JP2003318448A5 - - Google Patents

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JP2003318448A5
JP2003318448A5 JP2003040712A JP2003040712A JP2003318448A5 JP 2003318448 A5 JP2003318448 A5 JP 2003318448A5 JP 2003040712 A JP2003040712 A JP 2003040712A JP 2003040712 A JP2003040712 A JP 2003040712A JP 2003318448 A5 JP2003318448 A5 JP 2003318448A5
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JP2003040712A
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JP2003318448A (ja
JP4269709B2 (ja
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JP2003040712A 2002-02-19 2003-02-19 発光装置およびその製造方法 Expired - Lifetime JP4269709B2 (ja)

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JP2003040712A JP4269709B2 (ja) 2002-02-19 2003-02-19 発光装置およびその製造方法

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JP2002041192 2002-02-19
JP2002-41192 2002-02-19
JP2003040712A JP4269709B2 (ja) 2002-02-19 2003-02-19 発光装置およびその製造方法

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JP2003318448A JP2003318448A (ja) 2003-11-07
JP2003318448A5 true JP2003318448A5 (enExample) 2006-03-16
JP4269709B2 JP4269709B2 (ja) 2009-05-27

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7775685B2 (en) 2003-05-27 2010-08-17 Cree, Inc. Power surface mount light emitting die package
US8637883B2 (en) 2008-03-19 2014-01-28 Cree, Inc. Low index spacer layer in LED devices
US8710514B2 (en) 2002-09-04 2014-04-29 Cree, Inc. Power surface mount light emitting die package

