JP4703089B2 - 実装基板生産装置 - Google Patents

実装基板生産装置 Download PDF

Info

Publication number
JP4703089B2
JP4703089B2 JP2002218706A JP2002218706A JP4703089B2 JP 4703089 B2 JP4703089 B2 JP 4703089B2 JP 2002218706 A JP2002218706 A JP 2002218706A JP 2002218706 A JP2002218706 A JP 2002218706A JP 4703089 B2 JP4703089 B2 JP 4703089B2
Authority
JP
Japan
Prior art keywords
mounting
unit
electronic component
substrate
width
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2002218706A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003174296A (ja
JP2003174296A5 (enExample
Inventor
健太郎 西脇
義彦 三沢
邦男 櫻井
健 ▲高▼野
実 山本
裕一 本川
洋一 中村
一正 奥村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2002218706A priority Critical patent/JP4703089B2/ja
Publication of JP2003174296A publication Critical patent/JP2003174296A/ja
Publication of JP2003174296A5 publication Critical patent/JP2003174296A5/ja
Application granted granted Critical
Publication of JP4703089B2 publication Critical patent/JP4703089B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Supply And Installment Of Electrical Components (AREA)
JP2002218706A 2001-07-27 2002-07-26 実装基板生産装置 Expired - Fee Related JP4703089B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002218706A JP4703089B2 (ja) 2001-07-27 2002-07-26 実装基板生産装置

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2001227469 2001-07-27
JP2001-227469 2001-07-27
JP2001227469 2001-07-27
JP2001301955 2001-09-28
JP2001-301955 2001-09-28
JP2001301955 2001-09-28
JP2002218706A JP4703089B2 (ja) 2001-07-27 2002-07-26 実装基板生産装置

Publications (3)

Publication Number Publication Date
JP2003174296A JP2003174296A (ja) 2003-06-20
JP2003174296A5 JP2003174296A5 (enExample) 2007-01-25
JP4703089B2 true JP4703089B2 (ja) 2011-06-15

Family

ID=27347236

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002218706A Expired - Fee Related JP4703089B2 (ja) 2001-07-27 2002-07-26 実装基板生産装置

Country Status (1)

Country Link
JP (1) JP4703089B2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4853473B2 (ja) * 2007-12-26 2012-01-11 パナソニック株式会社 電子部品実装用装置および電子部品実装用装置の非常停止方法
JP5103239B2 (ja) * 2008-03-26 2012-12-19 株式会社日立ハイテクインスツルメンツ 電子部品装着装置
JP5525956B2 (ja) * 2010-07-30 2014-06-18 ヤマハ発動機株式会社 実装機
JP5375777B2 (ja) * 2010-09-09 2013-12-25 パナソニック株式会社 Ｌｅｄパッケージ製造システムにおける樹脂塗布装置
JP2012059917A (ja) * 2010-09-09 2012-03-22 Panasonic Corp Ｌｅｄパッケージ製造システムにおける樹脂塗布装置
JP5988456B2 (ja) * 2013-01-28 2016-09-07 富士機械製造株式会社 部品実装機
JP6289870B2 (ja) * 2013-11-07 2018-03-07 富士機械製造株式会社 部品実装システム
KR102046590B1 (ko) * 2018-11-08 2019-11-19 길양현 전자부품 실장 시스템

Also Published As

Publication number Publication date
JP2003174296A (ja) 2003-06-20

Similar Documents

Publication Publication Date Title
US6976304B2 (en) Components placing apparatus
JP3973439B2 (ja) 電子部品実装装置及び方法
JP5656446B2 (ja) バックアップピン装置並びにバックアップピン配置方法及び配置装置
KR20110136807A (ko) 기판 반송 처리 시스템 및 기판 반송 처리 방법, 및 부품 실장 장치 및 방법
JP2012222035A (ja) 電子部品装着方法及び装着装置
JP4703089B2 (ja) 実装基板生産装置
JP7266103B2 (ja) 部品実装機のバックアップピン自動配置システム
JP6171158B2 (ja) 実装装置、電子部品の実装方法、プログラム及び基板の製造方法
JP4354249B2 (ja) 部品装着装置
JP2003046295A (ja) 電気部品装着システムおよび電気回路製造方法
JP6283681B2 (ja) 作業機
JP2957783B2 (ja) 電子部品装着装置
JP4316325B2 (ja) 部品実装機用架台及び部品実装機
JP5112411B2 (ja) 基板供給装置、基板供給方法、実装基板回収装置、及び実装基板回収方法
JP5121590B2 (ja) 表面実装装置
JP2007184648A (ja) 実装方法
JPWO2015015578A1 (ja) 電子部品装着装置及び装着方法
JP4095917B2 (ja) トレー式部品供給装置及びそのパレット位置決め方法
JP2002176296A (ja) 搭載データ作成装置及びそのプログラムを記録した記録媒体
JP2005235803A (ja) 部品供給装置および部品供給方法
JP4061099B2 (ja) 実装機
JP3851852B2 (ja) トレイ式電子部品供給装置
JP2004259726A (ja) 電子部品搭載装置
JP2003101296A (ja) 部品搭載装置
JP2004111448A (ja) 部品装着装置

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20050714

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20061201

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20080403

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20080422

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080619

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20081021

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20081118

A911 Transfer of reconsideration by examiner before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20090119

A912 Removal of reconsideration by examiner before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A912

Effective date: 20090220

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20101217

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20110308

LAPS Cancellation because of no payment of annual fees