JP2004075864A5 - - Google Patents

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Publication number
JP2004075864A5
JP2004075864A5 JP2002238712A JP2002238712A JP2004075864A5 JP 2004075864 A5 JP2004075864 A5 JP 2004075864A5 JP 2002238712 A JP2002238712 A JP 2002238712A JP 2002238712 A JP2002238712 A JP 2002238712A JP 2004075864 A5 JP2004075864 A5 JP 2004075864A5
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JP
Japan
Prior art keywords
group
bis
oxazolin
methyl
oxazolinyl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002238712A
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English (en)
Japanese (ja)
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JP2004075864A (ja
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Publication date
Application filed filed Critical
Priority to JP2002238712A priority Critical patent/JP2004075864A/ja
Priority claimed from JP2002238712A external-priority patent/JP2004075864A/ja
Publication of JP2004075864A publication Critical patent/JP2004075864A/ja
Publication of JP2004075864A5 publication Critical patent/JP2004075864A5/ja
Pending legal-status Critical Current

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JP2002238712A 2002-08-20 2002-08-20 樹脂組成物 Pending JP2004075864A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002238712A JP2004075864A (ja) 2002-08-20 2002-08-20 樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002238712A JP2004075864A (ja) 2002-08-20 2002-08-20 樹脂組成物

Publications (2)

Publication Number Publication Date
JP2004075864A JP2004075864A (ja) 2004-03-11
JP2004075864A5 true JP2004075864A5 (cg-RX-API-DMAC7.html) 2005-07-28

Family

ID=32022014

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002238712A Pending JP2004075864A (ja) 2002-08-20 2002-08-20 樹脂組成物

Country Status (1)

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JP (1) JP2004075864A (cg-RX-API-DMAC7.html)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200622494A (en) * 2004-09-30 2006-07-01 Kyowa Hakko Chemical Co Ltd Photoresist composition for positive liquid crystal device
JP2007238781A (ja) * 2006-03-09 2007-09-20 Sumitomo Bakelite Co Ltd 液状封止樹脂組成物、及びそれを用いた半導体装置
JP4983532B2 (ja) * 2007-10-17 2012-07-25 日油株式会社 カラーフィルター保護膜用の熱硬化性樹脂組成物、およびカラーフィルター
US9034556B2 (en) 2007-12-21 2015-05-19 Tokyo Ohka Kogyo Co., Ltd. Compound and method of producing the same, acid generator, resist composition and method of forming resist pattern
JP5484671B2 (ja) * 2007-12-21 2014-05-07 東京応化工業株式会社 新規な化合物およびその製造方法
JP6107420B2 (ja) * 2012-07-24 2017-04-05 住友化学株式会社 塩、レジスト組成物及びレジストパターンの製造方法

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