Families Citing this family (104)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7264378B2 (en) * 2002-09-04 2007-09-04 Cree, Inc. Power surface mount light emitting die package
US7183587B2 (en) 2003-09-09 2007-02-27 Cree, Inc. Solid metal block mounting substrates for semiconductor light emitting devices
US7915085B2 (en) 2003-09-18 2011-03-29 Cree, Inc. Molded chip fabrication method
JP3963460B2 (ja) * 2003-10-08 2007-08-22 スタンレー電気株式会社 Ｌｅｄランプ用パッケージおよび該ｌｅｄランプ用パッケージを具備するｌｅｄランプ
JP4124129B2 (ja) * 2004-01-23 2008-07-23 セイコーエプソン株式会社 光源装置及びプロジェクタ
DE10351934B4 (de) 2003-11-07 2017-07-13 Tridonic Jennersdorf Gmbh Leuchtdioden-Anordnung mit wärmeabführender Platine
US7717589B2 (en) 2003-11-25 2010-05-18 Panasonic Electric Works Co., Ltd. Light emitting device using light emitting diode chip
JP2005158963A (ja) * 2003-11-25 2005-06-16 Matsushita Electric Works Ltd 発光装置
JP4385741B2 (ja) * 2003-11-25 2009-12-16 パナソニック電工株式会社 発光装置
JP4821087B2 (ja) * 2003-11-28 2011-11-24 パナソニック電工株式会社 発光装置
JP2005159045A (ja) * 2003-11-26 2005-06-16 Sumitomo Electric Ind Ltd 半導体発光素子搭載部材とそれを用いた発光ダイオード
JP2005191420A (ja) * 2003-12-26 2005-07-14 Stanley Electric Co Ltd 波長変換層を有する半導体発光装置およびその製造方法
US7355284B2 (en) * 2004-03-29 2008-04-08 Cree, Inc. Semiconductor light emitting devices including flexible film having therein an optical element
US7326583B2 (en) * 2004-03-31 2008-02-05 Cree, Inc. Methods for packaging of a semiconductor light emitting device
US7279346B2 (en) 2004-03-31 2007-10-09 Cree, Inc. Method for packaging a light emitting device by one dispense then cure step followed by another
US7517728B2 (en) 2004-03-31 2009-04-14 Cree, Inc. Semiconductor light emitting devices including a luminescent conversion element
JP4229447B2 (ja) 2004-03-31 2009-02-25 スタンレー電気株式会社 半導体発光装置及び製造方法
KR100634301B1 (ko) * 2004-04-21 2006-10-16 서울반도체 주식회사 발광다이오드
JP4359195B2 (ja) 2004-06-11 2009-11-04 株式会社東芝 半導体発光装置及びその製造方法並びに半導体発光ユニット
JP4254669B2 (ja) * 2004-09-07 2009-04-15 豊田合成株式会社 発光装置
JP4654639B2 (ja) * 2004-09-09 2011-03-23 日亜化学工業株式会社 発光装置及びその製造方法
JP5192811B2 (ja) * 2004-09-10 2013-05-08 ソウル セミコンダクター カンパニー リミテッド 多重モールド樹脂を有する発光ダイオードパッケージ
US20060097385A1 (en) 2004-10-25 2006-05-11 Negley Gerald H Solid metal block semiconductor light emitting device mounting substrates and packages including cavities and heat sinks, and methods of packaging same
JP2006140281A (ja) * 2004-11-11 2006-06-01 Stanley Electric Co Ltd パワーｌｅｄ及びその製造方法
KR101161396B1 (ko) * 2004-12-07 2012-07-02 서울반도체 주식회사 발광 다이오드
US7322732B2 (en) 2004-12-23 2008-01-29 Cree, Inc. Light emitting diode arrays for direct backlighting of liquid crystal displays
KR100696062B1 (ko) * 2005-01-05 2007-03-15 엘지이노텍 주식회사 발광 반도체 패키지
US7304694B2 (en) 2005-01-12 2007-12-04 Cree, Inc. Solid colloidal dispersions for backlighting of liquid crystal displays
DE102005020908A1 (de) * 2005-02-28 2006-08-31 Osram Opto Semiconductors Gmbh Beleuchtungsvorrichtung
US7980743B2 (en) 2005-06-14 2011-07-19 Cree, Inc. LED backlighting for displays
KR101201266B1 (ko) 2005-06-14 2012-11-14 덴끼 가가꾸 고교 가부시키가이샤 형광체 함유 수지 조성물 및 시트, 그것들을 사용한 발광소자
JP5020480B2 (ja) * 2005-06-14 2012-09-05 電気化学工業株式会社 蛍光体組成物とその用途
WO2006137711A1 (en) 2005-06-22 2006-12-28 Seoul Opto-Device Co., Ltd. Light emitting device and method of manufacturing the same
KR100631992B1 (ko) * 2005-07-19 2006-10-09 삼성전기주식회사 측면 방출형 이중 렌즈 구조 ｌｅｄ 패키지
JP4818654B2 (ja) * 2005-07-25 2011-11-16 ソニーケミカル＆インフォメーションデバイス株式会社 発光素子の封止方法
