HK1046151A1 - 含硅烷改性研磨颗粒的化学机械抛光(cmp)组合物 - Google Patents

含硅烷改性研磨颗粒的化学机械抛光(cmp)组合物 Download PDF

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Publication number
HK1046151A1
HK1046151A1 HK02107771.8A HK02107771A HK1046151A1 HK 1046151 A1 HK1046151 A1 HK 1046151A1 HK 02107771 A HK02107771 A HK 02107771A HK 1046151 A1 HK1046151 A1 HK 1046151A1
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HK
Hong Kong
Prior art keywords
silane
group
alkyl
hydrolyzable
mixtures
Prior art date
Application number
HK02107771.8A
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English (en)
Chinese (zh)
Inventor
史蒂文‧K‧格鲁姆宾
史蒂文‧K‧格魯姆賓
克里斯托弗‧C‧斯特赖恩兹
王淑敏
克里斯托弗‧C‧斯特賴恩茲
Original Assignee
卡伯特微电子公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 卡伯特微电子公司 filed Critical 卡伯特微电子公司
Publication of HK1046151A1 publication Critical patent/HK1046151A1/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1436—Composite particles, e.g. coated particles
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Composite Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Disintegrating Or Milling (AREA)
HK02107771.8A 1999-07-07 2000-07-05 含硅烷改性研磨颗粒的化学机械抛光(cmp)组合物 HK1046151A1 (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14270699P 1999-07-07 1999-07-07
US60/142,706 1999-07-07
PCT/US2000/018342 WO2001004226A2 (en) 1999-07-07 2000-07-05 Cmp composition containing silane modified abrasive particles

Publications (1)

Publication Number Publication Date
HK1046151A1 true HK1046151A1 (zh) 2002-12-27

Family

ID=22500954

Family Applications (1)

Application Number Title Priority Date Filing Date
HK02107771.8A HK1046151A1 (zh) 1999-07-07 2000-07-05 含硅烷改性研磨颗粒的化学机械抛光(cmp)组合物

Country Status (14)

Country Link
US (2) US6582623B1 (cg-RX-API-DMAC7.html)
EP (1) EP1200532B1 (cg-RX-API-DMAC7.html)
JP (2) JP2003520283A (cg-RX-API-DMAC7.html)
KR (1) KR100590665B1 (cg-RX-API-DMAC7.html)
CN (1) CN1209429C (cg-RX-API-DMAC7.html)
AT (1) ATE338100T1 (cg-RX-API-DMAC7.html)
AU (1) AU5785700A (cg-RX-API-DMAC7.html)
CA (1) CA2378492A1 (cg-RX-API-DMAC7.html)
DE (1) DE60030444T2 (cg-RX-API-DMAC7.html)
HK (1) HK1046151A1 (cg-RX-API-DMAC7.html)
IL (1) IL147039A0 (cg-RX-API-DMAC7.html)
MY (1) MY126717A (cg-RX-API-DMAC7.html)
TW (1) TW538110B (cg-RX-API-DMAC7.html)
WO (1) WO2001004226A2 (cg-RX-API-DMAC7.html)

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KR102765056B1 (ko) * 2021-10-21 2025-02-06 한남대학교 산학협력단 화학-기계적 연마 슬러리용 무기산화물 입자의 산화제 기능화를 위한 실란 링커의 제조방법
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