JPH10512680A - 音響プローブおよびその製造プロセス - Google Patents
音響プローブおよびその製造プロセスInfo
- Publication number
- JPH10512680A JPH10512680A JP9517907A JP51790797A JPH10512680A JP H10512680 A JPH10512680 A JP H10512680A JP 9517907 A JP9517907 A JP 9517907A JP 51790797 A JP51790797 A JP 51790797A JP H10512680 A JPH10512680 A JP H10512680A
- Authority
- JP
- Japan
- Prior art keywords
- acoustic probe
- piezoelectric
- probe according
- conductive
- dielectric substrates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000523 sample Substances 0.000 title claims abstract description 32
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 239000000758 substrate Substances 0.000 claims abstract description 27
- 238000000034 method Methods 0.000 claims abstract description 20
- 239000011358 absorbing material Substances 0.000 claims abstract description 12
- 239000011159 matrix material Substances 0.000 claims description 15
- 238000005520 cutting process Methods 0.000 claims description 9
- 229920001721 polyimide Polymers 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 238000000151 deposition Methods 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 18
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 238000001465 metallisation Methods 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000011805 ball Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 244000309464 bull Species 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000002059 diagnostic imaging Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000011806 microball Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
- B06B1/0629—Square array
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Transducers For Ultrasonic Waves (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.吸音材の表面上に分配された(Dx)方向のM個の圧電変換器および(Dx) 方向に直交する(Dy)方向のN個の圧電変換器からなるマトリックス、および 音響変換器を、信号を制御し、処理する電子装置に接続する相互接続システムを 含み、相互接続システムが、 − M×N個の導電トラックが、M×N個の圧電変換器に接触するセクションを 有し、かつ吸音材内で、(Dx)方向では間隔(PN)、(Dy)方向では間隔( PM)で分配された第1の部分(1)と、 − M×N個の導電トラックが、間隔(P'M)によって分離され、それぞれ間隔 (P'N)で分配されたN個のトラックを含むM個の誘電体基板上に分配された第 2の部分(2)とを含むことを特徴とする音響プローブ。 2.M個の誘電体基板がフレキシブル・プリント回路であることを特徴とする請 求の範囲第1項に記載の音響プローブ。 3.間隔(P'N)が、(Dx)方向および(Dy)方向によって画定される平面に 直交する軸に沿って増大することを特徴とする請求の範囲第1項または第2項に 記載の音響プローブ。 4.間隔(P'M)が、(Dx)方向および(Dy)方向によって画定される平面に 直交する軸に沿って増大することを特徴とする請求の範囲第1項ないし第3項の いずれか一項に記載の音響プローブ。 5.M個の基板がプリント回路であることを特徴とする請求の範囲第1項ないし 第4項のいずれか一項に記載の音響プローブ。 6.M個の基板が、NsがNよりも小さいとして、入力としてN個の導電行に接 続され、出力としてNs個の導電行に接続された構成要素を含んでいることを特 徴とする請求の範囲第1項ないし第5項のいずれか一項に記載の音響プローブ。 7.プリント回路がフレキシブル・ポリイミド・フィルムであることを特徴とす る請求の範囲第5項に記載の音響プローブ。 8.吸音材が充填エポキシ樹脂であることを特徴とする請求の範囲第1項ないし 第7項のいずれか一項に記載の音響プローブ。 9.