JP4820133B2 (ja) * 2005-07-25 2011-11-24 パナソニック電工株式会社 発光装置
KR100629496B1 (ko) 2005-08-08 2006-09-28 삼성전자주식회사 Ｌｅｄ 패키지 및 그 제조방법
JP4820135B2 (ja) * 2005-09-20 2011-11-24 パナソニック電工株式会社 発光装置
JP5235266B2 (ja) * 2005-09-29 2013-07-10 株式会社東芝 白色ｌｅｄの製造方法およびそれを用いたバックライトの製造方法並びに液晶表示装置の製造方法
JP2007123777A (ja) * 2005-10-31 2007-05-17 Sharp Corp 半導体発光装置
JP2007173733A (ja) * 2005-12-26 2007-07-05 Toshiba Lighting & Technology Corp 発光装置
JP5176273B2 (ja) * 2005-12-28 2013-04-03 日亜化学工業株式会社 発光装置及びその製造方法
JP5268082B2 (ja) * 2006-02-22 2013-08-21 シチズン電子株式会社 光半導体装置
JP2007234846A (ja) * 2006-03-01 2007-09-13 Ngk Spark Plug Co Ltd 発光素子用セラミックパッケージ
US8969908B2 (en) 2006-04-04 2015-03-03 Cree, Inc. Uniform emission LED package
JP2007311445A (ja) * 2006-05-17 2007-11-29 Stanley Electric Co Ltd 半導体発光装置及びその製造方法
US9502624B2 (en) 2006-05-18 2016-11-22 Nichia Corporation Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
JP4884074B2 (ja) * 2006-05-22 2012-02-22 スタンレー電気株式会社 半導体発光装置
EP2027412B1 (en) 2006-05-23 2018-07-04 Cree, Inc. Lighting device
WO2007139780A2 (en) 2006-05-23 2007-12-06 Cree Led Lighting Solutions, Inc. Lighting device and method of making
CN101449390A (zh) * 2006-05-24 2009-06-03 夏普株式会社 发光装置、包括该发光装置的照明装置和液晶显示装置
US8044418B2 (en) 2006-07-13 2011-10-25 Cree, Inc. Leadframe-based packages for solid state light emitting devices
US7960819B2 (en) * 2006-07-13 2011-06-14 Cree, Inc. Leadframe-based packages for solid state emitting devices
KR100803159B1 (ko) 2006-09-30 2008-02-14 서울반도체 주식회사 발광 다이오드 패키지용 발광 렌즈 및 이를 채용한 발광다이오드 패키지
US7631986B2 (en) * 2006-10-31 2009-12-15 Koninklijke Philips Electronics, N.V. Lighting device package
US10295147B2 (en) 2006-11-09 2019-05-21 Cree, Inc. LED array and method for fabricating same
US7897980B2 (en) 2006-11-09 2011-03-01 Cree, Inc. Expandable LED array interconnect
JP2008147203A (ja) * 2006-12-05 2008-06-26 Sanken Electric Co Ltd 半導体発光装置
US7687823B2 (en) 2006-12-26 2010-03-30 Nichia Corporation Light-emitting apparatus and method of producing the same
US9024349B2 (en) 2007-01-22 2015-05-05 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method
US9159888B2 (en) 2007-01-22 2015-10-13 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method
US8232564B2 (en) 2007-01-22 2012-07-31 Cree, Inc. Wafer level phosphor coating technique for warm light emitting diodes
DE102007011637A1 (de) * 2007-03-09 2008-09-18 Ivoclar Vivadent Ag Lichtemissionsvorrichtung
US10505083B2 (en) 2007-07-11 2019-12-10 Cree, Inc. Coating method utilizing phosphor containment structure and devices fabricated using same
JP5431320B2 (ja) 2007-07-17 2014-03-05 クリー インコーポレイテッド 内部光学機能を備えた光学素子およびその製造方法
KR101374898B1 (ko) * 2007-09-28 2014-03-18 서울반도체 주식회사 계면 분리를 줄인 ｌｅｄ 패키지
JP5155638B2 (ja) * 2007-10-25 2013-03-06 パナソニック株式会社 発光装置
US8167674B2 (en) 2007-12-14 2012-05-01 Cree, Inc. Phosphor distribution in LED lamps using centrifugal force
US9041285B2 (en) 2007-12-14 2015-05-26 Cree, Inc. Phosphor distribution in LED lamps using centrifugal force
US8878219B2 (en) 2008-01-11 2014-11-04 Cree, Inc. Flip-chip phosphor coating method and devices fabricated utilizing method
KR100992778B1 (ko) 2008-05-23 2010-11-05 엘지이노텍 주식회사 발광소자 패키지 및 그 제조방법
TWI456784B (zh) * 2008-07-29 2014-10-11 日亞化學工業股份有限公司 發光裝置
JP2010182746A (ja) * 2009-02-03 2010-08-19 Showa Denko Kk 発光装置、発光モジュールおよび発光装置を備えた電気装置
US20110308120A1 (en) * 2009-02-11 2011-12-22 Jae Yong Heo Led assembly having improved visibility, its attaching method and banner using it
