JP2004031474A5 - - Google Patents

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Publication number
JP2004031474A5
JP2004031474A5 JP2002182562A JP2002182562A JP2004031474A5 JP 2004031474 A5 JP2004031474 A5 JP 2004031474A5 JP 2002182562 A JP2002182562 A JP 2002182562A JP 2002182562 A JP2002182562 A JP 2002182562A JP 2004031474 A5 JP2004031474 A5 JP 2004031474A5
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Japan
Prior art keywords
solder
substrate
chip component
electrode
component
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Pending
Application number
JP2002182562A
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Japanese (ja)
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JP2004031474A (en
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Priority to JP2002182562A priority Critical patent/JP2004031474A/en
Priority claimed from JP2002182562A external-priority patent/JP2004031474A/en
Publication of JP2004031474A publication Critical patent/JP2004031474A/en
Publication of JP2004031474A5 publication Critical patent/JP2004031474A5/ja
Pending legal-status Critical Current

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Claims (12)

少なくとも、フリップチップのチップ部品と、基板とを含む電子部品であって、
前記チップ部品は、電極を含み、前記電極が前記基板に設けられた電極に、周囲を半田で覆ったコアボールからなる半田バンプで接続されており、
前記半田バンプは、前記コアボールを中心にして、前記基板の電極及び前記チップ部品の前記電極に向かって拡がっている、
電子部品。An electronic component including at least a flip-chip chip component and a substrate,
The chip component includes an electrode, and the electrode is connected to an electrode provided on the substrate by a solder bump made of a core ball whose periphery is covered with solder,
The solder bump extends around the core ball toward the electrode of the substrate and the electrode of the chip component.
Electronic components. 少なくとも、フリップチップのチップ部品と、基板とを含む電子部品であって、
前記チップ部品は、電極を含み、前記電極が前記基板に設けられた電極に、周囲を半田で覆ったコアボールからなる半田バンプで接続されており、
前記半田バンプは、前記コアボールを中心にして、前記基板の電極及び前記チップ部品の前記電極に向かって拡がる鼓状である、
電子部品。An electronic component including at least a flip-chip chip component and a substrate,
The chip component includes an electrode, and the electrode is connected to an electrode provided on the substrate by a solder bump made of a core ball whose periphery is covered with solder,
The solder bump has a drum shape that extends toward the electrode of the substrate and the electrode of the chip component around the core ball.
Electronic components. コアボールの周囲に、半田による導電膜を有する半田ボールを用いてチップ部品を基板に接続させた電子部品であって、
前記基板は、前記チップ部品と接続するための電極を有しており、前記電極上に前記半田ボールを搭載した後、熱処理により半田バンプを形成し、
前記チップ部品上の前記半田バンプと接続する電極に、予め半田を付着し、前記チップ部品を前記基板に搭載し、半田付けして得られた、
電子部品。An electronic component in which a chip component is connected to a substrate using a solder ball having a conductive film made of solder around a core ball,
The substrate has an electrode for connecting to the chip component, and after mounting the solder ball on the electrode, a solder bump is formed by heat treatment,
Solder was previously attached to the electrodes connected to the solder bumps on the chip component, and the chip component was mounted on the substrate and obtained by soldering.
Electronic components. コアボールの周囲に、半田による導電膜を有する半田ボールを用いてチップ部品を基板に接続させた電子部品であって、
前記基板の電極上に、前記半田ボールを搭載した後、熱処理により半田バンプを形成し、前記基板上の前記電極には予め半田が付着されており、
前記基板に前記チップ部品を搭載し、半田付けして得られた、
電子部品。An electronic component in which a chip component is connected to a substrate using a solder ball having a conductive film made of solder around a core ball,
After mounting the solder balls on the electrodes of the substrate, solder bumps are formed by heat treatment, and solder is previously attached to the electrodes on the substrate,
Obtained by mounting the chip component on the substrate and soldering,
Electronic components. 前記コアボールに、銅を用いた請求項１乃至３の何れかに記載の電子部品。  The electronic component according to claim 1, wherein copper is used for the core ball. 前記チップ部品上又は基板上のいずれか一方の電極に予め付着する半田は、半田ペーストである請求項１乃至４の何れかに記載の電子部品。  The electronic component according to any one of claims 1 to 4, wherein the solder previously attached to any one of the electrodes on the chip component or the substrate is a solder paste. 前記チップ部品上又は基板上いずれか一方の電極に予め付着する半田は、湿式又は乾式メッキ法を用いた又は半田ペーストを塗布後、熱処理した半田プリコートである請求項１乃至６の何れかに記載の電子部品。  7. The solder pre-attached to either one of the chip component and the electrode on the substrate is a solder precoat using a wet or dry plating method or heat-treated after applying a solder paste. Electronic components. コアボールの周囲に、半田による導電膜を有する半田ボールを用いてチップ部品を基板に接続させた電子部品の製造方法であって、
前記基板は、前記チップ部品と接続するための電極を有しており、前記電極上に前記半田ボールを搭載した後、熱処理により半田バンプを形成し、
前記チップ部品上の前記半田バンプと接続する電極に、予め半田を付着し、前記チップ部品を前記基板に搭載し、半田付けする、
工程を含む電子部品の製造方法。An electronic component manufacturing method in which a chip component is connected to a substrate using a solder ball having a conductive film made of solder around a core ball,
The substrate has an electrode for connecting to the chip component, and after mounting the solder ball on the electrode, a solder bump is formed by heat treatment,
Solder is previously attached to the electrodes connected to the solder bumps on the chip component, and the chip component is mounted on the substrate and soldered.
An electronic component manufacturing method including a process. コアボールの周囲に、半田による導電膜を有する半田ボールを用いてチップ部品を基板に接続させた電子部品の製造方法であって、
前記基板の電極上に、前記半田ボールを搭載した後、熱処理により半田バンプを形成し、前記基板上の前記電極には予め半田が付着されており、
前記基板に前記チップ部品を搭載し、半田付けする、
工程を含む電子部品の製造方法。An electronic component manufacturing method in which a chip component is connected to a substrate using a solder ball having a conductive film made of solder around a core ball,
After mounting the solder balls on the electrodes of the substrate, solder bumps are formed by heat treatment, and solder is previously attached to the electrodes on the substrate,
Mounting the chip component on the substrate and soldering;
An electronic component manufacturing method including a process. 前記コアボールに、銅を用いた請求項８又は９に記載の電子部品の製造方法。  The method for manufacturing an electronic component according to claim 8, wherein copper is used for the core ball. 前記チップ部品上又は基板上のいずれか一方の電極に予め付着する半田は、半田ペーストである請求項８乃至１０の何れかに記載の電子部品の製造方法。  The method of manufacturing an electronic component according to any one of claims 8 to 10, wherein the solder previously attached to one of the electrodes on the chip component or the substrate is a solder paste. 前記チップ部品上又は基板上いずれか一方の電極に予め付着する半田は、湿式又は乾式メッキ法を用いた又は半田ペーストを塗布後、熱処理した半田プリコートである請求項８乃至１１の何れかに記載の電子部品の製造方法。  The solder pre-attached to either one of the electrodes on the chip component or the substrate is a solder precoat using a wet or dry plating method or heat-treated after applying a solder paste. Manufacturing method for electronic parts.
JP2002182562A 2002-06-24 2002-06-24 Electronic component and manufacturing method therefor Pending JP2004031474A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002182562A JP2004031474A (en) 2002-06-24 2002-06-24 Electronic component and manufacturing method therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002182562A JP2004031474A (en) 2002-06-24 2002-06-24 Electronic component and manufacturing method therefor

