TW592869B - Improvements in or relating to solders - Google Patents

Improvements in or relating to solders Download PDF

Info

Publication number
TW592869B
TW592869B TW090124883A TW90124883A TW592869B TW 592869 B TW592869 B TW 592869B TW 090124883 A TW090124883 A TW 090124883A TW 90124883 A TW90124883 A TW 90124883A TW 592869 B TW592869 B TW 592869B
Authority
TW
Taiwan
Prior art keywords
solder
tin
copper
lead
silver
Prior art date
Application number
TW090124883A
Other languages
Chinese (zh)
Inventor
Kai-Hwa Chew
Wei-Chih Pan
Original Assignee
Quantum Chem Tech Singapore
Singapore Asahi Chemical & Solder Ind Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to SG200104071-6A priority Critical patent/SG139507A1/en
Application filed by Quantum Chem Tech Singapore, Singapore Asahi Chemical & Solder Ind Pte Ltd filed Critical Quantum Chem Tech Singapore
Application granted granted Critical
Publication of TW592869B publication Critical patent/TW592869B/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/26Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262Sn as the principal constituent

Abstract

A substantially lead-free solder with enhanced properties comprises from 88.5% to 93.5% tin; from 3.5% to 4.5% silver; from 2.0% to 6.0% indium; and from 0.3% to 1.0% copper. The solder may also comprise up to 0.5% of an anti-oxidant or anti-skinning additive. A solder embodying the invention finds particular utility in wave-soldering processes where it may be used as a direct replacement for conventional tin/lead solder.

