FI107192B - Menetelmä elektrodin pinnanlaadun tarkistamiseksi - Google Patents
Menetelmä elektrodin pinnanlaadun tarkistamiseksi Download PDFInfo
- Publication number
- FI107192B FI107192B FI992406A FI992406A FI107192B FI 107192 B FI107192 B FI 107192B FI 992406 A FI992406 A FI 992406A FI 992406 A FI992406 A FI 992406A FI 107192 B FI107192 B FI 107192B
- Authority
- FI
- Finland
- Prior art keywords
- cathode
- camera
- light source
- plane
- image
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 26
- 239000002244 precipitate Substances 0.000 claims description 13
- 238000005868 electrolysis reaction Methods 0.000 claims description 4
- 229910052736 halogen Inorganic materials 0.000 claims description 2
- 150000002367 halogens Chemical class 0.000 claims description 2
- 241000406668 Loxodonta cyclotis Species 0.000 claims 1
- 238000007689 inspection Methods 0.000 description 18
- 239000002184 metal Substances 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000003792 electrolyte Substances 0.000 description 6
- 239000012535 impurity Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 238000001556 precipitation Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004590 computer program Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000003203 everyday effect Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/8422—Investigating thin films, e.g. matrix isolation method
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
- G01N2021/8822—Dark field detection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
- G01N2021/8829—Shadow projection or structured background, e.g. for deflectometry
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Pathology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- Health & Medical Sciences (AREA)
- Immunology (AREA)
- General Health & Medical Sciences (AREA)
- Mathematical Physics (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Electrolytic Production Of Metals (AREA)
- Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
- Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
Priority Applications (16)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FI992406A FI107192B (fi) | 1999-11-09 | 1999-11-09 | Menetelmä elektrodin pinnanlaadun tarkistamiseksi |
| PE2000001130A PE20010857A1 (es) | 1999-11-09 | 2000-10-20 | Metodo para inspeccionar la calidad de la superficie de un electrodo |
| KR1020027005949A KR100816703B1 (ko) | 1999-11-09 | 2000-10-27 | 전극의 표면 품질 검사 방법 |
| MXPA02004567A MXPA02004567A (es) | 1999-11-09 | 2000-10-27 | Metodo para inspeccionar la calidad de la superficie de un electrodo. |
| EA200200543A EA008366B1 (ru) | 1999-11-09 | 2000-10-27 | Способ контроля качества поверхности электрода |
| CNB008154767A CN100409000C (zh) | 1999-11-09 | 2000-10-27 | 检验电极表面质量的方法 |
| JP2001536564A JP2003514121A (ja) | 1999-11-09 | 2000-10-27 | 電極表面質の検査方法 |
| BRPI0015345-1A BR0015345B1 (pt) | 1999-11-09 | 2000-10-27 | processo para inspecionar a qualidade superficial de um eletrodo. |
| CA002390536A CA2390536C (en) | 1999-11-09 | 2000-10-27 | Method for inspecting electrode surface quality |
| PCT/FI2000/000932 WO2001035083A1 (en) | 1999-11-09 | 2000-10-27 | Method for inspecting electrode surface quality |
| US10/129,869 US6646733B1 (en) | 1999-11-09 | 2000-10-27 | Method for inspecting electrode surface quality |
| AU11489/01A AU778924B2 (en) | 1999-11-09 | 2000-10-27 | Method for inspecting electrode surface quality |
