Optical Co Ltd | 超音波トランスデューサーおよびその製造方法 |
US6268683B1 (en) * | 1999-02-26 | 2001-07-31 | M&Fc Holding Company | Transducer configurations and related method |
JP3551141B2 (ja) * | 2000-09-28 | 2004-08-04 | 松下電器産業株式会社 | 圧電体の製造方法 |
JP3883823B2 (ja) * | 2001-06-19 | 2007-02-21 | 日本電波工業株式会社 | マトリクス型の超音波探触子及びその製造方法 |
US6758094B2 (en) * | 2001-07-31 | 2004-07-06 | Koninklijke Philips Electronics, N.V. | Ultrasonic transducer wafer having variable acoustic impedance |
US6859984B2 (en) * | 2002-09-05 | 2005-03-01 | Vermon | Method for providing a matrix array ultrasonic transducer with an integrated interconnection means |
JP4473532B2 (ja) * | 2002-10-10 | 2010-06-02 | 日本碍子株式会社 | 圧電/電歪デバイス及び製造方法 |
US7053530B2 (en) * | 2002-11-22 | 2006-05-30 | General Electric Company | Method for making electrical connection to ultrasonic transducer through acoustic backing material |
US20070046149A1 (en) * | 2005-08-23 | 2007-03-01 | Zipparo Michael J | Ultrasound probe transducer assembly and production method |
US7449640B2 (en) * | 2005-10-14 | 2008-11-11 | Sonosite, Inc. | Alignment features for dicing multi element acoustic arrays |
-
2004
- 2004-04-28 JP JP2004132495A patent/JP4503347B2/ja not_active Expired - Fee Related
-
2005
- 2005-04-21 US US11/111,170 patent/US7312556B2/en not_active Expired - Fee Related
-
2007
- 2007-08-09 US US11/891,106 patent/US7913366B2/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10512680A (ja) * | 1995-11-03 | 1998-12-02 | トムソン−セーエスエフ | 音響プローブおよびその製造プロセス |
JP2002027593A (ja) * | 2000-07-05 | 2002-01-25 | Hitachi Medical Corp | 超音波探触子 |
Also Published As
Publication number | Publication date |
---|---|
US20080294053A1 (en) | 2008-11-27 |
US7913366B2 (en) | 2011-03-29 |
US20050242689A1 (en) | 2005-11-03 |
JP2005318155A (ja) | 2005-11-10 |
US7312556B2 (en) | 2007-12-25 |
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