CZ303793B6 - Bezolovnatá pájka, zpusob její prípravy a zpusob pájení - Google Patents
Bezolovnatá pájka, zpusob její prípravy a zpusob pájení Download PDFInfo
- Publication number
- CZ303793B6 CZ303793B6 CZ20040209A CZ2004209A CZ303793B6 CZ 303793 B6 CZ303793 B6 CZ 303793B6 CZ 20040209 A CZ20040209 A CZ 20040209A CZ 2004209 A CZ2004209 A CZ 2004209A CZ 303793 B6 CZ303793 B6 CZ 303793B6
- Authority
- CZ
- Czechia
- Prior art keywords
- solder
- lead
- copper
- tin
- free
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 253
- 238000000034 method Methods 0.000 title claims abstract description 30
- 238000005476 soldering Methods 0.000 title claims abstract description 18
- 238000002360 preparation method Methods 0.000 title description 2
- 239000010949 copper Substances 0.000 claims abstract description 86
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 72
- 229910052802 copper Inorganic materials 0.000 claims abstract description 72
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 63
- 229910052718 tin Inorganic materials 0.000 claims abstract description 63
- 229910052709 silver Inorganic materials 0.000 claims abstract description 50
- 239000004332 silver Substances 0.000 claims abstract description 50
- 229910052738 indium Inorganic materials 0.000 claims abstract description 39
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims abstract description 39
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 16
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 16
- 239000011574 phosphorus Substances 0.000 claims abstract description 16
- 238000004519 manufacturing process Methods 0.000 claims abstract description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 49
- 238000002156 mixing Methods 0.000 claims description 7
- 238000005219 brazing Methods 0.000 claims description 6
- 239000011135 tin Substances 0.000 description 82
- 238000012360 testing method Methods 0.000 description 50
- 238000009736 wetting Methods 0.000 description 30
- 238000000576 coating method Methods 0.000 description 18
- 229910045601 alloy Inorganic materials 0.000 description 16
- 239000000956 alloy Substances 0.000 description 16
- 238000004090 dissolution Methods 0.000 description 16
- 229910052797 bismuth Inorganic materials 0.000 description 12
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 12
- 239000011248 coating agent Substances 0.000 description 12
- 239000000203 mixture Substances 0.000 description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- 239000002893 slag Substances 0.000 description 9
- 239000010931 gold Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 239000003963 antioxidant agent Substances 0.000 description 4
- 230000003078 antioxidant effect Effects 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 229910000765 intermetallic Inorganic materials 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 230000000704 physical effect Effects 0.000 description 4
- 239000000654 additive Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- ALKZAGKDWUSJED-UHFFFAOYSA-N dinuclear copper ion Chemical compound [Cu].[Cu] ALKZAGKDWUSJED-UHFFFAOYSA-N 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 2
- 238000001000 micrograph Methods 0.000 description 2
- 239000003755 preservative agent Substances 0.000 description 2
- 230000002335 preservative effect Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000009616 inductively coupled plasma Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 239000003223 protective agent Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Glass Compositions (AREA)
- Thermally Insulated Containers For Foods (AREA)