音波減衰層の表面上に分配され、相互接続システムを介して、信号を制御し 、処理する電子装置に接続されたM×N個の圧電素子のマトリックスを含み、相 互接続システムの製造が、 − それぞれN個の導電トラックがその上に製造されるM個の誘電体基板、およ び導電トラックが局所的に露出した窓を製造するステップと、 − M個の誘電体基板をスタック化し、M個の窓のスタックに対応するキャビテ ィを形成するステップと、 − 予備成形したキャビティを電気絶縁吸音材で充填するステップと、 − 絶縁吸音材で充填されたキャビティ内にある平面(Pc)内でM個の誘電体 基板のスタックを切断するステップとを含むことを特徴とする音響プローブを製 造する方法。 10.M個の誘電体基板がプリント回路であることを特徴とする請求の範囲第9 項に記載の音響プローブを製造する方法。 11.− 相互接続システムの部分(1)の表面上に導電層を付着するステップ と、 − 圧電材料の層を接着するステップと、 − 導電層および圧電層をN−1(Dy)方向において切断するステップと、 − N個の素子に切断された圧電層の表面全体上に四分の1波長板を接着するス テップと、 − 導電層、圧電層および四分の1波長板からなる3つの厚さをM−1(Dx) 方向において切断するステップとを含むことを特徴とする請求の範囲第9項また は第10項に記載の音響プローブを製造する方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9512999A FR2740933B1 (fr) | 1995-11-03 | 1995-11-03 | Sonde acoustique et procede de realisation |
FR95/12999 | 1995-11-03 | ||
PCT/FR1996/001650 WO1997017145A1 (fr) | 1995-11-03 | 1996-10-22 | Sonde acoustique et procede de realisation |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH10512680A true JPH10512680A (ja) | 1998-12-02 |
JP3766978B2 JP3766978B2 (ja) | 2006-04-19 |
Family
ID=9484205
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP51790797A Expired - Lifetime JP3766978B2 (ja) | 1995-11-03 | 1996-10-22 | 音響プローブの製造方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US6044533A (ja) |
EP (1) | EP0801595B1 (ja) |
JP (1) | JP3766978B2 (ja) |
KR (1) | KR100414141B1 (ja) |
DE (1) | DE69603829D1 (ja) |
FR (1) | FR2740933B1 (ja) |
WO (1) | WO1997017145A1 (ja) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001292496A (ja) * | 2000-02-02 | 2001-10-19 | Toshiba Corp | 二次元アレイ型超音波プローブ |
JP2005318155A (ja) * | 2004-04-28 | 2005-11-10 | Nippon Dempa Kogyo Co Ltd | 超音波探触子及びその製造方法 |
JP2006288420A (ja) * | 2005-04-05 | 2006-10-26 | Toshiba Corp | 超音波トランスデューサの製造方法及び超音波トランスデューサ |
JP2007130385A (ja) * | 2005-11-14 | 2007-05-31 | Aloka Co Ltd | 超音波探触子及びそれに用いるバッキング |
JP2008188423A (ja) * | 2007-01-31 | 2008-08-21 | General Electric Co <Ge> | 超音波撮像システム |
JP2009022006A (ja) * | 2007-07-10 | 2009-01-29 | Siemens Medical Solutions Usa Inc | 改良形超音波トランスデューサ、バッキングおよびバッキング作製方法 |
JP2009147365A (ja) * | 2009-03-09 | 2009-07-02 | Ge Medical Systems Global Technology Co Llc | フレキシブルプリント基板、超音波探触子および超音波探触子の製造方法 |
US7757389B2 (en) | 2006-06-28 | 2010-07-20 | Ge Medical Systems Global Technology Company, Llc | Method of manufacturing an ultrasonic probe |
WO2012042766A1 (ja) * | 2010-09-30 | 2012-04-05 | 株式会社アドバンテスト | 変換器および測定装置 |
JP5923205B1 (ja) * | 2015-07-07 | 2016-05-24 | 日立アロカメディカル株式会社 | 超音波探触子 |
KR20180068586A (ko) * | 2016-12-14 | 2018-06-22 | 삼성메디슨 주식회사 | 초음파 진단 장치용 프로브 |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2756447B1 (fr) * | 1996-11-26 | 1999-02-05 | Thomson Csf | Sonde acoustique multielements comprenant une electrode de masse commune |
FR2770932B1 (fr) | 1997-11-07 | 2001-11-16 | Thomson Csf | Procede de fabrication d'une sonde acoustique |
