TW592869B - Improvements in or relating to solders - Google Patents

Abstract

A substantially lead-free solder with enhanced properties comprises from 88.5% to 93.5% tin; from 3.5% to 4.5% silver; from 2.0% to 6.0% indium; and from 0.3% to 1.0% copper. The solder may also comprise up to 0.5% of an anti-oxidant or anti-skinning additive. A solder embodying the invention finds particular utility in wave-soldering processes where it may be used as a direct replacement for conventional tin/lead solder.

Description

V. Description of the invention (1) Specific ::: Ι Γ: There are solders, especially solders without errors, which include 右 ^, silver, indium, and copper, and the solder can also contain a certain amount of anti-lice Chemical additives or anti-stripping additives. The proportion of daggers is used in the wave-shaped soldering process. The soldering materials are particularly suitable. Furthermore, it can directly replace the traditional tin / wrong soldering. “Many traditional solders with gold usually have good physical properties. J = 7 knives. This type of solder solder” includes the production of printed circuit boards. The use of lead is common. For 37% of the solder, it is not equal to f '. For example, the demand for tin containing 63% and lead is increasing: based on; $ type: f? Process, however, many countries for solder j 迕Etc. Lead-free legal requirements in the coming years. Ik 4 Xixi project will be set to contain a small amount or the industry early in the deployment of benefit gold L, solder paste-generally has poor physics; m =, its traditional lead-free mobility is low, compatible with existing coatings = = Wetness, the use of helmet correction, Lu coarse private, good, and too much residue. However, the specific problem of the board's wear and tear is the protrusion of the weld and the separation of the printed materials. Another problem is that ^ the weld seam will be in contact with the solder and the bottom material such as gold / gold coating will be in contact with the solder:; ::: =:; the solution rate is very high, and the original, the industry's original; v use In addition, the current application may have to be replaced to be compatible with error-free solder, especially 1 Η 佶 ::, the adjustment of raw materials is widely regarded as the poor use of resources / 疋 σ made of lead-free solder Article standards, usually far from page 4 592869 V. Description of the invention (2) Lead-free solders that are lower than the main tins of the traditional tin containing lead, which are tin, silver, indium, copper, such as phosphorus or other The solder has the characteristics of oblique solder. Regardless of the compatibility, the lead-containing solder of the welding seam must be compared to the lead to achieve a significant improvement. Another aspect of this creation is the use of other lead-free solder component coatings. It is not necessary for the creation of another article standard to make your review better. Although this creation will limit the creation to the following, the lead-free solder of the present invention: from 8% to 4.5% silver. · 3% to 1 · 〇 solder. The purpose is to provide a non-gold, non-gold, and non-gold material that greatly improves the humidity, copper solution, and more lead-free solder. The purpose is the same. The technical layer of this preferred embodiment is 8.5%; copper from 2.5%. The alloy's proportions are the characteristics of the compound, the fluidity and the addition of the properties. The properties must be replaced with a more straight composition, oxidation resistance or element, in other words, the effect of using the solder on the scum does not change the existing use. In comparison, lead-free replacements contain specific agents or anti-stripping agents. Compared with this, there are zero groups in this discovery, which can be used as a standard. Lead solder, mechanical, soldering system, the proportion of conventional lead soldering is added to the known no-ware coatings, publicity, environmental protection, no need for process or zero process far more than providing a lead-free solder, the traditional lead-containing solder. & The structure and efficacy of the case will be further matched with the drawings, and detailed as follows: The examples will be described in detail, but will go to the center. In the noodles, it is provided by the following composition to 93.2% tin; from 3. $ 0% to 6.0% indium; from