Publications (2)

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JP2004031474A JP2004031474A (en) 2004-01-29
JP2004031474A5 true JP2004031474A5 (en) 2005-09-22

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JP2002182562A Pending JP2004031474A (en) 2002-06-24 2002-06-24 Electronic component and manufacturing method therefor

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8464348B2 (en) 2004-11-15 2013-06-11 Microsoft Corporation Isolated computing environment anchored into CPU and motherboard

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013094836A (en) * 2011-11-02 2013-05-20 Mitsubishi Materials Corp Solder paste for precoat and method of manufacturing the same

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS512382A (en) * 1974-06-24 1976-01-09 Hitachi Ltd
JPH0793341B2 (en) * 1986-05-15 1995-10-09 沖電気工業株式会社 Semiconductor device and manufacturing method thereof
JP3171477B2 (en) * 1992-02-26 2001-05-28 株式会社東芝 Semiconductor device
JPH08115997A (en) * 1994-10-13 1996-05-07 Hitachi Ltd Semiconductor device and its manufacture
JPH10173006A (en) * 1996-12-09 1998-06-26 Hitachi Ltd Semiconductor device and its manufacturing method
JP2002151532A (en) * 2000-11-08 2002-05-24 Sharp Corp Electronic component, method and structure for mounting semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8464348B2 (en) 2004-11-15 2013-06-11 Microsoft Corporation Isolated computing environment anchored into CPU and motherboard

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