JP2012059917A - Ledパッケージ製造システムにおける樹脂塗布装置 - Google Patents
Ledパッケージ製造システムにおける樹脂塗布装置 Download PDFInfo
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- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 29
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- 239000003822 epoxy resin Substances 0.000 description 2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
- H01L2224/9222—Sequential connecting processes
- H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
- H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Coating Apparatus (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
【解決手段】複数のLED素子の発光特性を予め個別に測定して得られた素子特性情報12、規定の発光特性を具備したLEDパッケージを得るための樹脂の適正塗布量と素子特性情報とを対応させた樹脂塗布情報14を予め準備し、部品実装装置M1によって実装されたLED素子の基板における位置を示す実装位置情報71aと素子特性情報12とを関連付けたマップデータ18をマップ作成処理部74によって基板毎に作成し、樹脂塗布装置M4において、マップデータ18と樹脂塗布情報14に基づき適正塗布量の樹脂を基板に実装された各LED素子に塗布する。
【選択図】図9
Description
2 LANシステム
4 基板
4a 個片基板
4b LED実装部
4c 反射部
5 LED素子
50 LEDパッケージ
8 樹脂
12 素子特性情報
13A,13B,13C LEDシート
14 樹脂塗布情報
18 マップデータ
23 樹脂接着剤
24 接着剤転写機構
25 部品供給機構
26 部品実装機構
32 樹脂吐出ヘッド
33 吐出ノズル
Claims (2)
- 基板に実装されたLED素子を蛍光体を含む樹脂によって覆って成るLEDパッケージを製造するLEDパッケージ製造システムにおいて、部品実装装置によって前記基板に実装された複数のLED素子を覆って前記樹脂を塗布する樹脂塗布装置であって、
前記LEDパッケージ製造システムは、前記複数のLED素子の発光波長を含む発光特性を予め個別に測定して得られた情報を素子特性情報として提供する素子特性情報提供手段と、
規定の発光特性を具備したLEDパッケージを得るための前記樹脂の適正塗布量と前記素子特性情報とを対応させた情報を樹脂塗布情報として提供する樹脂情報提供手段と、
前記基板に実装されたLED素子の当該基板における位置を示す実装位置情報と当該LED素子についての前記素子特性情報とを関連付けたマップデータを前記基板毎に作成し、前記樹脂塗布装置に送信するマップデータ作成手段とを備え、
樹脂供給部によって供給される前記樹脂を吐出ノズルから吐出する樹脂吐出機構と、前記吐出ノズルを前記基板に対して相対的に移動させる相対移動機構と、前記送信されたマップデータと前記樹脂塗布情報とに基づき、前記樹脂吐出機構および相対移動機構を制御することにより、規定の発光特性を具備するための適正な塗布量の前記樹脂を各LED素子に塗布させる塗布制御部とを備えたことを特徴とするLEDパッケージ製造システムにおける樹脂塗布装置。 - 前記部品実装装置および樹脂塗布装置はいずれもLANシステムに接続されており、前記素子特性情報提供手段および樹脂情報提供手段は、外部記憶手段より読み出された前記素子特性情報および樹脂塗布情報を、前記LANシステムを介して前記部品実装装置および樹脂塗布装置にそれぞれ送信することを特徴とする請求項1記載のLEDパッケージ製造システムにおける樹脂塗布装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010201655A JP2012059917A (ja) | 2010-09-09 | 2010-09-09 | Ledパッケージ製造システムにおける樹脂塗布装置 |
DE112011103013T DE112011103013T5 (de) | 2010-09-09 | 2011-05-09 | Kunstharz-Beschichtungseinrichtung in einem LED-Bauelemente-Fertigungssystem |
US13/634,153 US20130000554A1 (en) | 2010-09-09 | 2011-05-09 | Resin coating device in led package manufacturing system |
KR1020127022510A KR20130093466A (ko) | 2010-09-09 | 2011-05-09 | Led 패키지 제조 시스템에서의 수지 도포 장치 |
PCT/JP2011/002579 WO2012032693A1 (ja) | 2010-09-09 | 2011-05-09 | Ledパッケージ製造システムにおける樹脂塗布装置 |
CN201180011456.2A CN102782890B (zh) | 2010-09-09 | 2011-05-09 | Led封装件制造系统中的树脂涂覆装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010201655A JP2012059917A (ja) | 2010-09-09 | 2010-09-09 | Ledパッケージ製造システムにおける樹脂塗布装置 |
Publications (1)
Publication Number | Publication Date |
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JP2012059917A true JP2012059917A (ja) | 2012-03-22 |
Family
ID=45810306
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2010201655A Pending JP2012059917A (ja) | 2010-09-09 | 2010-09-09 | Ledパッケージ製造システムにおける樹脂塗布装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20130000554A1 (ja) |
JP (1) | JP2012059917A (ja) |
KR (1) | KR20130093466A (ja) |
