JP2004075864A - 樹脂組成物 - Google Patents

樹脂組成物 Download PDF

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Publication number
JP2004075864A
JP2004075864A JP2002238712A JP2002238712A JP2004075864A JP 2004075864 A JP2004075864 A JP 2004075864A JP 2002238712 A JP2002238712 A JP 2002238712A JP 2002238712 A JP2002238712 A JP 2002238712A JP 2004075864 A JP2004075864 A JP 2004075864A
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JP
Japan
Prior art keywords
acid
compound
resin composition
butene
methyl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002238712A
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English (en)
Japanese (ja)
Other versions
JP2004075864A5 (cg-RX-API-DMAC7.html
Inventor
Iwao Hotta
堀田　巌
Aya Kodama
児玉　彩
Shigeru Murata
村田　繁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KH Neochem Co Ltd
Original Assignee
Kyowa Yuka Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyowa Yuka Co Ltd filed Critical Kyowa Yuka Co Ltd
Priority to JP2002238712A priority Critical patent/JP2004075864A/ja
Publication of JP2004075864A publication Critical patent/JP2004075864A/ja
Publication of JP2004075864A5 publication Critical patent/JP2004075864A5/ja
Pending legal-status Critical Current

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  • Epoxy Resins (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
JP2002238712A 2002-08-20 2002-08-20 樹脂組成物 Pending JP2004075864A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002238712A JP2004075864A (ja) 2002-08-20 2002-08-20 樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002238712A JP2004075864A (ja) 2002-08-20 2002-08-20 樹脂組成物

Publications (2)

Publication Number Publication Date
JP2004075864A true JP2004075864A (ja) 2004-03-11
JP2004075864A5 JP2004075864A5 (cg-RX-API-DMAC7.html) 2005-07-28

Family

ID=32022014

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002238712A Pending JP2004075864A (ja) 2002-08-20 2002-08-20 樹脂組成物

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JP (1) JP2004075864A (cg-RX-API-DMAC7.html)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006035926A1 (ja) * 2004-09-30 2006-04-06 Kyowa Hakko Chemical Co., Ltd. ポジ型液晶素子用フォトレジスト組成物
JP2007238781A (ja) * 2006-03-09 2007-09-20 Sumitomo Bakelite Co Ltd 液状封止樹脂組成物、及びそれを用いた半導体装置
JP2009096884A (ja) * 2007-10-17 2009-05-07 Nof Corp カラーフィルター保護膜用の熱硬化性樹脂組成物、およびカラーフィルター
JP2009149588A (ja) * 2007-12-21 2009-07-09 Tokyo Ohka Kogyo Co Ltd 新規な化合物およびその製造方法
JP2014040405A (ja) * 2012-07-24 2014-03-06 Sumitomo Chemical Co Ltd 塩、レジスト組成物及びレジストパターンの製造方法
US9034556B2 (en) 2007-12-21 2015-05-19 Tokyo Ohka Kogyo Co., Ltd. Compound and method of producing the same, acid generator, resist composition and method of forming resist pattern

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006035926A1 (ja) * 2004-09-30 2006-04-06 Kyowa Hakko Chemical Co., Ltd. ポジ型液晶素子用フォトレジスト組成物
JP2007238781A (ja) * 2006-03-09 2007-09-20 Sumitomo Bakelite Co Ltd 液状封止樹脂組成物、及びそれを用いた半導体装置
JP2009096884A (ja) * 2007-10-17 2009-05-07 Nof Corp カラーフィルター保護膜用の熱硬化性樹脂組成物、およびカラーフィルター
JP2009149588A (ja) * 2007-12-21 2009-07-09 Tokyo Ohka Kogyo Co Ltd 新規な化合物およびその製造方法
US9034556B2 (en) 2007-12-21 2015-05-19 Tokyo Ohka Kogyo Co., Ltd. Compound and method of producing the same, acid generator, resist composition and method of forming resist pattern
US9040220B2 (en) 2007-12-21 2015-05-26 Tokyo Ohka Kogyo Co., Ltd. Compound and method of producing the same, acid generator, resist composition and method of forming resist pattern
JP2014040405A (ja) * 2012-07-24 2014-03-06 Sumitomo Chemical Co Ltd 塩、レジスト組成物及びレジストパターンの製造方法

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