JP2004031474A5 - - Google Patents

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Publication number
JP2004031474A5
JP2004031474A5 JP2002182562A JP2002182562A JP2004031474A5 JP 2004031474 A5 JP2004031474 A5 JP 2004031474A5 JP 2002182562 A JP2002182562 A JP 2002182562A JP 2002182562 A JP2002182562 A JP 2002182562A JP 2004031474 A5 JP2004031474 A5 JP 2004031474A5
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JP
Japan
Prior art keywords
solder
substrate
chip component
electrode
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002182562A
Other languages
English (en)
Japanese (ja)
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JP2004031474A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2002182562A priority Critical patent/JP2004031474A/ja
Priority claimed from JP2002182562A external-priority patent/JP2004031474A/ja
Publication of JP2004031474A publication Critical patent/JP2004031474A/ja
Publication of JP2004031474A5 publication Critical patent/JP2004031474A5/ja
Pending legal-status Critical Current

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JP2002182562A 2002-06-24 2002-06-24 電子部品及びその製造方法 Pending JP2004031474A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002182562A JP2004031474A (ja) 2002-06-24 2002-06-24 電子部品及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002182562A JP2004031474A (ja) 2002-06-24 2002-06-24 電子部品及びその製造方法

Publications (2)

Publication Number Publication Date
JP2004031474A JP2004031474A (ja) 2004-01-29
JP2004031474A5 true JP2004031474A5 (enExample) 2005-09-22

Family

ID=31179027

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002182562A Pending JP2004031474A (ja) 2002-06-24 2002-06-24 電子部品及びその製造方法

Country Status (1)

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JP (1) JP2004031474A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8464348B2 (en) 2004-11-15 2013-06-11 Microsoft Corporation Isolated computing environment anchored into CPU and motherboard

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013094836A (ja) * 2011-11-02 2013-05-20 Mitsubishi Materials Corp プリコート用ハンダペースト及びその製造方法
CN118737836A (zh) * 2023-03-28 2024-10-01 普罗科技有限公司 柱状连接体的基板接合方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS512382A (enExample) * 1974-06-24 1976-01-09 Hitachi Ltd
JPH0793341B2 (ja) * 1986-05-15 1995-10-09 沖電気工業株式会社 半導体装置及びその製造方法
JP3171477B2 (ja) * 1992-02-26 2001-05-28 株式会社東芝 半導体装置
JPH08115997A (ja) * 1994-10-13 1996-05-07 Hitachi Ltd 半導体装置及びその製造方法
JPH10173006A (ja) * 1996-12-09 1998-06-26 Hitachi Ltd 半導体装置および半導体装置の製造方法
JP2002151532A (ja) * 2000-11-08 2002-05-24 Sharp Corp 電子部品、半導体装置の実装方法および半導体装置の実装構造

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8464348B2 (en) 2004-11-15 2013-06-11 Microsoft Corporation Isolated computing environment anchored into CPU and motherboard

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