FR2779575B1 (fr) | 1998-06-05 | 2003-05-30 | Thomson Csf | Sonde acoustique multielements comprenant un film composite conducteur et procede de fabrication |
FR2789822B1 (fr) | 1999-02-12 | 2001-06-08 | Thomson Csf | Dispositif a ondes de surface connecte a une embase avec un adhesif conducteur |
FR2799883B1 (fr) | 1999-10-15 | 2003-05-30 | Thomson Csf | Procede d'encapsulation de composants electroniques |
US6467138B1 (en) | 2000-05-24 | 2002-10-22 | Vermon | Integrated connector backings for matrix array transducers, matrix array transducers employing such backings and methods of making the same |
FR2810907B1 (fr) * | 2000-06-30 | 2002-10-31 | Thomson Csf | Procede de fabrication d'une sonde acoustique multielements utilisant une nouvelle methode de realisation de la masse electrique |
FR2818170B1 (fr) * | 2000-12-19 | 2003-03-07 | Thomson Csf | Procede de fabrication d'une sonde acoustique multielements utilisant un film polymere metallise et ablate comme plan de masse |
FR2819143B1 (fr) * | 2000-12-28 | 2003-03-07 | Thomson Csf | Procede de realisation de plots de connexion sur un circuit imprime |
JP4079658B2 (ja) * | 2002-03-05 | 2008-04-23 | 株式会社リコー | 2値化ウォブル信号を生成する回路、ライトクロック生成回路、2値化ウォブル信号を生成する方法、ライトクロック生成方法及び光ディスク装置 |
FR2837636B1 (fr) * | 2002-03-19 | 2004-09-24 | Thales Sa | Dispositif a ondes acoustiques d'interface en tantalate de lithium |
JP4222467B2 (ja) * | 2002-04-18 | 2009-02-12 | テイカ株式会社 | コンポジット圧電体およびその製造方法 |
JP3856380B2 (ja) * | 2002-04-26 | 2006-12-13 | テイカ株式会社 | コンポジット圧電振動子およびその製造方法 |
EP1838462B1 (en) * | 2005-01-11 | 2018-08-08 | Koninklijke Philips N.V. | Redistribution interconnect for microbeamformer(s) and a medical ultrasound system |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1530783A (en) * | 1976-01-30 | 1978-11-01 | Emi Ltd | Ultra-sonic pickup device |
DE3485521D1 (de) * | 1983-12-08 | 1992-04-02 | Toshiba Kawasaki Kk | Gebogene lineare ultraschallwandleranordnung. |
DE3623520A1 (de) * | 1985-07-15 | 1987-01-22 | Advanced Tech Lab | Phasengesteuerter ultraschall-gruppenwandler |
JP2847575B2 (ja) * | 1990-10-30 | 1999-01-20 | 日本電波工業株式会社 | 超音波深触子 |
JP3040554B2 (ja) * | 1991-10-08 | 2000-05-15 | ジーイー横河メディカルシステム株式会社 | 超音波探触子 |
US5311095A (en) * | 1992-05-14 | 1994-05-10 | Duke University | Ultrasonic transducer array |
JP3138104B2 (ja) * | 1993-03-17 | 2001-02-26 | 三洋電機株式会社 | 電子部品自動装着装置 |
EP0637470A3 (en) * | 1993-08-05 | 1995-11-22 | Hewlett Packard Co | Back layer for a set of acoustic transducers. |
US5592730A (en) * | 1994-07-29 | 1997-01-14 | Hewlett-Packard Company | Method for fabricating a Z-axis conductive backing layer for acoustic transducers using etched leadframes |
-
1995
- 1995-11-03 FR FR9512999A patent/FR2740933B1/fr not_active Expired - Fee Related
