JP2004095612A - 半導体装置及び配線基板 - Google Patents

半導体装置及び配線基板 Download PDF

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Publication number
JP2004095612A
JP2004095612A JP2002250934A JP2002250934A JP2004095612A JP 2004095612 A JP2004095612 A JP 2004095612A JP 2002250934 A JP2002250934 A JP 2002250934A JP 2002250934 A JP2002250934 A JP 2002250934A JP 2004095612 A JP2004095612 A JP 2004095612A
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JP
Japan
Prior art keywords
wiring board
semiconductor device
core material
bonding
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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JP2002250934A
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English (en)
Japanese (ja)
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JP2004095612A5 (enExample
Inventor
Takao Nishimura
西村　隆雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP2002250934A priority Critical patent/JP2004095612A/ja
Publication of JP2004095612A publication Critical patent/JP2004095612A/ja
Publication of JP2004095612A5 publication Critical patent/JP2004095612A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector

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  • Wire Bonding (AREA)
JP2002250934A 2002-08-29 2002-08-29 半導体装置及び配線基板 Pending JP2004095612A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002250934A JP2004095612A (ja) 2002-08-29 2002-08-29 半導体装置及び配線基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002250934A JP2004095612A (ja) 2002-08-29 2002-08-29 半導体装置及び配線基板

Publications (2)

Publication Number Publication Date
JP2004095612A true JP2004095612A (ja) 2004-03-25
JP2004095612A5 JP2004095612A5 (enExample) 2005-11-04

Family

ID=32057639

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002250934A Pending JP2004095612A (ja) 2002-08-29 2002-08-29 半導体装置及び配線基板

Country Status (1)

Country Link
JP (1) JP2004095612A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008135428A (ja) * 2006-11-27 2008-06-12 Matsushita Electric Ind Co Ltd 半導体装置と、これを用いた電子機器
JP2020136624A (ja) * 2019-02-26 2020-08-31 新日本無線株式会社 半導体装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008135428A (ja) * 2006-11-27 2008-06-12 Matsushita Electric Ind Co Ltd 半導体装置と、これを用いた電子機器
JP2020136624A (ja) * 2019-02-26 2020-08-31 新日本無線株式会社 半導体装置
JP7260220B2 (ja) 2019-02-26 2023-04-18 日清紡マイクロデバイス株式会社 半導体装置

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