592869 V. Description of the invention (3) Luo, Tian: The solder of Jin Yuming can also contain 0.5% antioxidant or anti-stripping such as scale or other non-metallic compounds or yuan silver, 4.0% containing 9 1.3% tin, 4.2% 40% indium, and 0.5% copper. 4 ί The best solder combination, including 9 1 · 39% tin, 〇 · 〇;%: Phosphorous 4 · 0% indium, 0 · 5% copper, and including another technical level 'provides manufacturing lead-free Method of soldering 8 8 ^ The steps of silver, indium and copper: the proportion of tin in solder is from 40 f 9 3.2%; the proportion of silver in solder is from 3.5% to above (the ratio of indium in solder is from 0 ′ The proportion of copper in 2 is from 0.3% to 1.0%. In other words, the method of making solder = can include an anti-oxidant or anti-stripping additive in the solder mixture. The preferred method of soldering involves stirring tin, copper, indium and copper as follows: the tin ratio in step 2 is 91.3%; the silver ratio in the solder is 0.5%. The ratio of indium in the material is 4．〇%; Copper in solder is better than indium and steel: ^ Τ: J: The preferred method of solder includes stirring the ratio of tin, silver, and silver. The ratio of tin in the solder is 91.3%; in the solder The copper ratio h is 1%, the indium ratio made by the solder is 4.0%; the solder according to the present invention is further: .5%, and the phosphorus ratio in the solder is 0.00%. The technical level is provided with error-free solder II. Welding Method, including the steps of making M: from 88.5% to 93.5% tin; from 592869 V. Description of the invention (4) 3.5% to 4.5% silver; from 2.0% to 6.0% indium From 0. 3% to 1.0% copper. The preferred method is to use solder with the following composition: 9 1 · 3% tin, 4.1% silver, 4.0% indium, and 0 · 5% copper. A more convenient method uses solder with the following components: 9 1 · 39% tin, 4 · 1% silver, 4 · 0% indium, 0 · 5% copper and 0 · 0 1% Phosphorus. A more powerful method involves a wave soldering step using lead-free solder. To demonstrate the superior properties of the invented solder, five tests were performed, as described below. These tests were performed on the better solders invented , Which is referred to herein as Alloy 349, and contains 9 1 · 39% tin, 4 · 1% silver, 4 · 0% indium, 0 · 5% copper, and 0 · 01%. The first test of the wetness of the solder samples of the invention, such as eight existing lead-free solders and traditional lead-containing solders compared to the known solder samples. The nine known solders are as follows: 1 Composition of the solder: 63% tin; 37% lead. 2 · Composition of the first lead-free solder: 99 · 3% tin; 0 · 7% copper. 3 · Composition of the second lead-free solder : 9 6 · 5% tin; 3 · 5 silver.

4 · Composition of a third lead-free solder (herein referred to as VI ROM ET 2 17): 8 8 · 3% tin; 3 · 2%

592869 V. Description of the invention (5) silver; 4.5% bismuth; 4.0% indium.

5. The composition of the fourth lead-free solder (herein referred to as VIROM ET 4 11): 92% tin; 2% copper; 3% silver; 3% bismuth. 6. Composition of the fifth lead-free solder (herein referred to as VI ROM ET 5 1 3): 92. 8% tin; 0.7% copper; 0.5% gallium; 6% indium. 7 · Composition of the sixth lead-free solder: 9 3 · 5% tin;

3 · 5% silver; 3 · 0% silver 0 8 · Composition of seventh lead-free solder: 9 5 · 5% tin; 4 · 0% silver; 0 · 5% copper. 9 · Composition of the eighth lead-free solder: 9 6 · 0% tin; 2 · 5% silver; 1 · 0% bismuth; 0 · 5% copper.

The first technical level of the first test includes the measurement of wet time according to the American National Standards Institute (ANSI) / JStd — 003 in various temperature ranges from 235 ° C to 2 65 ° C. In this test First, the copper samples were immersed in an appropriate amount of each dissolved solder, and then the copper samples were connected to a sensitive force measuring device, and arranged in such a way that the vertical force of the samples could be measured and recorded. The change in vertical force on the copper sample when immersed in the dissolved solder is due to

(8) The term "item" is buoyancy. Since the solder joint is equal to the weight of the solder displaced by the sample, increasing the specific direction of the sample can be calculated and included in the degree = known. Therefore, the two factors of this brother are the forces acting on the sample due to the solder surface. In each case, the time required for the surface contact angle to change and the wet force to be equal to zero. Meaning: The result of the first technical level of the item Γ test is shown as 1m * Γ The solder present invention at each temperature & shown in the figure, compared to the traditional lead-containing The display of the solder, except this: the wet time represented by: the wet time, the solder adhesion / 烊 枓 measured at the solder time of the present invention. The properties of the invented materials are fault-free solder. _ _Technical layer® towel ’s overall superiority to other current ones. Figure 2 shows the results at the individual surgery level graphically as shown below. Performance results of traditional error-containing solders, and the solder of the present invention; The second technical aspect of the following item :: is that the relevant solder is immersed in the sample and the solder is the same as the sample σ :: measures the large wet force, as described above, wet Adhesion of the force material to the bottom: The adhesion force of the dip 1 is obviously that the wet force is the best feature to provide welding. —Effective strength index, so the low humidity time is more unexpected than the fifth. Explanation of the invention (7) Now one member ^ " The second technical level of the social fruit such as 筮 ^ @ Sample 2. 〇 After the next, this The solder of the invention is almost the same as the immersion material, but some existing ones are similar to the traditional solder containing viR〇MET = = but the solder contains only the wet force of the material. In all the slightly better overall results, the solder of the invention 4 Yes ;;; ::: Close to the traditional solder containing solder, this item-test is found, close to the traditional solder containing solder. Figure 4, from this; the shape of the results are shown graphically as close to :; the error-containing solder of the system is other error-free; the result of = = It can be seen from the results of a test that the present invention The error-containing solder is very similar. Very = 枓 :: wet. It is suggested that the solder of the present invention is suitable to replace the traditional solder with error.] The first test is to compare the traditional solder quality of the present invention. In the second test, the wrong solder based on the material: "Seven other non-rules The composition of the traditional lead-free contamination containing 1 and 2 is: 9 9 · 3% tin · 2 · η-μ ^ · 7% steel. The composition of a lead-free consumable: 9 β · 5 % Tin · Page 10 592869 V. Description of the invention (8) 3 · 5 Silver.