Description

V. Description of the invention (1) Specific ::: Ι Γ: There are solders, especially solders without errors, which include 右 ^, silver, indium, and copper, and the solder can also contain a certain amount of anti-lice Chemical additives or anti-stripping additives. The proportion of daggers is used in the wave-shaped soldering process. The soldering materials are particularly suitable. Furthermore, it can directly replace the traditional tin / wrong soldering. “Many traditional solders with gold usually have good physical properties. J = 7 knives. This type of solder solder” includes the production of printed circuit boards. The use of lead is common. For 37% of the solder, it is not equal to f '. For example, the demand for tin containing 63% and lead is increasing: based on; $ type: f? Process, however, many countries for solder j 迕Etc. Lead-free legal requirements in the coming years. Ik 4 Xixi project will be set to contain a small amount or the industry early in the deployment of benefit gold L, solder paste-generally has poor physics; m =, its traditional lead-free mobility is low, compatible with existing coatings = = Wetness, the use of helmet correction, Lu coarse private, good, and too much residue. However, the specific problem of the board's wear and tear is the protrusion of the weld and the separation of the printed materials. Another problem is that ^ the weld seam will be in contact with the solder and the bottom material such as gold / gold coating will be in contact with the solder:; ::: =:; the solution rate is very high, and the original, the industry's original; v use In addition, the current application may have to be replaced to be compatible with error-free solder, especially 1 Η 佶 ::, the adjustment of raw materials is widely regarded as the poor use of resources / 疋 σ made of lead-free solder Article standards, usually far from page 4 592869 V. Description of the invention (2) Lead-free solders that are lower than the main tins of the traditional tin containing lead, which are tin, silver, indium, copper, such as phosphorus or other The solder has the characteristics of oblique solder. Regardless of the compatibility, the lead-containing solder of the welding seam must be compared to the lead to achieve a significant improvement. Another aspect of this creation is the use of other lead-free solder component coatings. It is not necessary for the creation of another article standard to make your review better. Although this creation will limit the creation to the following, the lead-free solder of the present invention: from 8% to 4.5% silver. · 3% to 1 · 〇 solder. The purpose is to provide a non-gold, non-gold, and non-gold material that greatly improves the humidity, copper solution, and more lead-free solder. The purpose is the same. The technical layer of this preferred embodiment is 8.5%; copper from 2.5%. The alloy's proportions are the characteristics of the compound, the fluidity and the addition of the properties. The properties must be replaced with a more straight composition, oxidation resistance or element, in other words, the effect of using the solder on the scum does not change the existing use. In comparison, lead-free replacements contain specific agents or anti-stripping agents. Compared with this, there are zero groups in this discovery, which can be used as a standard. Lead solder, mechanical, soldering system, the proportion of conventional lead soldering is added to the known no-ware coatings, publicity, environmental protection, no need for process or zero process far more than providing a lead-free solder, the traditional lead-containing solder. & The structure and efficacy of the case will be further matched with the drawings, and detailed as follows: The examples will be described in detail, but will go to the center. In the noodles, it is provided by the following composition to 93.2% tin; from 3. $ 0% to 6.0% indium; from
592869 V. Description of the invention (3) Luo, Tian: The solder of Jin Yuming can also contain 0.5% antioxidant or anti-stripping such as scale or other non-metallic compounds or yuan silver, 4.0% containing 9 1.3% tin, 4.2% 40% indium, and 0.5% copper. 4 ί The best solder combination, including 9 1 · 39% tin, 〇 · 〇;%: Phosphorous 4 · 0% indium, 0 · 5% copper, and including another technical level 'provides manufacturing lead-free Method of soldering 8 8 ^ The steps of silver, indium and copper: the proportion of tin in solder is from 40 f 9 3.2%; the proportion of silver in solder is from 3.5% to above (the ratio of indium in solder is from 0 ′ The proportion of copper in 2 is from 0.3% to 1.0%. In other words, the method of making solder = can include an anti-oxidant or anti-stripping additive in the solder mixture. The preferred method of soldering involves stirring tin, copper, indium and copper as follows: the tin ratio in step 2 is 91.3%; the silver ratio in the solder is 0.5%. The ratio of indium in the material is 4.〇%; Copper in solder is better than indium and steel: ^ Τ: J: The preferred method of solder includes stirring the ratio of tin, silver, and silver. The ratio of tin in the solder is 91.3%; in the solder The copper ratio h is 1%, the indium ratio made by the solder is 4.0%; the solder according to the present invention is further: .5%, and the phosphorus ratio in the solder is 0.00%. The technical level is provided with error-free solder II. Welding Method, including the steps of making M: from 88.5% to 93.5% tin; from 592869 V. Description of the invention (4) 3.5% to 4.5% silver; from 2.0% to 6.0% indium From 0. 