JP2003520283A - シラン改質砥粒を含有するｃｍｐ組成物 - Google Patents

シラン改質砥粒を含有するｃｍｐ組成物

Info

Publication number
JP2003520283A
JP2003520283A JP2001509432A JP2001509432A JP2003520283A JP 2003520283 A JP2003520283 A JP 2003520283A JP 2001509432 A JP2001509432 A JP 2001509432A JP 2001509432 A JP2001509432 A JP 2001509432A JP 2003520283 A JP2003520283 A JP 2003520283A
Authority
JP
Japan
Prior art keywords
silane
alkyl
hydrolyzable
group
chemical mechanical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2001509432A
Other languages
English (en)
Japanese (ja)
Inventor
ケー． グランバイン，スティーブン
シー． ストレインツ，クリストファー
ワン，シュミン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CMC Materials LLC
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Publication of JP2003520283A publication Critical patent/JP2003520283A/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1436—Composite particles, e.g. coated particles
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Composite Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Disintegrating Or Milling (AREA)
JP2001509432A 1999-07-07 2000-07-05 シラン改質砥粒を含有するｃｍｐ組成物 Withdrawn JP2003520283A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14270699P 1999-07-07 1999-07-07
US60/142,706 1999-07-07
PCT/US2000/018342 WO2001004226A2 (en) 1999-07-07 2000-07-05 Cmp composition containing silane modified abrasive particles

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2006306726A Division JP2007088499A (ja) 1999-07-07 2006-11-13 シラン改質砥粒を含有するｃｍｐ組成物

Publications (1)

Publication Number Publication Date
JP2003520283A true JP2003520283A (ja) 2003-07-02

Family

ID=22500954

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2001509432A Withdrawn JP2003520283A (ja) 1999-07-07 2000-07-05 シラン改質砥粒を含有するｃｍｐ組成物
JP2006306726A Withdrawn JP2007088499A (ja) 1999-07-07 2006-11-13 シラン改質砥粒を含有するｃｍｐ組成物

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2006306726A Withdrawn JP2007088499A (ja) 1999-07-07 2006-11-13 シラン改質砥粒を含有するｃｍｐ組成物

Country Status (14)

Country Link
US (2) US6582623B1 (cg-RX-API-DMAC7.html)
EP (1) EP1200532B1 (cg-RX-API-DMAC7.html)
JP (2) JP2003520283A (cg-RX-API-DMAC7.html)
KR (1) KR100590665B1 (cg-RX-API-DMAC7.html)
CN (1) CN1209429C (cg-RX-API-DMAC7.html)
AT (1) ATE338100T1 (cg-RX-API-DMAC7.html)
AU (1) AU5785700A (cg-RX-API-DMAC7.html)
CA (1) CA2378492A1 (cg-RX-API-DMAC7.html)
DE (1) DE60030444T2 (cg-RX-API-DMAC7.html)
HK (1) HK1046151A1 (cg-RX-API-DMAC7.html)
IL (1) IL147039A0 (cg-RX-API-DMAC7.html)
MY (1) MY126717A (cg-RX-API-DMAC7.html)
TW (1) TW538110B (cg-RX-API-DMAC7.html)
WO (1) WO2001004226A2 (cg-RX-API-DMAC7.html)

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JP2011518051A (ja) * 2008-04-18 2011-06-23 サンーゴバン アブレイシブズ，インコーポレイティド 砥粒の親水性および疎水性シラン表面改質
JP2012515806A (ja) * 2009-01-20 2012-07-12 キャボット コーポレイション シラン変性金属酸化物を含む組成物
JP2013520547A (ja) * 2010-02-24 2013-06-06 ビーエーエスエフ ソシエタス・ヨーロピア 研磨物品、その製造方法及びその使用方法
JP2014130944A (ja) * 2012-12-28 2014-07-10 Fujimi Inc 研磨用組成物
KR20160023723A (ko) * 2013-06-24 2016-03-03 쓰리엠 이노베이티브 프로퍼티즈 컴파니 연마 입자, 연마 입자의 제조 방법, 및 연마 용품
JP2017092373A (ja) * 2015-11-16 2017-05-25 信越化学工業株式会社 研磨組成物及び研磨方法
JP2019196467A (ja) * 2018-05-11 2019-11-14 日立化成株式会社 Ｃｍｐ研磨剤及びその製造方法、並びにｃｍｐ研磨方法
KR20210111643A (ko) * 2020-03-03 2021-09-13 삼성에스디아이 주식회사 구리 연마용 ｃｍｐ 슬러리 조성물 및 이를 이용한 구리 막 연마 방법

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