JP2004031474A - 電子部品及びその製造方法 - Google Patents

電子部品及びその製造方法 Download PDF

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Publication number
JP2004031474A
JP2004031474A JP2002182562A JP2002182562A JP2004031474A JP 2004031474 A JP2004031474 A JP 2004031474A JP 2002182562 A JP2002182562 A JP 2002182562A JP 2002182562 A JP2002182562 A JP 2002182562A JP 2004031474 A JP2004031474 A JP 2004031474A
Authority
JP
Japan
Prior art keywords
solder
substrate
electronic component
chip
chip component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002182562A
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English (en)
Japanese (ja)
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JP2004031474A5 (enExample
Inventor
Katsuhiko Hayashi
林　克彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Priority to JP2002182562A priority Critical patent/JP2004031474A/ja
Publication of JP2004031474A publication Critical patent/JP2004031474A/ja
Publication of JP2004031474A5 publication Critical patent/JP2004031474A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps

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  • Wire Bonding (AREA)
JP2002182562A 2002-06-24 2002-06-24 電子部品及びその製造方法 Pending JP2004031474A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002182562A JP2004031474A (ja) 2002-06-24 2002-06-24 電子部品及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002182562A JP2004031474A (ja) 2002-06-24 2002-06-24 電子部品及びその製造方法

Publications (2)

Publication Number Publication Date
JP2004031474A true JP2004031474A (ja) 2004-01-29
JP2004031474A5 JP2004031474A5 (enExample) 2005-09-22

Family

ID=31179027

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002182562A Pending JP2004031474A (ja) 2002-06-24 2002-06-24 電子部品及びその製造方法

Country Status (1)

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JP (1) JP2004031474A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013094836A (ja) * 2011-11-02 2013-05-20 Mitsubishi Materials Corp プリコート用ハンダペースト及びその製造方法
JP2024144328A (ja) * 2023-03-28 2024-10-11 プロテック カンパニー リミテッド 柱状接続体の基板ボンディング方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8464348B2 (en) 2004-11-15 2013-06-11 Microsoft Corporation Isolated computing environment anchored into CPU and motherboard

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS512382A (enExample) * 1974-06-24 1976-01-09 Hitachi Ltd
JPS62266842A (ja) * 1986-05-15 1987-11-19 Oki Electric Ind Co Ltd 半導体装置及びその製造方法
JPH05235102A (ja) * 1992-02-26 1993-09-10 Toshiba Corp 半導体装置
JPH08115997A (ja) * 1994-10-13 1996-05-07 Hitachi Ltd 半導体装置及びその製造方法
JPH10173006A (ja) * 1996-12-09 1998-06-26 Hitachi Ltd 半導体装置および半導体装置の製造方法
JP2002151532A (ja) * 2000-11-08 2002-05-24 Sharp Corp 電子部品、半導体装置の実装方法および半導体装置の実装構造

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS512382A (enExample) * 1974-06-24 1976-01-09 Hitachi Ltd
JPS62266842A (ja) * 1986-05-15 1987-11-19 Oki Electric Ind Co Ltd 半導体装置及びその製造方法
JPH05235102A (ja) * 1992-02-26 1993-09-10 Toshiba Corp 半導体装置
JPH08115997A (ja) * 1994-10-13 1996-05-07 Hitachi Ltd 半導体装置及びその製造方法
JPH10173006A (ja) * 1996-12-09 1998-06-26 Hitachi Ltd 半導体装置および半導体装置の製造方法
JP2002151532A (ja) * 2000-11-08 2002-05-24 Sharp Corp 電子部品、半導体装置の実装方法および半導体装置の実装構造

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013094836A (ja) * 2011-11-02 2013-05-20 Mitsubishi Materials Corp プリコート用ハンダペースト及びその製造方法
JP2024144328A (ja) * 2023-03-28 2024-10-11 プロテック カンパニー リミテッド 柱状接続体の基板ボンディング方法
JP7805389B2 (ja) 2023-03-28 2026-01-23 プロテック カンパニー リミテッド 柱状接続体の基板ボンディング方法

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