US20120102797A1 (en) * 2009-02-27 2012-05-03 Jae Yong Heo Led assembly having improved discernibility, an attachment method for the same, and a signboard and traffic safety display board to which the same has been attached
TWI381556B (zh) * 2009-03-20 2013-01-01 億光電子工業股份有限公司 發光二極體封裝結構及其製作方法
EP2346100B1 (en) * 2010-01-15 2019-05-22 LG Innotek Co., Ltd. Light emitting apparatus and lighting system
JP5496757B2 (ja) * 2010-04-16 2014-05-21 交和電気産業株式会社 照明装置
US10546846B2 (en) 2010-07-23 2020-01-28 Cree, Inc. Light transmission control for masking appearance of solid state light sources
KR20120022410A (ko) * 2010-09-02 2012-03-12 삼성엘이디 주식회사 발광소자 패키지 및 그 제조 방법
US8772817B2 (en) 2010-12-22 2014-07-08 Cree, Inc. Electronic device submounts including substrates with thermally conductive vias
US9166126B2 (en) 2011-01-31 2015-10-20 Cree, Inc. Conformally coated light emitting devices and methods for providing the same
JP5887889B2 (ja) * 2011-11-30 2016-03-16 セイコーエプソン株式会社 光照射装置
KR101161387B1 (ko) * 2011-12-05 2012-07-02 서울반도체 주식회사 발광 다이오드
KR101247380B1 (ko) * 2012-03-09 2013-03-26 서울반도체 주식회사 발광 다이오드
JP2014011364A (ja) * 2012-06-29 2014-01-20 Ｈｏｙａ Ｃａｎｄｅｏ Ｏｐｔｒｏｎｉｃｓ株式会社 Ｌｅｄモジュール
JP2014216385A (ja) * 2013-04-23 2014-11-17 イーグル工業株式会社 光学素子モジュール
DE102013208223B4 (de) 2013-05-06 2021-09-16 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zum Herstellen eines optoelektronischen Bauelements
US9461214B2 (en) 2013-11-29 2016-10-04 Nichia Corporation Light emitting device with phosphor layer
JP6221696B2 (ja) * 2013-11-29 2017-11-01 日亜化学工業株式会社 発光装置の製造方法および発光装置
EP3172771B1 (en) * 2014-07-23 2019-03-20 Crystal Is, Inc. Illumination device with improved photon extraction, and assembling method therefor
EP3038173B1 (en) * 2014-12-23 2019-05-22 LG Innotek Co., Ltd. Light emitting device
KR102309671B1 (ko) * 2015-01-30 2021-10-07 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 소자 패키지 및 조명 장치
JP6634304B2 (ja) * 2015-03-31 2020-01-22 株式会社小糸製作所 光源ユニット、光源ユニットの製造方法及び車輌用灯具
KR102486035B1 (ko) * 2016-01-28 2023-01-06 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 소자 패키지 및 이를 구비한 발광 장치
KR102509312B1 (ko) * 2016-02-24 2023-03-17 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 소자 패키지
CN108633317B (zh) * 2016-02-12 2021-07-09 Lg 伊诺特有限公司 发光器件封装和包括该发光器件封装的照明设备
CN110915006A (zh) * 2018-11-19 2020-03-24 泉州三安半导体科技有限公司 一种紫外光源封装元件
US12002908B2 (en) 2018-11-19 2024-06-04 Quanzhou Sanan Semiconductor Technology Co., Ltd. Light-emitting packaging device
DE102019105831B4 (de) * 2019-03-07 2025-11-20 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches bauelement mit einer transparenten verbindung zwischen zwei fügepartnern und verfahren zu dessen herstellung
TWI744139B (zh) 2020-12-16 2021-10-21 隆達電子股份有限公司 二極體封裝結構及其製造方法
JP2022180743A (ja) * 2021-05-25 2022-12-07 東芝ライテック株式会社 車両用照明装置、および車両用灯具
WO2023063285A1 (ja) * 2021-10-11 2023-04-20 大日本印刷株式会社 面発光装置、表示装置、面発光装置の製造方法、および面発光装置用封止部材シート
CN119364937B (zh) * 2024-11-05 2025-09-19 深圳市中实光电科技有限公司 高聚光led光源制备方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8710514B2 (en) 2002-09-04 2014-04-29 Cree, Inc. Power surface mount light emitting die package
US7775685B2 (en) 2003-05-27 2010-08-17 Cree, Inc. Power surface mount light emitting die package
US8637883B2 (en) 2008-03-19 2014-01-28 Cree, Inc. Low index spacer layer in LED devices

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