- Nonmetallic Welding Materials (AREA)
- Silicates, Zeolites, And Molecular Sieves (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Details Of Resistors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SG200104071-6A SG139507A1 (en) | 2001-07-09 | 2001-07-09 | Improvements in or relating to solders |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CZ2004209A3 CZ2004209A3 (cs) | 2004-09-15 |
| CZ303793B6 true CZ303793B6 (cs) | 2013-05-09 |
Family
ID=20430801
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CZ20040209A CZ303793B6 (cs) | 2001-07-09 | 2002-01-22 | Bezolovnatá pájka, zpusob její prípravy a zpusob pájení |
Country Status (22)
| Country | Link |
|---|---|
| US (1) | US6843862B2 (enExample) |
| EP (1) | EP1404483B1 (enExample) |
| JP (1) | JP3795797B2 (enExample) |
| CN (1) | CN1235717C (enExample) |
| AT (1) | ATE278502T1 (enExample) |
| AU (1) | AU2002226534B2 (enExample) |
| BR (1) | BR0210970A (enExample) |
| CZ (1) | CZ303793B6 (enExample) |
| DE (1) | DE60201542T2 (enExample) |
| DK (1) | DK1404483T3 (enExample) |
| ES (1) | ES2230477T3 (enExample) |
| HU (1) | HU229014B1 (enExample) |
| MX (1) | MXPA04000229A (enExample) |
| MY (1) | MY123567A (enExample) |
| NO (1) | NO337878B1 (enExample) |
| NZ (1) | NZ530220A (enExample) |
| PL (1) | PL201507B1 (enExample) |
| PT (1) | PT1404483E (enExample) |
| RU (1) | RU2268126C2 (enExample) |
| SG (1) | SG139507A1 (enExample) |
| TW (1) | TW592869B (enExample) |
| WO (1) | WO2003006200A1 (enExample) |
Families Citing this family (40)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9154906B2 (en) | 2002-03-28 | 2015-10-06 | Telecommunication Systems, Inc. | Area watcher for wireless network |
| US8918073B2 (en) * | 2002-03-28 | 2014-12-23 | Telecommunication Systems, Inc. | Wireless telecommunications location based services scheme selection |
| JP2004179618A (ja) * | 2002-10-04 | 2004-06-24 | Sharp Corp | 太陽電池およびその製造方法、太陽電池用インターコネクター、ストリングならびにモジュール |
| JP2004146464A (ja) * | 2002-10-22 | 2004-05-20 | Sharp Corp | 太陽電池およびその製造方法、太陽電池用インターコネクター、ストリングならびにモジュール |
| US20040187976A1 (en) * | 2003-03-31 | 2004-09-30 | Fay Hua | Phase change lead-free super plastic solders |
| US7111771B2 (en) * | 2003-03-31 | 2006-09-26 | Intel Corporation | Solders with surfactant-refined grain sizes, solder bumps made thereof, and methods of making same |
| US7282175B2 (en) * | 2003-04-17 | 2007-10-16 | Senju Metal Industry Co., Ltd. | Lead-free solder |
| WO2005035180A1 (ja) * | 2003-10-07 | 2005-04-21 | Senju Metal Industry Co., Ltd. | 鉛フリーはんだボール |
| US20050100474A1 (en) * | 2003-11-06 | 2005-05-12 | Benlih Huang | Anti-tombstoning lead free alloys for surface mount reflow soldering |
| US20080126535A1 (en) * | 2006-11-28 | 2008-05-29 | Yinjun Zhu | User plane location services over session initiation protocol (SIP) |
| EP1560272B1 (en) * | 2004-01-29 | 2016-04-27 | Panasonic Intellectual Property Management Co., Ltd. | Solar cell module |
| CN100503133C (zh) * | 2004-03-09 | 2009-06-24 | 千住金属工业株式会社 | 焊膏 |
| US7223695B2 (en) * | 2004-09-30 | 2007-05-29 | Intel Corporation | Methods to deposit metal alloy barrier layers |
| US6985105B1 (en) * | 2004-10-15 | 2006-01-10 | Telecommunication Systems, Inc. | Culled satellite ephemeris information based on limiting a span of an inverted cone for locating satellite in-range determinations |
| GB2406101C (en) * | 2004-10-27 | 2007-09-11 | Quantum Chem Tech Singapore | Improvements in ro relating to solders |
| US20060120911A1 (en) * | 2004-12-08 | 2006-06-08 | Manoj Gupta | Method of forming composite solder by cold compaction and composite solder |
