JP2003514121A - 電極表面質の検査方法 - Google Patents
電極表面質の検査方法Info
- Publication number
- JP2003514121A JP2003514121A JP2001536564A JP2001536564A JP2003514121A JP 2003514121 A JP2003514121 A JP 2003514121A JP 2001536564 A JP2001536564 A JP 2001536564A JP 2001536564 A JP2001536564 A JP 2001536564A JP 2003514121 A JP2003514121 A JP 2003514121A
- Authority
- JP
- Japan
- Prior art keywords
- cathode
- light source
- image
- camera
- illuminated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000000034 method Methods 0.000 title claims abstract description 37
- 238000007689 inspection Methods 0.000 title claims description 24
- 239000002184 metal Substances 0.000 claims abstract description 13
- 229910052751 metal Inorganic materials 0.000 claims abstract description 13
- 238000005868 electrolysis reaction Methods 0.000 claims description 3
- 229910052736 halogen Inorganic materials 0.000 claims description 2
- 150000002367 halogens Chemical class 0.000 claims description 2
- 230000005856 abnormality Effects 0.000 abstract description 4
- 239000003792 electrolyte Substances 0.000 description 8
- 230000002159 abnormal effect Effects 0.000 description 5
- 239000012535 impurity Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000005137 deposition process Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000002547 anomalous effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004590 computer program Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/8422—Investigating thin films, e.g. matrix isolation method
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
- G01N2021/8822—Dark field detection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
- G01N2021/8829—Shadow projection or structured background, e.g. for deflectometry
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Pathology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- Health & Medical Sciences (AREA)
- Immunology (AREA)
- General Health & Medical Sciences (AREA)
- Mathematical Physics (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Electrolytic Production Of Metals (AREA)
- Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
- Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FI992406A FI107192B (fi) | 1999-11-09 | 1999-11-09 | Menetelmä elektrodin pinnanlaadun tarkistamiseksi |
| FI19992406 | 1999-11-09 | ||
| PCT/FI2000/000932 WO2001035083A1 (en) | 1999-11-09 | 2000-10-27 | Method for inspecting electrode surface quality |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003514121A true JP2003514121A (ja) | 2003-04-15 |
| JP2003514121A5 JP2003514121A5 (enExample) | 2007-12-06 |
Family
ID=8555574
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001536564A Abandoned JP2003514121A (ja) | 1999-11-09 | 2000-10-27 | 電極表面質の検査方法 |
Country Status (16)
| Country | Link |
|---|---|
| US (1) | US6646733B1 (enExample) |
| EP (1) | EP1228360A1 (enExample) |
| JP (1) | JP2003514121A (enExample) |
| KR (1) | KR100816703B1 (enExample) |
| CN (1) | CN100409000C (enExample) |
| AU (1) | AU778924B2 (enExample) |
| BG (1) | BG64999B1 (enExample) |
| BR (1) | BR0015345B1 (enExample) |
| CA (1) | CA2390536C (enExample) |
| EA (1) | EA008366B1 (enExample) |
| FI (1) | FI107192B (enExample) |
| MX (1) | MXPA02004567A (enExample) |
| PE (1) | PE20010857A1 (enExample) |
| PL (1) | PL356130A1 (enExample) |
| WO (1) | WO2001035083A1 (enExample) |
| ZA (1) | ZA200203247B (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FI112383B (fi) * | 2001-06-25 | 2003-11-28 | Outokumpu Oy | Menetelmä katodin laadun parantamiseksi elektrolyysissä |
| US8594417B2 (en) | 2007-11-27 | 2013-11-26 | Alcoa Inc. | Systems and methods for inspecting anodes and smelting management relating to the same |
| KR101013612B1 (ko) * | 2008-11-21 | 2011-02-10 | 엘에스니꼬동제련 주식회사 | 전해 정련된 금속석출판 표면 검사장치 |
| FI20135688A7 (fi) * | 2013-06-24 | 2014-12-25 | Outotec Finland Oy | Menetelmä ja järjestely metallien elektrolyyttistä raffinointia varten valettujen anodien valmistamiseksi elektrolyyttistä raffinointivaihetta varten |
| CN109103118A (zh) * | 2017-06-21 | 2018-12-28 | 致茂电子(苏州)有限公司 | 太阳能电池的检测方法与检测系统 |
| TWI639829B (zh) | 2017-06-21 | 2018-11-01 | 致茂電子股份有限公司 | 太陽能電池的檢測方法與檢測系統 |
| JP6876576B2 (ja) * | 2017-08-17 | 2021-05-26 | 日本電子株式会社 | 三次元像構築方法 |
| CN108335296B (zh) * | 2018-02-28 | 2021-10-01 | 中际山河科技有限责任公司 | 一种极板识别装置及方法 |
| CN110205653B (zh) * | 2019-06-14 | 2020-10-16 | 中国环境科学研究院 | 一种铅基阳极表面阳极泥智能识别及无损干除方法及系统 |