3. Composition of the third lead-free solder (herein referred to as VIROM ET 217): 88. 3% tin; 3.2% silver; 4.5% bismuth; 4.0% indium 4. Composition of a lead-free solder (herein called VIROMET HF): 92% tin; 0. 7% copper; 0.5% gallium

; 6% indium. 5 · Composition of the fifth lead-free solder: 9 3 · 5% tin; 3 · 5% silver; 3 · 0% grade. 6 · Composition of the sixth lead-free solder: 9 5 · 5% tin; 4 · 0% silver; 0 · 5% copper. 7. The composition of the seventh lead-free solder: 96% tin; 2.5% silver; 0.5% copper;

1 · 0% level. The first technical aspect of the second test is to determine the dissolution temperature, the coefficient of thermal expansion (C T E), and the specific gravity (SG) of the solder under test. The results are listed in Figure 5 and graphically represented in Figure 6. It can be seen from the chart that the alloy 3 4 9 solder of the present invention proves to have a coefficient of thermal expansion very close to that of the conventional lead-containing solder, thus greatly reducing

Page 11 ^ 〇Oy V. Description of the invention (9) This issue = yes, there is a wide range of concerns about the incompatibility between the components and the base plate. The second test of this test was H-centricity, maximum load, and flexure. Measure the tensile strength of various solders. The graph shows that the tensile strength and buckling of the parent alloy mismatch the solder. The ρ ^ made by the alloy of the present invention is better, so it shows that it is solid. The increase in quilting may be more than that of traditional leaded solders in various industries. The increase in Yijin L, Dudou 1L Π3 welding preservative coatings (〇′p ®) shows that when organic road boards are used with error-free solder, In the third test of the nickel / gold paint penetrating hole printed electricity, the second is the tendency of U protrusions, that is, the inventors tested various kinds of lead-free solder materials of this type: a gold 3 4 9 and The following six types of existing error-free soldering 2 4 The first type of lead-free solder The second type of lead-free solder The second type of lead-free solder The fourth type of lead-free solder The fifth type of lead-free solder