-
1996
- 1996-10-22 KR KR1019970704573A patent/KR100414141B1/ko not_active IP Right Cessation
- 1996-10-22 EP EP96934953A patent/EP0801595B1/fr not_active Expired - Lifetime
- 1996-10-22 JP JP51790797A patent/JP3766978B2/ja not_active Expired - Lifetime
- 1996-10-22 DE DE69603829T patent/DE69603829D1/de not_active Expired - Lifetime
- 1996-10-22 US US08/849,734 patent/US6044533A/en not_active Expired - Lifetime
- 1996-10-22 WO PCT/FR1996/001650 patent/WO1997017145A1/fr active IP Right Grant
Cited By (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4521126B2 (ja) * | 2000-02-02 | 2010-08-11 | 株式会社東芝 | 二次元アレイ型超音波プローブ |
JP2001292496A (ja) * | 2000-02-02 | 2001-10-19 | Toshiba Corp | 二次元アレイ型超音波プローブ |
JP2005318155A (ja) * | 2004-04-28 | 2005-11-10 | Nippon Dempa Kogyo Co Ltd | 超音波探触子及びその製造方法 |
JP4503347B2 (ja) * | 2004-04-28 | 2010-07-14 | 日本電波工業株式会社 | 超音波探触子の製造方法 |
JP2006288420A (ja) * | 2005-04-05 | 2006-10-26 | Toshiba Corp | 超音波トランスデューサの製造方法及び超音波トランスデューサ |
JP4621530B2 (ja) * | 2005-04-05 | 2011-01-26 | 株式会社東芝 | 超音波トランスデューサの製造方法及び超音波トランスデューサ |
JP2007130385A (ja) * | 2005-11-14 | 2007-05-31 | Aloka Co Ltd | 超音波探触子及びそれに用いるバッキング |
JP4532392B2 (ja) * | 2005-11-14 | 2010-08-25 | アロカ株式会社 | 超音波探触子及びそれに用いるバッキング |
US7757389B2 (en) | 2006-06-28 | 2010-07-20 | Ge Medical Systems Global Technology Company, Llc | Method of manufacturing an ultrasonic probe |
JP2008188423A (ja) * | 2007-01-31 | 2008-08-21 | General Electric Co <Ge> | 超音波撮像システム |
JP2009022006A (ja) * | 2007-07-10 | 2009-01-29 | Siemens Medical Solutions Usa Inc | 改良形超音波トランスデューサ、バッキングおよびバッキング作製方法 |
JP2009147365A (ja) * | 2009-03-09 | 2009-07-02 | Ge Medical Systems Global Technology Co Llc | フレキシブルプリント基板、超音波探触子および超音波探触子の製造方法 |
WO2012042766A1 (ja) * | 2010-09-30 | 2012-04-05 | 株式会社アドバンテスト | 変換器および測定装置 |
JP2012075555A (ja) * | 2010-09-30 | 2012-04-19 | Advantest Corp | 変換器および測定装置 |
US8711657B2 (en) | 2010-09-30 | 2014-04-29 | Advantest Corporation | Converter and measuring apparatus |
JP5923205B1 (ja) * | 2015-07-07 | 2016-05-24 | 日立アロカメディカル株式会社 | 超音波探触子 |
WO2017006590A1 (ja) * | 2015-07-07 | 2017-01-12 | 株式会社日立製作所 | 超音波探触子 |
US10238365B2 (en) | 2015-07-07 | 2019-03-26 | Hitachi, Ltd. | Ultrasound probe |
KR20180068586A (ko) * | 2016-12-14 | 2018-06-22 | 삼성메디슨 주식회사 | 초음파 진단 장치용 프로브 |
Also Published As
Publication number | Publication date |
---|---|
FR2740933A1 (fr) | 1997-05-09 |
DE69603829D1 (de) | 1999-09-23 |
JP3766978B2 (ja) | 2006-04-19 |
KR980700894A (ko) | 1998-04-30 |
KR100414141B1 (ko) | 2004-03-30 |
WO1997017145A1 (fr) | 1997-05-15 |
EP0801595B1 (fr) | 1999-08-18 |
FR2740933B1 (fr) | 1997-11-28 |
EP0801595A1 (fr) | 1997-10-22 |
US6044533A (en) | 2000-04-04 |
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