| US20070036670A1 (en) * | 2005-08-12 | 2007-02-15 | John Pereira | Solder composition |
| US20070037004A1 (en) * | 2005-08-12 | 2007-02-15 | Antaya Technologies Corporation | Multilayer solder article |
| US20070292708A1 (en) * | 2005-08-12 | 2007-12-20 | John Pereira | Solder composition |
| US20080175748A1 (en) * | 2005-08-12 | 2008-07-24 | John Pereira | Solder Composition |
| US20070231594A1 (en) * | 2005-08-12 | 2007-10-04 | John Pereira | Multilayer solder article |
| US7749336B2 (en) * | 2005-08-30 | 2010-07-06 | Indium Corporation Of America | Technique for increasing the compliance of tin-indium solders |
| US20070071634A1 (en) * | 2005-09-26 | 2007-03-29 | Indium Corporation Of America | Low melting temperature compliant solders |
| US7825780B2 (en) * | 2005-10-05 | 2010-11-02 | Telecommunication Systems, Inc. | Cellular augmented vehicle alarm notification together with location services for position of an alarming vehicle |
| US7907551B2 (en) * | 2005-10-06 | 2011-03-15 | Telecommunication Systems, Inc. | Voice over internet protocol (VoIP) location based 911 conferencing |
| US20070172381A1 (en) * | 2006-01-23 | 2007-07-26 | Deram Brian T | Lead-free solder with low copper dissolution |
| US8150363B2 (en) | 2006-02-16 | 2012-04-03 | Telecommunication Systems, Inc. | Enhanced E911 network access for call centers |
| US8059789B2 (en) | 2006-02-24 | 2011-11-15 | Telecommunication Systems, Inc. | Automatic location identification (ALI) emergency services pseudo key (ESPK) |
| US7471236B1 (en) | 2006-03-01 | 2008-12-30 | Telecommunication Systems, Inc. | Cellular augmented radar/laser detector |
| US8208605B2 (en) * | 2006-05-04 | 2012-06-26 | Telecommunication Systems, Inc. | Extended efficient usage of emergency services keys |
| US20080261619A1 (en) * | 2006-09-26 | 2008-10-23 | John Gordon Hines | Injection of location object into routing SIP message |
| US7966013B2 (en) * | 2006-11-03 | 2011-06-21 | Telecommunication Systems, Inc. | Roaming gateway enabling location based services (LBS) roaming for user plane in CDMA networks without requiring use of a mobile positioning center (MPC) |
| US20080157910A1 (en) * | 2006-12-29 | 2008-07-03 | Park Chang-Min | Amorphous soft magnetic layer for on-die inductively coupled wires |
| US20080167018A1 (en) * | 2007-01-10 | 2008-07-10 | Arlene Havlark | Wireless telecommunications location based services scheme selection |
| KR101167549B1 (ko) * | 2007-07-18 | 2012-07-20 | 센주긴조쿠고교 가부시키가이샤 | 차재 전자 회로용 Ｉｎ 함유 무납 땜납 |
| GB2455486A (en) * | 2008-03-05 | 2009-06-17 | Quantum Chem Tech Singapore | A sputtered film, solder spheres and solder paste formed from an Sn-Ag-Cu-In alloy |
| CN101474728B (zh) * | 2009-01-07 | 2011-06-01 | 高新锡业（惠州）有限公司 | 无铅软钎焊料 |
| US9841282B2 (en) | 2009-07-27 | 2017-12-12 | Visa U.S.A. Inc. | Successive offer communications with an offer recipient |
| CN109702372A (zh) * | 2019-03-06 | 2019-05-03 | 上海莜玮汽车零部件有限公司 | 无铅焊料合金及其应用 |
| CN113798725B (zh) * | 2021-10-13 | 2022-10-04 | 浙江强力控股有限公司 | 选择性波峰焊用免焊剂无铅焊料及其制备方法 |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0235546A2 (de) * | 1986-02-19 | 1987-09-09 | Degussa Aktiengesellschaft | Verwendung einer Weichlotlegierung zum Verbinden von Keramikteilen |
| EP0307638A1 (de) * | 1987-09-12 | 1989-03-22 | DEMETRON Gesellschaft für Elektronik-Werkstoffe m.b.H. | Verwendung von Legierungen aus Zinn und/oder Blei als Weichlote zum Aufbringen von Halbleitern auf metallische Träger |
| JPH0952191A (ja) * | 1995-08-11 | 1997-02-25 | Uchihashi Estec Co Ltd | はんだ合金及びペ−スト状はんだ |
| WO1997009455A1 (en) * | 1995-09-01 | 1997-03-13 | Sarnoff Corporation | Soldering composition |
