JP2003174296A5 - - Google Patents
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- Publication number
- JP2003174296A5 JP2003174296A5 JP2002218706A JP2002218706A JP2003174296A5 JP 2003174296 A5 JP2003174296 A5 JP 2003174296A5 JP 2002218706 A JP2002218706 A JP 2002218706A JP 2002218706 A JP2002218706 A JP 2002218706A JP 2003174296 A5 JP2003174296 A5 JP 2003174296A5
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- unit
- mounting
- component mounting
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- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000007246 mechanism Effects 0.000 description 24
- 230000003028 elevating effect Effects 0.000 description 13
- 238000009434 installation Methods 0.000 description 11
- 239000000758 substrate Substances 0.000 description 10
- 229910000679 solder Inorganic materials 0.000 description 3
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002218706A JP4703089B2 (ja) | 2001-07-27 | 2002-07-26 | 実装基板生産装置 |
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001227469 | 2001-07-27 | ||
| JP2001-227469 | 2001-07-27 | ||
| JP2001227469 | 2001-07-27 | ||
| JP2001301955 | 2001-09-28 | ||
| JP2001-301955 | 2001-09-28 | ||
| JP2001301955 | 2001-09-28 | ||
| JP2002218706A JP4703089B2 (ja) | 2001-07-27 | 2002-07-26 | 実装基板生産装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003174296A JP2003174296A (ja) | 2003-06-20 |
| JP2003174296A5 true JP2003174296A5 (enExample) | 2007-01-25 |
| JP4703089B2 JP4703089B2 (ja) | 2011-06-15 |
Family
ID=27347236
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002218706A Expired - Fee Related JP4703089B2 (ja) | 2001-07-27 | 2002-07-26 | 実装基板生産装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4703089B2 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4853473B2 (ja) * | 2007-12-26 | 2012-01-11 | パナソニック株式会社 | 電子部品実装用装置および電子部品実装用装置の非常停止方法 |
| JP5103239B2 (ja) * | 2008-03-26 | 2012-12-19 | 株式会社日立ハイテクインスツルメンツ | 電子部品装着装置 |
| JP5525956B2 (ja) * | 2010-07-30 | 2014-06-18 | ヤマハ発動機株式会社 | 実装機 |
| JP5375777B2 (ja) * | 2010-09-09 | 2013-12-25 | パナソニック株式会社 | Ledパッケージ製造システムにおける樹脂塗布装置 |
| JP2012059917A (ja) * | 2010-09-09 | 2012-03-22 | Panasonic Corp | Ledパッケージ製造システムにおける樹脂塗布装置 |
| JP5988456B2 (ja) * | 2013-01-28 | 2016-09-07 | 富士機械製造株式会社 | 部品実装機 |
| JP6289870B2 (ja) * | 2013-11-07 | 2018-03-07 | 富士機械製造株式会社 | 部品実装システム |
| KR102046590B1 (ko) * | 2018-11-08 | 2019-11-19 | 길양현 | 전자부품 실장 시스템 |
-
2002
- 2002-07-26 JP JP2002218706A patent/JP4703089B2/ja not_active Expired - Fee Related
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