| EP00972931A EP1228360A1 (en) | 1999-11-09 | 2000-10-27 | Method for inspecting electrode surface quality |
| PL00356130A PL356130A1 (en) | 1999-11-09 | 2000-10-27 | Method for inspecting electrode surface quality |
| BG106643A BG64999B1 (bg) | 1999-11-09 | 2002-04-24 | Метод за контролиране качеството на повърхността на електрода |
| ZA200203247A ZA200203247B (en) | 1999-11-09 | 2002-04-24 | Method for inspecting electrode surface quality. |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FI992406 | 1999-11-09 | ||
| FI992406A FI107192B (fi) | 1999-11-09 | 1999-11-09 | Menetelmä elektrodin pinnanlaadun tarkistamiseksi |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| FI107192B true FI107192B (fi) | 2001-06-15 |
Family
ID=8555574
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FI992406A FI107192B (fi) | 1999-11-09 | 1999-11-09 | Menetelmä elektrodin pinnanlaadun tarkistamiseksi |
Country Status (16)
| Country | Link |
|---|---|
| US (1) | US6646733B1 (enExample) |
| EP (1) | EP1228360A1 (enExample) |
| JP (1) | JP2003514121A (enExample) |
| KR (1) | KR100816703B1 (enExample) |
| CN (1) | CN100409000C (enExample) |
| AU (1) | AU778924B2 (enExample) |
| BG (1) | BG64999B1 (enExample) |
| BR (1) | BR0015345B1 (enExample) |
| CA (1) | CA2390536C (enExample) |
| EA (1) | EA008366B1 (enExample) |
| FI (1) | FI107192B (enExample) |
| MX (1) | MXPA02004567A (enExample) |
| PE (1) | PE20010857A1 (enExample) |
| PL (1) | PL356130A1 (enExample) |
| WO (1) | WO2001035083A1 (enExample) |
| ZA (1) | ZA200203247B (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FI112383B (fi) * | 2001-06-25 | 2003-11-28 | Outokumpu Oy | Menetelmä katodin laadun parantamiseksi elektrolyysissä |
| US8594417B2 (en) | 2007-11-27 | 2013-11-26 | Alcoa Inc. | Systems and methods for inspecting anodes and smelting management relating to the same |
| KR101013612B1 (ko) * | 2008-11-21 | 2011-02-10 | 엘에스니꼬동제련 주식회사 | 전해 정련된 금속석출판 표면 검사장치 |
| FI20135688A7 (fi) * | 2013-06-24 | 2014-12-25 | Outotec Finland Oy | Menetelmä ja järjestely metallien elektrolyyttistä raffinointia varten valettujen anodien valmistamiseksi elektrolyyttistä raffinointivaihetta varten |
| TWI639829B (zh) | 2017-06-21 | 2018-11-01 | 致茂電子股份有限公司 | 太陽能電池的檢測方法與檢測系統 |
| CN109103118A (zh) * | 2017-06-21 | 2018-12-28 | 致茂电子(苏州)有限公司 | 太阳能电池的检测方法与检测系统 |
| JP6876576B2 (ja) * | 2017-08-17 | 2021-05-26 | 日本電子株式会社 | 三次元像構築方法 |
| CN108335296B (zh) * | 2018-02-28 | 2021-10-01 | 中际山河科技有限责任公司 | 一种极板识别装置及方法 |
| CN110205653B (zh) * | 2019-06-14 | 2020-10-16 | 中国环境科学研究院 | 一种铅基阳极表面阳极泥智能识别及无损干除方法及系统 |
| CN112864034B (zh) * | 2019-11-27 | 2023-09-01 | 上海先进半导体制造有限公司 | 铝腐蚀的处理方法及系统 |
| KR20230056313A (ko) * | 2021-10-20 | 2023-04-27 | 주식회사 엘지에너지솔루션 | 전극 표면 검사 장치 |
| CN115165890A (zh) * | 2022-06-06 | 2022-10-11 | 云南铜业股份有限公司西南铜业分公司 | 一种沉积阴极铜表面特征性缺陷检测装置及方法 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SU482658A1 (ru) * | 1972-05-03 | 1975-08-30 | Институт электрохимии АН СССР | Способ определени структурных параметров пористых электродов |
| US4498960A (en) * | 1982-11-01 | 1985-02-12 | General Electric Company | Electrochemical method for visual detection of nonmetallic surface inclusions in metallic substrates |
| DE3431148A1 (de) | 1984-08-24 | 1986-03-06 | Klöckner-Humboldt-Deutz AG, 5000 Köln | Verfahren und vorrichtung zum entfernen von badmaterialresten an anodenresten |
| DE3837290A1 (de) * | 1988-11-03 | 1990-07-05 | Heraeus Elektroden | Pruefung von elektroden mit aktivierungsschichten |
