JP2003039193A5 - - Google Patents

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Publication number
JP2003039193A5
JP2003039193A5 JP2001367169A JP2001367169A JP2003039193A5 JP 2003039193 A5 JP2003039193 A5 JP 2003039193A5 JP 2001367169 A JP2001367169 A JP 2001367169A JP 2001367169 A JP2001367169 A JP 2001367169A JP 2003039193 A5 JP2003039193 A5 JP 2003039193A5
Authority
JP
Japan
Prior art keywords
solder material
proportion
indium
silver
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001367169A
Other languages
English (en)
Japanese (ja)
Other versions
JP3795797B2 (ja
JP2003039193A (ja
Filing date
Publication date
Priority claimed from SG200104071-6A external-priority patent/SG139507A1/en
Application filed filed Critical
Publication of JP2003039193A publication Critical patent/JP2003039193A/ja
Publication of JP2003039193A5 publication Critical patent/JP2003039193A5/ja
Application granted granted Critical
Publication of JP3795797B2 publication Critical patent/JP3795797B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP2001367169A 2001-07-09 2001-11-30 はんだ材 Expired - Lifetime JP3795797B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SG200104071-6A SG139507A1 (en) 2001-07-09 2001-07-09 Improvements in or relating to solders
SG200104071-6 2001-07-09

Publications (3)

Publication Number Publication Date
JP2003039193A JP2003039193A (ja) 2003-02-12
JP2003039193A5 true JP2003039193A5 (enExample) 2005-04-07
JP3795797B2 JP3795797B2 (ja) 2006-07-12

Family

ID=20430801

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001367169A Expired - Lifetime JP3795797B2 (ja) 2001-07-09 2001-11-30 はんだ材

Country Status (22)

Country Link
US (1) US6843862B2 (enExample)
EP (1) EP1404483B1 (enExample)
JP (1) JP3795797B2 (enExample)
CN (1) CN1235717C (enExample)
AT (1) ATE278502T1 (enExample)
AU (1) AU2002226534B2 (enExample)
BR (1) BR0210970A (enExample)
CZ (1) CZ303793B6 (enExample)
DE (1) DE60201542T2 (enExample)
DK (1) DK1404483T3 (enExample)
ES (1) ES2230477T3 (enExample)
HU (1) HU229014B1 (enExample)
MX (1) MXPA04000229A (enExample)
MY (1) MY123567A (enExample)
NO (1) NO337878B1 (enExample)
NZ (1) NZ530220A (enExample)
PL (1) PL201507B1 (enExample)
PT (1) PT1404483E (enExample)
RU (1) RU2268126C2 (enExample)
SG (1) SG139507A1 (enExample)
TW (1) TW592869B (enExample)
WO (1) WO2003006200A1 (enExample)

