JP2004095612A5 - - Google Patents

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Publication number
JP2004095612A5
JP2004095612A5 JP2002250934A JP2002250934A JP2004095612A5 JP 2004095612 A5 JP2004095612 A5 JP 2004095612A5 JP 2002250934 A JP2002250934 A JP 2002250934A JP 2002250934 A JP2002250934 A JP 2002250934A JP 2004095612 A5 JP2004095612 A5 JP 2004095612A5
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JP
Japan
Prior art keywords
core material
substrate core
semiconductor device
land
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002250934A
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English (en)
Japanese (ja)
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JP2004095612A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2002250934A priority Critical patent/JP2004095612A/ja
Priority claimed from JP2002250934A external-priority patent/JP2004095612A/ja
Publication of JP2004095612A publication Critical patent/JP2004095612A/ja
Publication of JP2004095612A5 publication Critical patent/JP2004095612A5/ja
Pending legal-status Critical Current

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JP2002250934A 2002-08-29 2002-08-29 半導体装置及び配線基板 Pending JP2004095612A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002250934A JP2004095612A (ja) 2002-08-29 2002-08-29 半導体装置及び配線基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002250934A JP2004095612A (ja) 2002-08-29 2002-08-29 半導体装置及び配線基板

Publications (2)

Publication Number Publication Date
JP2004095612A JP2004095612A (ja) 2004-03-25
JP2004095612A5 true JP2004095612A5 (enExample) 2005-11-04

Family

ID=32057639

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002250934A Pending JP2004095612A (ja) 2002-08-29 2002-08-29 半導体装置及び配線基板

Country Status (1)

Country Link
JP (1) JP2004095612A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4797950B2 (ja) * 2006-11-27 2011-10-19 パナソニック株式会社 半導体装置と、これを用いた電子機器
JP7260220B2 (ja) * 2019-02-26 2023-04-18 日清紡マイクロデバイス株式会社 半導体装置

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