3% to 1.0% copper. The preferred method is to use solder with the following composition: 9 1 · 3% tin, 4.1% silver, 4.0% indium, and 0 · 5% copper. A more convenient method uses solder with the following components: 9 1 · 39% tin, 4 · 1% silver, 4 · 0% indium, 0 · 5% copper and 0 · 0 1% Phosphorus. A more powerful method involves a wave soldering step using lead-free solder. To demonstrate the superior properties of the invented solder, five tests were performed, as described below. These tests were performed on the better solders invented , Which is referred to herein as Alloy 349, and contains 9 1 · 39% tin, 4 · 1% silver, 4 · 0% indium, 0 · 5% copper, and 0 · 01%. The first test of the wetness of the solder samples of the invention, such as eight existing lead-free solders and traditional lead-containing solders compared to the known solder samples. The nine known solders are as follows: 1 Composition of the solder: 63% tin; 37% lead. 2 · Composition of the first lead-free solder: 99 · 3% tin; 0 · 7% copper. 3 · Composition of the second lead-free solder : 9 6 · 5% tin; 3 · 5 silver.
4 · Composition of a third lead-free solder (herein referred to as VI ROM ET 2 17): 8 8 · 3% tin; 3 · 2%
592869 V. Description of the invention (5) silver; 4.5% bismuth; 4.0% indium.
5. The composition of the fourth lead-free solder (herein referred to as VIROM ET 4 11): 92% tin; 2% copper; 3% silver; 3% bismuth. 6. Composition of the fifth lead-free solder (herein referred to as VI ROM ET 5 1 3): 92. 8% tin; 0.7% copper; 0.5% gallium; 6% indium. 7 · Composition of the sixth lead-free solder: 9 3 · 5% tin;
3 · 5% silver; 3 · 0% silver 0 8 · Composition of seventh lead-free solder: 9 5 · 5% tin; 4 · 0% silver; 0 · 5% copper. 9 · Composition of the eighth lead-free solder: 9 6 · 0% tin; 2 · 5% silver; 1 · 0% bismuth; 0 · 5% copper.
The first technical level of the first test includes the measurement of wet time according to the American National Standards Institute (ANSI) / JStd — 003 in various temperature ranges from 235 ° C to 2 65 ° C. In this test First, the copper samples were immersed in an appropriate amount of each dissolved solder, and then the copper samples were connected to a sensitive force measuring device, and arranged in such a way that the vertical force of the samples could be measured and recorded. The change in vertical force on the copper sample when immersed in the dissolved solder is due to
(8) The term "item" is buoyancy. Since the solder joint is equal to the weight of the solder displaced by the sample, increasing the specific direction of the sample can be calculated and included in the degree = known. Therefore, the two factors of this brother are the forces acting on the sample due to the solder surface. In each case, the time required for the surface contact angle to change and the wet force to be equal to zero. Meaning: The result of the first technical level of the item Γ test is shown as 1m * Γ The solder present invention at each temperature & shown in the figure, compared to the traditional lead-containing The display of the solder, except this: the wet time represented by: the wet time, the solder adhesion / 烊 枓 measured at the solder time of the present invention. The properties of the invented materials are fault-free solder. _ _Technical layer® towel ’s overall superiority to other current ones. Figure 2 shows the results at the individual surgery level graphically as shown below. Performance results of traditional error-containing solders, and the solder of the present invention; The second technical aspect of the following item :: is that the relevant solder is immersed in the sample and the solder is the same as the sample σ :: measures the large wet force, as described above, wet Adhesion of the force material to the bottom: The adhesion force of the dip 1 is obviously that the wet force is the best feature to provide welding. —Effective strength index, so the low humidity time is more unexpected than the fifth. Explanation of the invention (7) Now one member ^ " The second technical level of the social fruit such as 筮 ^ @ Sample 2. 〇 After the next, this The solder of the invention is almost the same as the immersion material, but some existing ones are similar to the traditional solder containing viR〇MET = = but the solder contains only the wet force of the material. In all the slightly better overall results, the solder of the invention 4 Yes ;;; ::: Close to the traditional solder containing solder, this item-test is found, close to the traditional solder containing solder. Figure 4, from this; the shape of the results are shown graphically as close to :; the error-containing solder of the system is other error-free; the result of = = It can be seen from the results of a test that the present invention The error-containing solder is very similar. Very = 枓 :: wet. It is suggested that the solder of the present invention is suitable to replace the traditional solder with error.] The first test is to compare the traditional solder quality of the present invention. In the second test, the wrong solder based on the material: "Seven other non-rules The composition of the traditional lead-free contamination containing 1 and 2 is: 9 9 · 3% tin · 2 · η-μ ^ · 7% steel. The composition of a lead-free consumable: 9 β · 5 % Tin · Page 10 592869 V. Description of the invention (8) 3 · 5 Silver.
3. Composition of the third lead-free solder (herein referred to as VIROM ET 217): 88. 3% tin; 3.2% silver; 4.5% bismuth; 4.0% indium 4. Composition of a lead-free solder (herein called VIROMET HF): 92% tin; 0. 7% copper; 0.5% gallium
; 6% indium. 5 · Composition of the fifth lead-free solder: 9 3 · 5% tin; 3 · 5% silver; 3 · 0% grade. 6 · Composition of the sixth lead-free solder: 9 5 · 5% tin; 4 · 0% silver; 0 · 5% copper. 7. The composition of the seventh lead-free solder: 96% tin; 2.5% silver; 0.5% copper;