| CN112864034B (zh) * | 2019-11-27 | 2023-09-01 | 上海先进半导体制造有限公司 | 铝腐蚀的处理方法及系统 |
| KR20230056313A (ko) * | 2021-10-20 | 2023-04-27 | 주식회사 엘지에너지솔루션 | 전극 표면 검사 장치 |
| CN115165890A (zh) * | 2022-06-06 | 2022-10-11 | 云南铜业股份有限公司西南铜业分公司 | 一种沉积阴极铜表面特征性缺陷检测装置及方法 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SU482658A1 (ru) * | 1972-05-03 | 1975-08-30 | Институт электрохимии АН СССР | Способ определени структурных параметров пористых электродов |
| US4498960A (en) * | 1982-11-01 | 1985-02-12 | General Electric Company | Electrochemical method for visual detection of nonmetallic surface inclusions in metallic substrates |
| DE3431148A1 (de) | 1984-08-24 | 1986-03-06 | Klöckner-Humboldt-Deutz AG, 5000 Köln | Verfahren und vorrichtung zum entfernen von badmaterialresten an anodenresten |
| DE3837290A1 (de) * | 1988-11-03 | 1990-07-05 | Heraeus Elektroden | Pruefung von elektroden mit aktivierungsschichten |
| BE1003136A3 (nl) * | 1990-03-23 | 1991-12-03 | Icos Vision Systems Nv | Werkwijze en inrichting voor het bepalen van een positie van ten minste een aansluitpen van een elektronische component. |
| EP0586702A4 (en) * | 1991-04-29 | 1994-06-01 | N Proizv Predprivatie Novatekh | Electric arc evaporator of metals |
| JPH08313544A (ja) * | 1995-05-24 | 1996-11-29 | Hitachi Ltd | 電子顕微鏡及びこれを用いた試料観察方法 |
| US5614722A (en) * | 1995-11-01 | 1997-03-25 | University Of Louisville Research Foundation, Inc. | Radiation detector based on charge amplification in a gaseous medium |
| US5774224A (en) * | 1997-01-24 | 1998-06-30 | International Business Machines Corporation | Linear-scanning, oblique-viewing optical apparatus |
| JPH11148807A (ja) * | 1997-07-29 | 1999-06-02 | Toshiba Corp | バンプ高さ測定方法及びバンプ高さ測定装置 |
| JP3272998B2 (ja) * | 1997-09-30 | 2002-04-08 | イビデン株式会社 | バンプ高さ良否判定装置 |
| JPH11111174A (ja) * | 1997-10-03 | 1999-04-23 | Sony Corp | 電子銃の位置ずれ検出方法及び検出装置 |
| US5951372A (en) * | 1997-11-14 | 1999-09-14 | Lucent Technologies Inc. | Method of roughing a metallic surface of a semiconductor deposition tool |
| JP3724949B2 (ja) * | 1998-05-15 | 2005-12-07 | 株式会社東芝 | 基板検査装置およびこれを備えた基板検査システム並びに基板検査方法 |
-
1999
- 1999-11-09 FI FI992406A patent/FI107192B/fi not_active IP Right Cessation
-
2000
- 2000-10-20 PE PE2000001130A patent/PE20010857A1/es not_active Application Discontinuation
- 2000-10-27 WO PCT/FI2000/000932 patent/WO2001035083A1/en not_active Ceased
- 2000-10-27 EA EA200200543A patent/EA008366B1/ru not_active IP Right Cessation
- 2000-10-27 EP EP00972931A patent/EP1228360A1/en not_active Withdrawn
- 2000-10-27 KR KR1020027005949A patent/KR100816703B1/ko not_active Expired - Fee Related
- 2000-10-27 JP JP2001536564A patent/JP2003514121A/ja not_active Abandoned
- 2000-10-27 BR BRPI0015345-1A patent/BR0015345B1/pt not_active IP Right Cessation
- 2000-10-27 MX MXPA02004567A patent/MXPA02004567A/es active IP Right Grant
- 2000-10-27 CA CA002390536A patent/CA2390536C/en not_active Expired - Lifetime
- 2000-10-27 AU AU11489/01A patent/AU778924B2/en not_active Ceased
- 2000-10-27 US US10/129,869 patent/US6646733B1/en not_active Expired - Fee Related
- 2000-10-27 PL PL00356130A patent/PL356130A1/xx not_active Application Discontinuation
- 2000-10-27 CN CNB008154767A patent/CN100409000C/zh not_active Expired - Lifetime
-
2002
- 2002-04-24 BG BG106643A patent/BG64999B1/bg unknown
- 2002-04-24 ZA ZA200203247A patent/ZA200203247B/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| PE20010857A1 (es) | 2001-08-21 |
| FI107192B (fi) | 2001-06-15 |
| EA200200543A1 (ru) | 2002-10-31 |
| PL356130A1 (en) | 2004-06-14 |
| ZA200203247B (en) | 2002-11-28 |
| CA2390536C (en) | 2009-09-15 |
| BG64999B1 (bg) | 2006-11-30 |
| KR100816703B1 (ko) | 2008-03-27 |
| BR0015345B1 (pt) | 2011-01-25 |
| CN100409000C (zh) | 2008-08-06 |
| MXPA02004567A (es) | 2002-09-02 |
| BG106643A (en) | 2003-04-30 |
| CN1531648A (zh) | 2004-09-22 |
| KR20020053844A (ko) | 2002-07-05 |
| EP1228360A1 (en) | 2002-08-07 |
| CA2390536A1 (en) | 2001-05-17 |
| EA008366B1 (ru) | 2007-04-27 |
| AU1148901A (en) | 2001-06-06 |
| BR0015345A (pt) | 2002-06-25 |
| AU778924B2 (en) | 2004-12-23 |
| WO2001035083A1 (en) | 2001-05-17 |
| US6646733B1 (en) | 2003-11-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20071015 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20071015 |
|
| A762 | Written abandonment of application |
Free format text: JAPANESE INTERMEDIATE CODE: A762 Effective date: 20101022 |