CN (1) | CN102782890B (ja) |
DE (1) | DE112011103013T5 (ja) |
WO (1) | WO2012032693A1 (ja) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2004253745A (ja) * | 2003-02-24 | 2004-09-09 | Citizen Electronics Co Ltd | パステルledの作成方法 |
JP2005056885A (ja) * | 2003-08-04 | 2005-03-03 | Fine Rubber Kenkyusho:Kk | 半導体発光装置の製造方法 |
JP2007066969A (ja) * | 2005-08-29 | 2007-03-15 | Toshiba Lighting & Technology Corp | 白色発光ダイオード装置とその製造方法 |
JP2009272638A (ja) * | 2008-05-05 | 2009-11-19 | Cree Inc | 測定された発光特性に基づいた光変換材料の選択的堆積によって発光素子を製造する方法 |
JP2010103349A (ja) * | 2008-10-24 | 2010-05-06 | Toshiba Corp | 発光装置の製造方法 |
JP2010177620A (ja) * | 2009-02-02 | 2010-08-12 | Showa Denko Kk | 発光装置の製造方法 |
JP2011096936A (ja) * | 2009-10-30 | 2011-05-12 | Alpha- Design Kk | 半導体発光ディバイス製造装置 |
Family Cites Families (6)
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JP4703089B2 (ja) * | 2001-07-27 | 2011-06-15 | パナソニック株式会社 | 実装基板生産装置 |
KR101115291B1 (ko) * | 2003-04-25 | 2012-03-05 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 액적 토출 장치, 패턴의 형성 방법, 및 반도체 장치의 제조 방법 |
US20060029724A1 (en) * | 2004-08-06 | 2006-02-09 | Nordson Corporation | System for jetting phosphor for optical displays |
WO2009118985A2 (en) * | 2008-03-25 | 2009-10-01 | Kabushiki Kaisha Toshiba | Light emitting device, and method and apparatus for manufacturing same |
US20100184244A1 (en) * | 2009-01-20 | 2010-07-22 | SunPrint, Inc. | Systems and methods for depositing patterned materials for solar panel production |
JP5071412B2 (ja) | 2009-02-27 | 2012-11-14 | 株式会社デンソー | マスキングテープ貼付製造装置およびマスキングテープの貼付方法 |
-
2010
- 2010-09-09 JP JP2010201655A patent/JP2012059917A/ja active Pending
-
2011
- 2011-05-09 DE DE112011103013T patent/DE112011103013T5/de not_active Withdrawn
- 2011-05-09 US US13/634,153 patent/US20130000554A1/en not_active Abandoned
- 2011-05-09 CN CN201180011456.2A patent/CN102782890B/zh active Active
- 2011-05-09 WO PCT/JP2011/002579 patent/WO2012032693A1/ja active Application Filing
- 2011-05-09 KR KR1020127022510A patent/KR20130093466A/ko not_active Application Discontinuation
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004253745A (ja) * | 2003-02-24 | 2004-09-09 | Citizen Electronics Co Ltd | パステルledの作成方法 |
JP2005056885A (ja) * | 2003-08-04 | 2005-03-03 | Fine Rubber Kenkyusho:Kk | 半導体発光装置の製造方法 |
JP2007066969A (ja) * | 2005-08-29 | 2007-03-15 | Toshiba Lighting & Technology Corp | 白色発光ダイオード装置とその製造方法 |
JP2009272638A (ja) * | 2008-05-05 | 2009-11-19 | Cree Inc | 測定された発光特性に基づいた光変換材料の選択的堆積によって発光素子を製造する方法 |
JP2010103349A (ja) * | 2008-10-24 | 2010-05-06 | Toshiba Corp | 発光装置の製造方法 |
JP2010177620A (ja) * | 2009-02-02 | 2010-08-12 | Showa Denko Kk | 発光装置の製造方法 |
JP2011096936A (ja) * | 2009-10-30 | 2011-05-12 | Alpha- Design Kk | 半導体発光ディバイス製造装置 |
Also Published As
Publication number | Publication date |
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US20130000554A1 (en) | 2013-01-03 |
DE112011103013T5 (de) | 2013-06-27 |
CN102782890A (zh) | 2012-11-14 |
KR20130093466A (ko) | 2013-08-22 |
WO2012032693A1 (ja) | 2012-03-15 |
CN102782890B (zh) | 2015-10-21 |
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