1 · 0% level. The first technical aspect of the second test is to determine the dissolution temperature, the coefficient of thermal expansion (C T E), and the specific gravity (SG) of the solder under test. The results are listed in Figure 5 and graphically represented in Figure 6. It can be seen from the chart that the alloy 3 4 9 solder of the present invention proves to have a coefficient of thermal expansion very close to that of the conventional lead-containing solder, thus greatly reducing
Page 11 ^ 〇Oy V. Description of the invention (9) This issue = yes, there is a wide range of concerns about the incompatibility between the components and the base plate. The second test of this test was H-centricity, maximum load, and flexure. Measure the tensile strength of various solders. The graph shows that the tensile strength and buckling of the parent alloy mismatch the solder. The ρ ^ made by the alloy of the present invention is better, so it shows that it is solid. The increase in quilting may be more than that of traditional leaded solders in various industries. The increase in Yijin L, Dudou 1L Π3 welding preservative coatings (〇′p ®) shows that when organic road boards are used with error-free solder, In the third test of the nickel / gold paint penetrating hole printed electricity, the second is the tendency of U protrusions, that is, the inventors tested various kinds of lead-free solder materials of this type: a gold 3 4 9 and The following six types of existing error-free soldering 2 4 The first type of lead-free solder The second type of lead-free solder The second type of lead-free solder The fourth type of lead-free solder The fifth type of lead-free solder
V R 0 Μ E T • 3% tin; 3 5% Μ; 4. 8 9 · 8% tin; 3 1 · 0% secret; 6.8 8 · 8% tin; 30% Μ; 0 2 17. • 2% silver and 0%. • 2% silver and 0% indium. • 2% silver, 0% indium, 0.45% tin, 4.0% silver, 0.5% copper, and 1.0% bismuth. Page 12 V. Description of the invention (10) V. Description of the invention (10) 1 0 10 The above materials are compared with the projecting materials (dissolved solder concentration, calculated according to the chart, the first lead-free solder measured by the Institute and the error-free solder) Three lead-free solders 2 6. 6th lead-free solder: 9 6. The results of the third test are described in 9th tin, 3.5% silver. Figure a and Figure B show the nickel / gold and organic welding Figure 10A and the use of the alloy 3 4 9 of the present invention: a photomicrograph of a coating (0SP) example 'These results are clearly divided into two different The problem of soldering with nickel / gold coating and using the present invention can be ruled out. The fourth test of the welding seam of the left-hole printed circuit board is to compare the helmet of the present invention (δ 3% tin / 37% lead).枓 Same as traditional leaded soldering rate: ^ Same as v IR 〇 Μ ET 217 and two existing lead-free solders. 99.3% tin; 0.7% steel. 99 · 5% tin; 4.0% silver; ρ, + ρ + + from rainbow — 0.5% copper. The medium-fi line immerses a known weight of flux-treated copper plate into the dissolved _, and then uses a combined induction plasma device to measure the copper. Calculation: recap: copper concentration ratio in Π vs. steel immersed in solder = ^: The results of the test are described in Figure 11 and Figure 12, respectively, and the results are invented, as shown in Figure 11 and Figure 1. As shown in Figure 2, the copper dissolution rate of gold is slightly higher than that of traditional lead-containing solders, but among the lead-containing solders of a ^, the dissolution rate of steel is the lowest. Description of the invention (11) Connect the machine, dissolve the solder in an appropriate amount of wave-shaped solder, and place the circuit board on the surface of the pot material. Vibration = stimulus: ripple spreads to the entire dissolved solder.) To the dissolving solder; part of all parts must be in contact with the dissolving solder. 卞 μ plate facing down on the surface of the existing error-free solder 'floating volume phase in the existing solder pot'. After using it, there is nothing wrong. The fifth test is to determine that the combination of the present invention is compared to the conventional 63% tin / 37% lead solder pad.] = 9 烊 枓, the amount of scum: dry Shixing two other lead-free solders 1. The first lead-free solder: viroMet 2 ^: two error-free solders: 99.3% tin; 0.7% copper. 2nd error-free solder: 9 5 · 5% tin; 4.0% silver; 0.5% copper. In this test, the solder is used to simulate the value of the solder pot, and μ has m ^, in the dissolved beans of the wave soldering machine ... I There are 'moving machines' that are used to accommodate the use of solder,:, used to:: The machine Γ is in the same way as traditional tin / wrong solder. At 2 ί = "The machine is in a normal air environment. i. 8 m / 的 盆 , 盆 下 # 作, and the circuit board is conveyed to the basin at a speed of 1.4 ~ A. After 15 minutes of operation, each time ^ four-person, Determine the weight produced by each wave-shaped welding process:; :: The floating weight is measured, and the quantity u is measured per hour = Ling; and then the weight J / room rate is determined. , Invention description ( 12) The results are tabulated in Figure 13 which clearly shows that the dross generated by the solder of the present invention is lower than all solders (except only one lead-free solder) and more than the floatation of traditional ship-containing solder. low. In summary, from the above results, it can be seen that the lead-free solder of the present invention is very suitable for direct replacement due to the properties of wetness, fluidity, compatibility with existing component coatings, weld protrusions and scum. Traditional leaded solder.
Page 15 592869 592869 Brief description of the drawings The data in Figure 11 are shown graphically. It is a list of various solder scum levels including the invented solder. Presented
Page 17

