JP2004006689A - 指紋センサダイと外部回路とを有する装置と、そのダイをその外部回路にワイヤボンディングする方法 - Google Patents

指紋センサダイと外部回路とを有する装置と、そのダイをその外部回路にワイヤボンディングする方法 Download PDF

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Publication number
JP2004006689A
JP2004006689A JP2003060533A JP2003060533A JP2004006689A JP 2004006689 A JP2004006689 A JP 2004006689A JP 2003060533 A JP2003060533 A JP 2003060533A JP 2003060533 A JP2003060533 A JP 2003060533A JP 2004006689 A JP2004006689 A JP 2004006689A
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JP
Japan
Prior art keywords
die
fingerprint sensor
external
wire
external circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003060533A
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English (en)
Japanese (ja)
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JP2004006689A5 (cg-RX-API-DMAC7.html
Inventor
Michael Manansala
マイケル　マナンサラ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of JP2004006689A publication Critical patent/JP2004006689A/ja
Publication of JP2004006689A5 publication Critical patent/JP2004006689A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
    • Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49174—Assembling terminal to elongated conductor
    • Y10T29/49176—Assembling terminal to elongated conductor with molding of electrically insulating material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49174—Assembling terminal to elongated conductor
    • Y10T29/49179—Assembling terminal to elongated conductor by metal fusion bonding

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  • Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Multimedia (AREA)
  • Theoretical Computer Science (AREA)
  • Image Input (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
  • Wire Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2003060533A 2002-03-09 2003-03-06 指紋センサダイと外部回路とを有する装置と、そのダイをその外部回路にワイヤボンディングする方法 Pending JP2004006689A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/094,954 US6653723B2 (en) 2002-03-09 2002-03-09 System for providing an open-cavity low profile encapsulated semiconductor package

Publications (2)

Publication Number Publication Date
JP2004006689A true JP2004006689A (ja) 2004-01-08
JP2004006689A5 JP2004006689A5 (cg-RX-API-DMAC7.html) 2005-03-17

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003060533A Pending JP2004006689A (ja) 2002-03-09 2003-03-06 指紋センサダイと外部回路とを有する装置と、そのダイをその外部回路にワイヤボンディングする方法

Country Status (5)

Country Link
US (2) US6653723B2 (cg-RX-API-DMAC7.html)
EP (1) EP1343109A3 (cg-RX-API-DMAC7.html)
JP (1) JP2004006689A (cg-RX-API-DMAC7.html)
KR (3) KR20030074287A (cg-RX-API-DMAC7.html)
CN (1) CN1291346C (cg-RX-API-DMAC7.html)

Cited By (4)

* Cited by examiner, † Cited by third party
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JP2008116366A (ja) * 2006-11-06 2008-05-22 Fujitsu Ltd 表面形状センサとその製造方法
WO2009113262A1 (ja) * 2008-03-11 2009-09-17 パナソニック株式会社 半導体デバイスおよび半導体デバイスの製造方法
EP2224271A2 (en) 2009-02-27 2010-09-01 Omron Corporation Light transmission module, electronic device, and manufacturing method of light transmission module
WO2013065729A1 (ja) * 2011-10-31 2013-05-10 アオイ電子株式会社 受光装置および受光装置の製造方法

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WO2009113262A1 (ja) * 2008-03-11 2009-09-17 パナソニック株式会社 半導体デバイスおよび半導体デバイスの製造方法
US8274125B2 (en) 2008-03-11 2012-09-25 Panasonic Corporation Semiconductor device and semiconductor device manufacturing method
EP2224271A2 (en) 2009-02-27 2010-09-01 Omron Corporation Light transmission module, electronic device, and manufacturing method of light transmission module
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