JP2003133507A5 - - Google Patents

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Publication number
JP2003133507A5
JP2003133507A5 JP2001329687A JP2001329687A JP2003133507A5 JP 2003133507 A5 JP2003133507 A5 JP 2003133507A5 JP 2001329687 A JP2001329687 A JP 2001329687A JP 2001329687 A JP2001329687 A JP 2001329687A JP 2003133507 A5 JP2003133507 A5 JP 2003133507A5
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JP
Japan
Prior art keywords
capacitor
pitch
semiconductor device
wiring
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001329687A
Other languages
English (en)
Japanese (ja)
Other versions
JP3967108B2 (ja
JP2003133507A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2001329687A priority Critical patent/JP3967108B2/ja
Priority claimed from JP2001329687A external-priority patent/JP3967108B2/ja
Priority to US10/092,525 priority patent/US7176556B2/en
Publication of JP2003133507A publication Critical patent/JP2003133507A/ja
Publication of JP2003133507A5 publication Critical patent/JP2003133507A5/ja
Priority to US11/600,211 priority patent/US7557014B2/en
Application granted granted Critical
Publication of JP3967108B2 publication Critical patent/JP3967108B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2001329687A 2001-10-26 2001-10-26 半導体装置およびその製造方法 Expired - Fee Related JP3967108B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2001329687A JP3967108B2 (ja) 2001-10-26 2001-10-26 半導体装置およびその製造方法
US10/092,525 US7176556B2 (en) 2001-10-26 2002-03-08 Semiconductor system-in-package
US11/600,211 US7557014B2 (en) 2001-10-26 2006-11-16 Semiconductor system-in-package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001329687A JP3967108B2 (ja) 2001-10-26 2001-10-26 半導体装置およびその製造方法

Publications (3)

Publication Number Publication Date
JP2003133507A JP2003133507A (ja) 2003-05-09
JP2003133507A5 true JP2003133507A5 (enExample) 2005-07-07
JP3967108B2 JP3967108B2 (ja) 2007-08-29

Family

ID=19145543

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001329687A Expired - Fee Related JP3967108B2 (ja) 2001-10-26 2001-10-26 半導体装置およびその製造方法

Country Status (2)

Country Link
US (2) US7176556B2 (enExample)
JP (1) JP3967108B2 (enExample)

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JP5275400B2 (ja) 2011-04-18 2013-08-28 新光電気工業株式会社 配線基板、半導体装置及び配線基板の製造方法
JP5275401B2 (ja) 2011-04-18 2013-08-28 新光電気工業株式会社 配線基板、半導体装置及び配線基板の製造方法
US20120292777A1 (en) * 2011-05-18 2012-11-22 Lotz Jonathan P Backside Power Delivery Using Die Stacking
US8994157B1 (en) 2011-05-27 2015-03-31 Scientific Components Corporation Circuit system in a package
JP6136061B2 (ja) * 2012-12-13 2017-05-31 株式会社村田製作所 半導体装置
US9865524B2 (en) * 2013-04-08 2018-01-09 STATS ChipPAC Pte. Ltd. Semiconductor device and method of forming conductive vias using backside via reveal and selective passivation
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WO2015003264A1 (en) 2013-07-08 2015-01-15 Motion Engine Inc. Mems device and method of manufacturing
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WO2015013827A1 (en) 2013-08-02 2015-02-05 Motion Engine Inc. Mems motion sensor for sub-resonance angular rate sensing
WO2015083281A1 (ja) * 2013-12-06 2015-06-11 ルネサスエレクトロニクス株式会社 半導体装置
WO2015083289A1 (ja) * 2013-12-06 2015-06-11 ルネサスエレクトロニクス株式会社 半導体装置
JP6590812B2 (ja) 2014-01-09 2019-10-16 モーション・エンジン・インコーポレーテッド 集積ｍｅｍｓシステム
JP2015153978A (ja) * 2014-02-18 2015-08-24 キヤノン株式会社 貫通配線の作製方法
WO2015154173A1 (en) 2014-04-10 2015-10-15 Motion Engine Inc. Mems pressure sensor
US11674803B2 (en) 2014-06-02 2023-06-13 Motion Engine, Inc. Multi-mass MEMS motion sensor
CA3004760A1 (en) 2014-12-09 2016-06-16 Motion Engine Inc. 3d mems magnetometer and associated methods
WO2016112463A1 (en) 2015-01-15 2016-07-21 Motion Engine Inc. 3d mems device with hermetic cavity
US9735227B2 (en) * 2015-08-03 2017-08-15 Synopsys, Inc. 2D material super capacitors
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KR102906435B1 (ko) 2020-10-07 2026-01-02 삼성전자주식회사 반도체 패키지

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