Claims (1)

  1. 5928 VI. Scope of patent application 1 · An error-free solder, including: from 8 8 · 5% to 9 3 · 2% tin from 3 · 5% to 4 · 5% silver; . Marriage of the copper spoon spoon Λ3. ^ Trr 0 / %% item 〇〇 1. · 61st round to the top%% profit 〇 3 special • • Please apply 2 〇 to add from Congru 2. For its material, adding materials, adding solder, dropping lead strips, or preventing chemical damage from oxygen, ^ ~ _% of the resistance Λ- 巳% ί 5 special • Please apply for the application of such materials as 3 materials. Materials Welding Lead or no-things combination of the gold 2 uhr 4 ¥ 々 shells to cover the scope or to fill in the specific means refer to the application such as 4% of the cause ο 4 Gen% 2 4 Λ tin. % Copper 3's.%-H LO 9. There is no τ ~ _ with the content of 5 as in 4 of the material, solder silver #, all the 4 items, 3 tin or% 2 9 or 3 1— I · $ ^ 1 Round 9 Fan Lihan Special materials please hit, 6 Bronze. % ΑΦ 1—Η, ο tin • mixed with copper indium, mixed with copper-containing cladding,% method 5 methods • made, welded with indium material% wrong ο none > _ 彐 彐 一 1 Species% 2 3 9 to% 5 8 8 are examples: the soldering step of the soldering step is lower than tin solder 5 0 4 6 to%% 5 0 3 2 is an example of dbt bt IP Gen As in AMV AMV Λρ / Θ The middle and middle materials are made by welding method. %% o Welding 1 &I; %% of the above are described in 3 cases • Item 0 6 is the case of Fan Tongli's junior high school, please apply for welding such as 7 peeling or agent / 1% of oxygen resistance 5 ο Add ^ 1 agent into the mix. Welding materials
    Page 18 592869-U, Application 8 · The method for producing an error-free solder as described in item 6 of the scope of patent application, wherein the additive is $ 粦 or other non-metallic compounds or elements. 9 · The method for producing an error-free solder as described in item 6 of the scope of patent application, wherein the mixing ratio of tin, silver, indium and copper is as follows: The tin ratio in the solder is 9 1 · 3%; the silver ratio in the solder It is 4.2%; the proportion of indium in the solder is 4%; the proportion of copper in the solder is 0.5%. 1 0 · The method for making a lead-free solder as described in item 6 or 7 or 8 of the scope of patent application, wherein the mixing ratio of tin, silver, indium, copper and phosphorus is as follows: The tin ratio in the solder is from 9 1 · 3 9%; the proportion of silver in the solder is 4.1%; the proportion of indium in the solder is 4%; the proportion of copper in the solder is 0.5%; the proportion of phosphorus in the solder is 0.1%. 1 1 · A soldering method using shipless solder, comprising: 88.5% to 93.5% tin; 3.5% to 4.5% silver; 2.0% to 6.0% indium; 0 · 3% to 1.0% copper. 1 2 · The soldering method using lead-free solder as described in item 11 of the scope of patent application, wherein the solder is added with an anti-oxidant or anti-peeling additive of 0.5%.