| US6077477A (en) * | 1996-06-06 | 2000-06-20 | Matsushita Electric Industrial Co., Ltd. | Solder alloy of electrode for joining electronic parts and soldering method |
| JP2000349433A (ja) * | 1996-02-09 | 2000-12-15 | Matsushita Electric Ind Co Ltd | はんだ付け方法 |
| US6176947B1 (en) * | 1998-12-31 | 2001-01-23 | H-Technologies Group, Incorporated | Lead-free solders |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW251249B (enExample) * | 1993-04-30 | 1995-07-11 | At & T Corp | |
| US5520752A (en) * | 1994-06-20 | 1996-05-28 | The United States Of America As Represented By The Secretary Of The Army | Composite solders |
| JP3874031B2 (ja) | 1995-11-29 | 2007-01-31 | 内橋エステック株式会社 | 無鉛はんだ合金 |
| KR980006783A (ko) | 1996-05-13 | 1998-03-30 | 이. 힐러 윌리엄 | 저가의 위상 고정 모터 제어 방법 및 구조 |
| JPH10314980A (ja) * | 1997-05-14 | 1998-12-02 | Sony Corp | はんだ材料 |
| JPH11221694A (ja) * | 1998-02-06 | 1999-08-17 | Hitachi Ltd | 鉛フリーはんだを用いた実装構造体およびそれを用いた実装方法 |
| US5938862A (en) * | 1998-04-03 | 1999-08-17 | Delco Electronics Corporation | Fatigue-resistant lead-free alloy |
| JP2000141078A (ja) * | 1998-09-08 | 2000-05-23 | Nippon Sheet Glass Co Ltd | 無鉛ハンダ |
| WO2000018536A1 (en) * | 1998-09-30 | 2000-04-06 | Matsushita Electric Industrial Co., Ltd. | Soldering material and electric/electronic device using the same |
| JP3753168B2 (ja) * | 1999-08-20 | 2006-03-08 | 千住金属工業株式会社 | 微小チップ部品接合用ソルダペースト |
| JP4338854B2 (ja) * | 1999-11-25 | 2009-10-07 | 三井金属鉱業株式会社 | スズ−ビスマス系無鉛はんだ |
| AU2001214037A1 (en) * | 2000-11-16 | 2002-05-27 | H-Technologies Group Incorporated | Lead-free solders |
-
2001
- 2001-07-09 SG SG200104071-6A patent/SG139507A1/en unknown
- 2001-08-09 MY MYPI20013738 patent/MY123567A/en unknown
- 2001-08-17 US US09/932,793 patent/US6843862B2/en not_active Expired - Lifetime
- 2001-09-05 CN CNB011326336A patent/CN1235717C/zh not_active Expired - Lifetime
- 2001-10-09 TW TW090124883A patent/TW592869B/zh not_active IP Right Cessation
- 2001-11-30 JP JP2001367169A patent/JP3795797B2/ja not_active Expired - Lifetime
-
2002
- 2002-01-22 DE DE60201542T patent/DE60201542T2/de not_active Expired - Lifetime
- 2002-01-22 WO PCT/GB2002/000259 patent/WO2003006200A1/en not_active Ceased
- 2002-01-22 RU RU2004103629/02A patent/RU2268126C2/ru active
- 2002-01-22 AU AU2002226534A patent/AU2002226534B2/en not_active Expired
- 2002-01-22 BR BR0210970-0A patent/BR0210970A/pt not_active Application Discontinuation
- 2002-01-22 PT PT02716141T patent/PT1404483E/pt unknown
- 2002-01-22 DK DK02716141T patent/DK1404483T3/da active
- 2002-01-22 HU HU0401432A patent/HU229014B1/hu unknown
- 2002-01-22 PL PL364627A patent/PL201507B1/pl unknown
- 2002-01-22 MX MXPA04000229A patent/MXPA04000229A/es active IP Right Grant
- 2002-01-22 CZ CZ20040209A patent/CZ303793B6/cs not_active IP Right Cessation
- 2002-01-22 ES ES02716141T patent/ES2230477T3/es not_active Expired - Lifetime
- 2002-01-22 EP EP02716141A patent/EP1404483B1/en not_active Expired - Lifetime
- 2002-01-22 AT AT02716141T patent/ATE278502T1/de active
- 2002-01-22 NZ NZ530220A patent/NZ530220A/en not_active IP Right Cessation
-
2004
- 2004-01-09 NO NO20040106A patent/NO337878B1/no not_active IP Right Cessation
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0235546A2 (de) * | 1986-02-19 | 1987-09-09 | Degussa Aktiengesellschaft | Verwendung einer Weichlotlegierung zum Verbinden von Keramikteilen |
| EP0307638A1 (de) * | 1987-09-12 | 1989-03-22 | DEMETRON Gesellschaft für Elektronik-Werkstoffe m.b.H. | Verwendung von Legierungen aus Zinn und/oder Blei als Weichlote zum Aufbringen von Halbleitern auf metallische Träger |