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JP2004179618A (ja) * 2002-10-04 2004-06-24 Sharp Corp 太陽電池およびその製造方法、太陽電池用インターコネクター、ストリングならびにモジュール
JP2004146464A (ja) * 2002-10-22 2004-05-20 Sharp Corp 太陽電池およびその製造方法、太陽電池用インターコネクター、ストリングならびにモジュール
US7111771B2 (en) * 2003-03-31 2006-09-26 Intel Corporation Solders with surfactant-refined grain sizes, solder bumps made thereof, and methods of making same
US20040187976A1 (en) * 2003-03-31 2004-09-30 Fay Hua Phase change lead-free super plastic solders
US7282175B2 (en) * 2003-04-17 2007-10-16 Senju Metal Industry Co., Ltd. Lead-free solder
JP3925554B2 (ja) * 2003-10-07 2007-06-06 千住金属工業株式会社 鉛フリーはんだボール
US20050100474A1 (en) * 2003-11-06 2005-05-12 Benlih Huang Anti-tombstoning lead free alloys for surface mount reflow soldering
US20080126535A1 (en) * 2006-11-28 2008-05-29 Yinjun Zhu User plane location services over session initiation protocol (SIP)
EP1560272B1 (en) * 2004-01-29 2016-04-27 Panasonic Intellectual Property Management Co., Ltd. Solar cell module
US8961709B1 (en) 2004-03-09 2015-02-24 Senju Metal Industry Co., Ltd. Solder paste
US7223695B2 (en) * 2004-09-30 2007-05-29 Intel Corporation Methods to deposit metal alloy barrier layers
US6985105B1 (en) * 2004-10-15 2006-01-10 Telecommunication Systems, Inc. Culled satellite ephemeris information based on limiting a span of an inverted cone for locating satellite in-range determinations
GB2406101C (en) * 2004-10-27 2007-09-11 Quantum Chem Tech Singapore Improvements in ro relating to solders
US20060120911A1 (en) * 2004-12-08 2006-06-08 Manoj Gupta Method of forming composite solder by cold compaction and composite solder
US20070231594A1 (en) * 2005-08-12 2007-10-04 John Pereira Multilayer solder article
US20070036670A1 (en) * 2005-08-12 2007-02-15 John Pereira Solder composition
US20080175748A1 (en) * 2005-08-12 2008-07-24 John Pereira Solder Composition
US20070037004A1 (en) * 2005-08-12 2007-02-15 Antaya Technologies Corporation Multilayer solder article
US20070292708A1 (en) * 2005-08-12 2007-12-20 John Pereira Solder composition
US7749336B2 (en) * 2005-08-30 2010-07-06 Indium Corporation Of America Technique for increasing the compliance of tin-indium solders
US20070071634A1 (en) * 2005-09-26 2007-03-29 Indium Corporation Of America Low melting temperature compliant solders
US7825780B2 (en) * 2005-10-05 2010-11-02 Telecommunication Systems, Inc. Cellular augmented vehicle alarm notification together with location services for position of an alarming vehicle
US7907551B2 (en) * 2005-10-06 2011-03-15 Telecommunication Systems, Inc. Voice over internet protocol (VoIP) location based 911 conferencing
US20070172381A1 (en) * 2006-01-23 2007-07-26 Deram Brian T Lead-free solder with low copper dissolution
US8150363B2 (en) 2006-02-16 2012-04-03 Telecommunication Systems, Inc. Enhanced E911 network access for call centers
US8059789B2 (en) 2006-02-24 2011-11-15 Telecommunication Systems, Inc. Automatic location identification (ALI) emergency services pseudo key (ESPK)
US7471236B1 (en) 2006-03-01 2008-12-30 Telecommunication Systems, Inc. Cellular augmented radar/laser detector
US8208605B2 (en) * 2006-05-04 2012-06-26 Telecommunication Systems, Inc. Extended efficient usage of emergency services keys
US20080259908A1 (en) * 2006-09-26 2008-10-23 John Gordon Hines Location object proxy
WO2008057477A2 (en) * 2006-11-03 2008-05-15 Telecommunication Systems, Inc. Roaming gateway enabling location based services (lbs) roaming for user plane in cdma networks without requiring use of a mobile positioning center (mpc)
US20080157910A1 (en) * 2006-12-29 2008-07-03 Park Chang-Min Amorphous soft magnetic layer for on-die inductively coupled wires
US20080167018A1 (en) * 2007-01-10 2008-07-10 Arlene Havlark Wireless telecommunications location based services scheme selection
EP2177305B1 (en) 2007-07-18 2013-07-03 Senju Metal Industry Co., Ltd In-containing lead-free solder for on-vehicle electronic circuit
GB2455486A (en) * 2008-03-05 2009-06-17 Quantum Chem Tech Singapore A sputtered film, solder spheres and solder paste formed from an Sn-Ag-Cu-In alloy
CN101474728B (zh) * 2009-01-07 2011-06-01 高新锡业（惠州）有限公司 无铅软钎焊料
US9841282B2 (en) 2009-07-27 2017-12-12 Visa U.S.A. Inc. Successive offer communications with an offer recipient
CN109702372A (zh) * 2019-03-06 2019-05-03 上海莜玮汽车零部件有限公司 无铅焊料合金及其应用
CN113798725B (zh) * 2021-10-13 2022-10-04 浙江强力控股有限公司 选择性波峰焊用免焊剂无铅焊料及其制备方法

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DE3730764C1 (de) * 1987-09-12 1988-07-14 Demetron Verwendung von Legierungen aus Zinn und/oder Blei als Weichlote zum Aufbringen von Halbleitern auf metallische Traeger
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US5520752A (en) * 1994-06-20 1996-05-28 The United States Of America As Represented By The Secretary Of The Army Composite solders
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JP3874031B2 (ja) 1995-11-29 2007-01-31 内橋エステック株式会社 無鉛はんだ合金
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JPH10314980A (ja) * 1997-05-14 1998-12-02 Sony Corp はんだ材料
JPH11221694A (ja) * 1998-02-06 1999-08-17 Hitachi Ltd 鉛フリーはんだを用いた実装構造体およびそれを用いた実装方法
US5938862A (en) * 1998-04-03 1999-08-17 Delco Electronics Corporation Fatigue-resistant lead-free alloy
JP2000141078A (ja) * 1998-09-08 2000-05-23 Nippon Sheet Glass Co Ltd 無鉛ハンダ
WO2000018536A1 (en) * 1998-09-30 2000-04-06 Matsushita Electric Industrial Co., Ltd. Soldering material and electric/electronic device using the same
US6176947B1 (en) * 1998-12-31 2001-01-23 H-Technologies Group, Incorporated Lead-free solders
JP3753168B2 (ja) * 1999-08-20 2006-03-08 千住金属工業株式会社 微小チップ部品接合用ソルダペースト
JP4338854B2 (ja) * 1999-11-25 2009-10-07 三井金属鉱業株式会社 スズ−ビスマス系無鉛はんだ
WO2002040213A1 (en) * 2000-11-16 2002-05-23 Singapore Asahi Chemical And Solder Industries Pte. Ltd. Lead-free solders

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