    Page 19 _ VI. Scope of Patent Application 1 3 · If the scope of patent application is for welding methods, compounds or elements. 1 4 · As for the method of patent application, in which 4% indium and copper 0 1 5 · As for the method of patent application, tin 9 1 · 3 9% copper 0 · 5% and phosphorus 16 · as applied Patent range Lead-free solder wave soldering method 17 · As in the patent application method, the silver content is 4.1%, and the indium phosphorus is 0. 0 1 ° / 〇. 18 · If you apply for a patent scope method, it can also be applied. The use of lead-free solder as described in item 11 or 12 wherein the additives refer to fillers or other non-metals. The use of lead-free solder as described in item 11 contains tin 91.3%, silver 4.2%, • 5% 〇 The use of lead-free solder as described in item 1 1 or 12 above, wherein the solder used includes silver 4.1%, indium 4.0%, and 0.11%. The method described in item 11 or 12 or 14 can also be used on lead-free solder. The solder used for soldering using lead-free solder as described in item 13 includes tin 9 1 · 39%, 4 · 0%, copper 0.5% and solder using lead-free solder as described in item 13 for use in lead-free solder. Wave-shaped welding method❿
    Page 20 9 6 8 2-9 Η Positive charge% 0 b〇on NJ ^ ΓΛ N-) ^ Τλ 2 r Fresh tin temperature: / 〇m ◦ 0.546 0.606 0.767 63 Tin 37 lead soldering time 0.165 0.682 1.034 1.411 99.3 Tin / 0.7 copper 0.74 Η-^ 1.352 2.189 96.5 tin / 3.5 silver 0.244 0.544 0.716 1.156 alloy 349 0,476 0.569 0.791 0.949 Viromet217 0.496 0.587 0.869 1.036 Viromet411 0.597 0.822 1.072 1.758 Viromet 513 0.653 0.814 1.669 3.173 96 · 5 tin / 3.5 silver / 3.0 Bismuth 1.048 1.284 1.946 3.368 95.5 tin / 4.0 silver / 0.5 copper 0.668 0.824 1.235 1 —— * · bo 96 tin / 2.5 silver / 1.0 bismuth / 0.5 copper 59286Γ9 Scream! If schema_Β ______ —tss ^ +99.3 Yi / 0.73ΓI96 · Ϊ / 3Ϊ Mingling 349 — ^ t-viromet 200 —Viromet 400 —I—vlrom & soo-: 96 · 5 Agriculture / 3.5 Choice / 3.0 Huan ——95 · ί 40SS ί / 15 s-2 / ο.ϊ I _
    • · 592869 丨 month 丨 said to modify the f 1 mine 'formula i §ίί Jue — Ν3 · υϋ μπ
    And 20S ^^ Λ ^^ ίΛ 6.51-
    Page 24 592869 丨 Made 11 丨 Figure 0 (m3 0 25 · 20 · 15 · 1〇t
    D63s75fe 99l ^ l □ 96Λδβι □ viroit 217 Ming Yin 34SO □ f I 96 · 5 Miao / 3.5 & /0.51Γ □ 95.5 桊 / 4 fee 0.5 stimulus _96 farm / 2.5 £ .5 food / 1 Huan page 26 92
    Xiu Weng style picture ¢ 00 ^ ftas
    Yiyu φ φ slave page
    Page 592 869
    Page 31, 5928 yards
    Figure ‘Formation Copper dissolution rate in lead-free alloy Copper concentration / Copper dissolution rate 0.2 0.1 S 0.1 0.05 Reference ^ ^ ^ Let Type of solder □ Copper concentration □ Copper solubility Page 12 2 Page 33
TW090124883A 2001-07-09 2001-10-09 Improvements in or relating to solders TW592869B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SG200104071-6A SG139507A1 (en) 2001-07-09 2001-07-09 Improvements in or relating to solders