| BE1003136A3 (nl) * | 1990-03-23 | 1991-12-03 | Icos Vision Systems Nv | Werkwijze en inrichting voor het bepalen van een positie van ten minste een aansluitpen van een elektronische component. |
| EP0586702A4 (en) * | 1991-04-29 | 1994-06-01 | N Proizv Predprivatie Novatekh | Electric arc evaporator of metals |
| JPH08313544A (ja) * | 1995-05-24 | 1996-11-29 | Hitachi Ltd | 電子顕微鏡及びこれを用いた試料観察方法 |
| US5614722A (en) * | 1995-11-01 | 1997-03-25 | University Of Louisville Research Foundation, Inc. | Radiation detector based on charge amplification in a gaseous medium |
| US5774224A (en) * | 1997-01-24 | 1998-06-30 | International Business Machines Corporation | Linear-scanning, oblique-viewing optical apparatus |
| JPH11148807A (ja) * | 1997-07-29 | 1999-06-02 | Toshiba Corp | バンプ高さ測定方法及びバンプ高さ測定装置 |
| JP3272998B2 (ja) * | 1997-09-30 | 2002-04-08 | イビデン株式会社 | バンプ高さ良否判定装置 |
| JPH11111174A (ja) * | 1997-10-03 | 1999-04-23 | Sony Corp | 電子銃の位置ずれ検出方法及び検出装置 |
| US5951372A (en) * | 1997-11-14 | 1999-09-14 | Lucent Technologies Inc. | Method of roughing a metallic surface of a semiconductor deposition tool |
| JP3724949B2 (ja) * | 1998-05-15 | 2005-12-07 | 株式会社東芝 | 基板検査装置およびこれを備えた基板検査システム並びに基板検査方法 |
-
1999
- 1999-11-09 FI FI992406A patent/FI107192B/fi not_active IP Right Cessation
-
2000
- 2000-10-20 PE PE2000001130A patent/PE20010857A1/es not_active Application Discontinuation
- 2000-10-27 PL PL00356130A patent/PL356130A1/xx not_active Application Discontinuation
- 2000-10-27 BR BRPI0015345-1A patent/BR0015345B1/pt not_active IP Right Cessation
- 2000-10-27 US US10/129,869 patent/US6646733B1/en not_active Expired - Fee Related
- 2000-10-27 KR KR1020027005949A patent/KR100816703B1/ko not_active Expired - Fee Related
- 2000-10-27 WO PCT/FI2000/000932 patent/WO2001035083A1/en not_active Ceased
- 2000-10-27 EP EP00972931A patent/EP1228360A1/en not_active Withdrawn
- 2000-10-27 CA CA002390536A patent/CA2390536C/en not_active Expired - Lifetime
- 2000-10-27 EA EA200200543A patent/EA008366B1/ru not_active IP Right Cessation
- 2000-10-27 MX MXPA02004567A patent/MXPA02004567A/es active IP Right Grant
- 2000-10-27 JP JP2001536564A patent/JP2003514121A/ja not_active Abandoned
- 2000-10-27 AU AU11489/01A patent/AU778924B2/en not_active Ceased
- 2000-10-27 CN CNB008154767A patent/CN100409000C/zh not_active Expired - Lifetime
-
2002
- 2002-04-24 BG BG106643A patent/BG64999B1/bg unknown
- 2002-04-24 ZA ZA200203247A patent/ZA200203247B/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CA2390536C (en) | 2009-09-15 |
| AU778924B2 (en) | 2004-12-23 |
| EA008366B1 (ru) | 2007-04-27 |
| EP1228360A1 (en) | 2002-08-07 |
| EA200200543A1 (ru) | 2002-10-31 |
| JP2003514121A (ja) | 2003-04-15 |
| WO2001035083A1 (en) | 2001-05-17 |
| ZA200203247B (en) | 2002-11-28 |
| CN1531648A (zh) | 2004-09-22 |
| US6646733B1 (en) | 2003-11-11 |
| CN100409000C (zh) | 2008-08-06 |
| PE20010857A1 (es) | 2001-08-21 |
| PL356130A1 (en) | 2004-06-14 |
| MXPA02004567A (es) | 2002-09-02 |
| KR20020053844A (ko) | 2002-07-05 |
| CA2390536A1 (en) | 2001-05-17 |
| BG106643A (en) | 2003-04-30 |
| BR0015345A (pt) | 2002-06-25 |
| BG64999B1 (bg) | 2006-11-30 |
| KR100816703B1 (ko) | 2008-03-27 |
| BR0015345B1 (pt) | 2011-01-25 |
| AU1148901A (en) | 2001-06-06 |
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| Stout | Visual Inspection |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PC | Transfer of assignment of patent |
Owner name: OUTOTEC OYJ Free format text: OUTOTEC OYJ |
|
| MM | Patent lapsed |