| JPH0952191A (ja) * | 1995-08-11 | 1997-02-25 | Uchihashi Estec Co Ltd | はんだ合金及びペ−スト状はんだ |
| WO1997009455A1 (en) * | 1995-09-01 | 1997-03-13 | Sarnoff Corporation | Soldering composition |
| JP2000349433A (ja) * | 1996-02-09 | 2000-12-15 | Matsushita Electric Ind Co Ltd | はんだ付け方法 |
| US6077477A (en) * | 1996-06-06 | 2000-06-20 | Matsushita Electric Industrial Co., Ltd. | Solder alloy of electrode for joining electronic parts and soldering method |
| US6176947B1 (en) * | 1998-12-31 | 2001-01-23 | H-Technologies Group, Incorporated | Lead-free solders |
Also Published As
| Publication number | Publication date |
|---|---|
| NZ530220A (en) | 2005-05-27 |
| US20030007886A1 (en) | 2003-01-09 |
| PL364627A1 (en) | 2004-12-13 |
| NO20040106L (no) | 2004-03-09 |
| HK1053278A1 (en) | 2003-10-17 |
| MXPA04000229A (es) | 2005-03-07 |
| BR0210970A (pt) | 2004-06-08 |
| DE60201542D1 (de) | 2004-11-11 |
| EP1404483B1 (en) | 2004-10-06 |
| PT1404483E (pt) | 2005-01-31 |
| RU2268126C2 (ru) | 2006-01-20 |
| RU2004103629A (ru) | 2005-06-10 |
| JP2003039193A (ja) | 2003-02-12 |
| TW592869B (en) | 2004-06-21 |
| ATE278502T1 (de) | 2004-10-15 |
| CN1235717C (zh) | 2006-01-11 |
| ES2230477T3 (es) | 2005-05-01 |
| CN1396039A (zh) | 2003-02-12 |
| MY123567A (en) | 2006-05-31 |
| HUP0401432A2 (en) | 2004-11-29 |
| WO2003006200A1 (en) | 2003-01-23 |
| AU2002226534B2 (en) | 2006-11-09 |
| US6843862B2 (en) | 2005-01-18 |
| SG139507A1 (en) | 2008-02-29 |
| PL201507B1 (pl) | 2009-04-30 |
| JP3795797B2 (ja) | 2006-07-12 |
| HU229014B1 (en) | 2013-07-29 |
| DK1404483T3 (da) | 2004-11-22 |
| NO337878B1 (no) | 2016-07-04 |
| DE60201542T2 (de) | 2005-02-03 |
| EP1404483A1 (en) | 2004-04-07 |
| CZ2004209A3 (cs) | 2004-09-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CZ303793B6 (cs) | Bezolovnatá pájka, zpusob její prípravy a zpusob pájení | |
| AU2002226534A1 (en) | Improvements in or relating to solders | |
| US6296722B1 (en) | Lead-free solder alloy | |
| CA2288817C (en) | Lead free solder alloy | |
| US9357657B2 (en) | Lead-free solder alloy for printed circuit board assemblies for high-temperature environments | |
| JP4282482B2 (ja) | はんだ合金およびはんだ接合部 | |
| KR20080048513A (ko) | 무연 저온 땜납 | |
| CN1311950C (zh) | 无铅焊接合金和焊接材料以及使用这些材料的焊接接点 | |
| US20020057986A1 (en) | Solders | |
| Ma et al. | Isothermal aging effects on the mechanical shock performance of lead-free solder joints | |
| Maveety et al. | Effect of cooling rate on microstructure and shear strength of pure Sn, Sn-0.7 Cu, Sn-3.5 Ag, and Sn-37Pb solders | |
| JPH10166178A (ja) | Ｐｂフリーはんだ材料及びそれを用いた電子機器 | |
| Hunt et al. | Impact of lead contamination on reliability of lead free alloys | |
| CN103586598A (zh) | 无铅锡条 | |
| Steiner et al. | Solderability of the lead free surface finishes | |
| Lee et al. | Study of intermetallic growth on PWBs soldered with Sn/sub 3.0/Ag/sub 0.5/Cu | |
| Vianco | Lead-Free Surface Finishes: Compatibility with Assembly Processes and Interconnection Reliability. | |
| Guruprasad | Micro impact fatigue testing of solder joints | |
| Vianco et al. | Prototype circuit boards assembled with non-lead bearing solders | |
| Farrell et al. | Lead-Free Process Transition-Phase II: Paste Performance Assessment by Surface Finish and Mechanical Strength Correlation | |
| Prasad | Metallurgy of Soldering and Solderability | |
| Jahari | Properties of Low Temperature Indium-based ternary lead free solders system | |
| Ewell | Current Trends and Future Issues in Solderability | |
| JP2007105798A (ja) | はんだ接合部を有する電気・電子機器 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Patent lapsed due to non-payment of fee |
Effective date: 20210122 |