Publications (1)

Publication Number Publication Date
TW592869B true TW592869B (en) 2004-06-21

Family

ID=20430801

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090124883A TW592869B (en) 2001-07-09 2001-10-09 Improvements in or relating to solders

Country Status (22)

Country Link
US (1) US6843862B2 (en)
EP (1) EP1404483B1 (en)
JP (1) JP3795797B2 (en)
CN (1) CN1235717C (en)
AT (1) AT278502T (en)
AU (1) AU2002226534B2 (en)
BR (1) BR0210970A (en)
CZ (1) CZ303793B6 (en)
DE (1) DE60201542T2 (en)
DK (1) DK1404483T3 (en)
ES (1) ES2230477T3 (en)
HK (1) HK1053278A1 (en)
HU (1) HU229014B1 (en)
MX (1) MXPA04000229A (en)
NO (1) NO337878B1 (en)
NZ (1) NZ530220A (en)
PL (1) PL201507B1 (en)
PT (1) PT1404483E (en)
RU (1) RU2268126C2 (en)
SG (1) SG139507A1 (en)
TW (1) TW592869B (en)
WO (1) WO2003006200A1 (en)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8918073B2 (en) * 2002-03-28 2014-12-23 Telecommunication Systems, Inc. Wireless telecommunications location based services scheme selection
US9154906B2 (en) 2002-03-28 2015-10-06 Telecommunication Systems, Inc. Area watcher for wireless network
JP2004179618A (en) * 2002-10-04 2004-06-24 Sharp Corp Solar cell, its manufacturing method, interconnector for solar cell, string, and module
JP2004146464A (en) * 2002-10-22 2004-05-20 Sharp Corp Solar cell, its manufacturing method, inter-connector therefor, string, and module
US7282175B2 (en) * 2003-04-17 2007-10-16 Senju Metal Industry Co., Ltd. Lead-free solder
US7111771B2 (en) * 2003-03-31 2006-09-26 Intel Corporation Solders with surfactant-refined grain sizes, solder bumps made thereof, and methods of making same
US20040187976A1 (en) * 2003-03-31 2004-09-30 Fay Hua Phase change lead-free super plastic solders
US7750475B2 (en) * 2003-10-07 2010-07-06 Senju Metal Industry Co., Ltd. Lead-free solder ball
US20050100474A1 (en) * 2003-11-06 2005-05-12 Benlih Huang Anti-tombstoning lead free alloys for surface mount reflow soldering
EP1560272B1 (en) * 2004-01-29 2016-04-27 Panasonic Intellectual Property Management Co., Ltd. Solar cell module
WO2005084877A1 (en) * 2004-03-09 2005-09-15 Senju Metal Industry Co. Ltd. Solder paste
US7223695B2 (en) * 2004-09-30 2007-05-29 Intel Corporation Methods to deposit metal alloy barrier layers
US6985105B1 (en) * 2004-10-15 2006-01-10 Telecommunication Systems, Inc. Culled satellite ephemeris information based on limiting a span of an inverted cone for locating satellite in-range determinations
GB2406101C (en) * 2004-10-27 2007-09-11 Quantum Chem Tech Singapore Improvements in ro relating to solders
US20060120911A1 (en) * 2004-12-08 2006-06-08 Manoj Gupta Method of forming composite solder by cold compaction and composite solder
US20070231594A1 (en) * 2005-08-12 2007-10-04 John Pereira Multilayer solder article
US20080175748A1 (en) * 2005-08-12 2008-07-24 John Pereira Solder Composition
US20070292708A1 (en) * 2005-08-12 2007-12-20 John Pereira Solder composition
US20070037004A1 (en) * 2005-08-12 2007-02-15 Antaya Technologies Corporation Multilayer solder article
US20070036670A1 (en) * 2005-08-12 2007-02-15 John Pereira Solder composition
US7749336B2 (en) * 2005-08-30 2010-07-06 Indium Corporation Of America Technique for increasing the compliance of tin-indium solders
US20070071634A1 (en) * 2005-09-26 2007-03-29 Indium Corporation Of America Low melting temperature compliant solders
US7825780B2 (en) * 2005-10-05 2010-11-02 Telecommunication Systems, Inc. Cellular augmented vehicle alarm notification together with location services for position of an alarming vehicle
US7907551B2 (en) * 2005-10-06 2011-03-15 Telecommunication Systems, Inc. Voice over internet protocol (VoIP) location based 911 conferencing
US20070172381A1 (en) * 2006-01-23 2007-07-26 Deram Brian T Lead-free solder with low copper dissolution
US8150363B2 (en) 2006-02-16 2012-04-03 Telecommunication Systems, Inc. Enhanced E911 network access for call centers
US8059789B2 (en) 2006-02-24 2011-11-15 Telecommunication Systems, Inc. Automatic location identification (ALI) emergency services pseudo key (ESPK)
US8208605B2 (en) * 2006-05-04 2012-06-26 Telecommunication Systems, Inc. Extended efficient usage of emergency services keys
US20080261619A1 (en) * 2006-09-26 2008-10-23 John Gordon Hines Injection of location object into routing SIP message
WO2008057477A2 (en) * 2006-11-03 2008-05-15 Telecommunication Systems, Inc. Roaming gateway enabling location based services (lbs) roaming for user plane in cdma networks without requiring use of a mobile positioning center (mpc)
US20080126535A1 (en) * 2006-11-28 2008-05-29 Yinjun Zhu User plane location services over session initiation protocol (SIP)
US20080157910A1 (en) * 2006-12-29 2008-07-03 Park Chang-Min Amorphous soft magnetic layer for on-die inductively coupled wires
US20080167018A1 (en) * 2007-01-10 2008-07-10 Arlene Havlark Wireless telecommunications location based services scheme selection
WO2009011392A1 (en) * 2007-07-18 2009-01-22 Senju Metal Industry Co., Ltd. In-containing lead-free solder for on-vehicle electronic circuit
GB2455486A (en) * 2008-03-05 2009-06-17 Quantum Chem Tech Singapore A sputtered film, solder spheres and solder paste formed from an Sn-Ag-Cu-In alloy
CN101474728B (en) * 2009-01-07 2011-06-01 高新锡业(惠州)有限公司 Leadless soft brazing material
US9841282B2 (en) 2009-07-27 2017-12-12 Visa U.S.A. Inc. Successive offer communications with an offer recipient
CN109702372A (en) * 2019-03-06 2019-05-03 上海莜玮汽车零部件有限公司 Leadless welding alloy and its application

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2023638B3 (en) * 1986-02-19 1992-02-01 Degussa USE OF A LIGHT ALLOY FOR CONNECTION OF CERAMIC PARTS
DE3730764C1 (en) * 1987-09-12 1988-07-14 Demetron Use of tin and / or lead alloys as soft solders to apply semiconductors to metallic substrates
TW251249B (en) * 1993-04-30 1995-07-11 At & T Corp
US5520752A (en) * 1994-06-20 1996-05-28 The United States Of America As Represented By The Secretary Of The Army Composite solders
JP3597607B2 (en) * 1995-08-11 2004-12-08 内橋エステック株式会社 Solder alloy and paste solder
WO1997009455A1 (en) * 1995-09-01 1997-03-13 Sarnoff Corporation Soldering composition
JP3874031B2 (en) 1995-11-29 2007-01-31 内橋エステック株式会社 Lead-free solder alloy
JP3643008B2 (en) * 1996-02-09 2005-04-27 松下電器産業株式会社 Soldering method
KR980006783A (en) 1996-05-13 1998-03-30 이. 힐러 윌리엄 Low cost phase locked motor control method and structure
JPH09326554A (en) * 1996-06-06 1997-12-16 Matsushita Electric Ind Co Ltd Solder alloy for electrode for joining electronic component and soldering method therefor
JPH10314980A (en) * 1997-05-14 1998-12-02 Sony Corp Solder material
JPH11221694A (en) * 1998-02-06 1999-08-17 Hitachi Ltd Packaging structural body using lead-free solder and packaging method using the same
JP2000141078A (en) * 1998-09-08 2000-05-23 Nippon Sheet Glass Co Ltd Leadless solder
WO2000018536A1 (en) * 1998-09-30 2000-04-06 Matsushita Electric Industrial Co., Ltd. Soldering material and electric/electronic device using the same
US6176947B1 (en) * 1998-12-31 2001-01-23 H-Technologies Group, Incorporated Lead-free solders
JP3753168B2 (en) * 1999-08-20 2006-03-08 千住金属工業株式会社 Solder paste for joining microchip components
JP4338854B2 (en) * 1999-11-25 2009-10-07 三井金属鉱業株式会社 Tin-bismuth lead-free solder
DE60019651T2 (en) * 2000-11-16 2005-09-22 Singapore Asahi Chemical & Solder Industries Pte. Ltd. LEAD-FREE SOFT PLATE

Also Published As

Publication number Publication date
WO2003006200A1 (en) 2003-01-23
AT278502T (en) 2004-10-15
NO337878B1 (en) 2016-07-04
CZ303793B6 (en) 2013-05-09
PL201507B1 (en) 2009-04-30
RU2004103629A (en) 2005-06-10
JP3795797B2 (en) 2006-07-12
DE60201542D1 (en) 2004-11-11
CN1235717C (en) 2006-01-11
BR0210970A (en) 2004-06-08
AU2002226534B2 (en) 2006-11-09
PL364627A1 (en) 2004-12-13
CN1396039A (en) 2003-02-12
US6843862B2 (en) 2005-01-18
DK1404483T3 (en) 2004-11-22
NO20040106L (en) 2004-03-09
US20030007886A1 (en) 2003-01-09
DE60201542T2 (en) 2005-02-03
JP2003039193A (en) 2003-02-12
EP1404483A1 (en) 2004-04-07
SG139507A1 (en) 2008-02-29
PT1404483E (en) 2005-01-31
MXPA04000229A (en) 2005-03-07
NZ530220A (en) 2005-05-27
CZ2004209A3 (en) 2004-09-15
EP1404483B1 (en) 2004-10-06
ES2230477T3 (en) 2005-05-01
HU229014B1 (en) 2013-07-29
HU0401432A2 (en) 2004-11-29
HK1053278A1 (en) 2003-10-17
RU2268126C2 (en) 2006-01-20

Similar Documents

Publication Publication Date Title
TW592869B (en) Improvements in or relating to solders
EP2875898B1 (en) Solder alloy, solder paste, and electronic circuit board
CN103038019B (en) Lead-free solder paste
DE19916618B4 (en) Use of a lead-free solder
JP5722302B2 (en) Lead-free solder alloy, solder paste using this, and mounted product
CN102121088B (en) Formula of flux for hot tinning of copper wire and preparation method thereof
US10864606B2 (en) Flux and solder material
JP5698447B2 (en) Solder bonding composition
JPWO2013147235A1 (en) Conductive paste, cured product, electrode, and electronic device
CN104785948A (en) Sn0.3Ag0.7Cu lead-free solder paste and preparation method thereof
CN108544140A (en) Semiconductor special-purpose high temperature solder(ing) paste
TW201643894A (en) Conductive paste and multilayer substrate using same
CN107891232B (en) Lead-free halogen-free soldering paste and preparation method thereof
JP5204365B2 (en) Anisotropic conductive paint and anisotropic conductive film using the same
US8853417B2 (en) Non-halogen activating agent used as flux
RU2438845C1 (en) Solder paste
JP2010090264A (en) Functional electroconductive coating and method for production of printed circuit board using the same
US8652269B2 (en) Flux composition and soldering paste composition
CN103586598A (en) Lead-free tin bar
CN106624461B (en) A kind of composition, preparation method and its application in scaling powder field
JP5887541B2 (en) Thermosetting resin composition
TW498009B (en) Improvements in or relating to solders
RU2623571C1 (en) Solder paste
RU2623554C1 (en) Solder paste
JP6548933B2 (en) Conductive adhesive and method of manufacturing electronic substrate