V R 0 Μ E T • 3% tin; 3 5% Μ; 4. 8 9 · 8% tin; 3 1 · 0% secret; 6.8 8 · 8% tin; 30% Μ; 0 2 17. • 2% silver and 0%. • 2% silver and 0% indium. • 2% silver, 0% indium, 0.45% tin, 4.0% silver, 0.5% copper, and 1.0% bismuth. Page 12 V. Description of the invention (10) V. Description of the invention (10) 1 0 10 The above materials are compared with the projecting materials (dissolved solder concentration, calculated according to the chart, the first lead-free solder measured by the Institute and the error-free solder) Three lead-free solders 2 6. 6th lead-free solder: 9 6. The results of the third test are described in 9th tin, 3.5% silver. Figure a and Figure B show the nickel / gold and organic welding Figure 10A and the use of the alloy 3 4 9 of the present invention: a photomicrograph of a coating (0SP) example 'These results are clearly divided into two different The problem of soldering with nickel / gold coating and using the present invention can be ruled out. The fourth test of the welding seam of the left-hole printed circuit board is to compare the helmet of the present invention (δ 3% tin / 37% lead).枓 Same as traditional leaded soldering rate: ^ Same as v IR 〇 Μ ET 217 and two existing lead-free solders. 99.3% tin; 0.7% steel. 99 · 5% tin; 4.0% silver; ρ, + ρ + + from rainbow — 0.5% copper. The medium-fi line immerses a known weight of flux-treated copper plate into the dissolved _, and then uses a combined induction plasma device to measure the copper. Calculation: recap: copper concentration ratio in Π vs. steel immersed in solder = ^: The results of the test are described in Figure 11 and Figure 12, respectively, and the results are invented, as shown in Figure 11 and Figure 1. As shown in Figure 2, the copper dissolution rate of gold is slightly higher than that of traditional lead-containing solders, but among the lead-containing solders of a ^, the dissolution rate of steel is the lowest. Description of the invention (11) Connect the machine, dissolve the solder in an appropriate amount of wave-shaped solder, and place the circuit board on the surface of the pot material. Vibration = stimulus: ripple spreads to the entire dissolved solder.) To the dissolving solder; part of all parts must be in contact with the dissolving solder. 卞 μ plate facing down on the surface of the existing error-free solder 'floating volume phase in the existing solder pot'. After using it, there is nothing wrong. The fifth test is to determine that the combination of the present invention is compared to the conventional 63% tin / 37% lead solder pad.] = 9 烊 枓, the amount of scum: dry Shixing two other lead-free solders 1. The first lead-free solder: viroMet 2 ^: two error-free solders: 99.3% tin; 0.7% copper. 2nd error-free solder: 9 5 · 5% tin; 4.0% silver; 0.5% copper. In this test, the solder is used to simulate the value of the solder pot, and μ has m ^, in the dissolved beans of the wave soldering machine ... I There are 'moving machines' that are used to accommodate the use of solder,:, used to:: The machine Γ is in the same way as traditional tin / wrong solder. At 2 ί = "The machine is in a normal air environment. i. 8 m / 的 盆 ， 盆 下 # 作, and the circuit board is conveyed to the basin at a speed of 1.4 ~ A. After 15 minutes of operation, each time ^ four-person, Determine the weight produced by each wave-shaped welding process:; :: The floating weight is measured, and the quantity u is measured per hour = Ling; and then the weight J / room rate is determined. , Invention description ( 12) The results are tabulated in Figure 13 which clearly shows that the dross generated by the solder of the present invention is lower than all solders (except only one lead-free solder) and more than the floatation of traditional ship-containing solder. low. In summary, from the above results, it can be seen that the lead-free solder of the present invention is very suitable for direct replacement due to the properties of wetness, fluidity, compatibility with existing component coatings, weld protrusions and scum. Traditional leaded solder.

Page 15 592869 592869 Brief description of the drawings The data in Figure 11 are shown graphically. It is a list of various solder scum levels including the invented solder. Presented

Page 17

Claims (1)

5928 VI. Scope of patent application 1 · An error-free solder, including: from 8 8 · 5% to 9 3 · 2% tin from 3 · 5% to 4 · 5% silver; . Marriage of the copper spoon spoon Λ3. ^ Trr 0 / %% item 〇〇 1. · 61st round to the top%% profit 〇 3 special • • Please apply 2 〇 to add from Congru 2. For its material, adding materials, adding solder, dropping lead strips, or preventing chemical damage from oxygen, ^ ~ _% of the resistance Λ- 巳% ί 5 special • Please apply for the application of such materials as 3 materials. Materials Welding Lead or no-things combination of the gold 2 uhr 4 ¥ 々 shells to cover the scope or to fill in the specific means refer to the application such as 4% of the cause ο 4 Gen% 2 4 Λ tin. % Copper 3's.%-H LO 9. There is no τ ~ _ with the content of 5 as in 4 of the material, solder silver #, all the 4 items, 3 tin or% 2 9 or 3 1— I · $ ^ 1 Round 9 Fan Lihan Special materials please hit, 6 Bronze. % ΑΦ 1—Η, ο tin • mixed with copper indium, mixed with copper-containing cladding,% method 5 methods • made, welded with indium material% wrong ο none > _ 彐 彐 一 1 Species% 2 3 9 to% 5 8 8 are examples: the soldering step of the soldering step is lower than tin solder 5 0 4 6 to%% 5 0 3 2 is an example of dbt bt IP Gen As in AMV AMV Λρ / Θ The middle and middle materials are made by welding method. %% o Welding 1 &I; %% of the above are described in 3 cases • Item 0 6 is the case of Fan Tongli's junior high school, please apply for welding such as 7 peeling or agent / 1% of oxygen resistance 5 ο Add ^ 1 agent into the mix. Welding materials Page 18 592869-U, Application 8 · The method for producing an error-free solder as described in item 6 of the scope of patent application, wherein the additive is $ 粦 or other non-metallic compounds or elements. 9 · The method for producing an error-free solder as described in item 6 of the scope of patent application, wherein the mixing ratio of tin, silver, indium and copper is as follows: The tin ratio in the solder is 9 1 · 3%; the silver ratio in the solder It is 4.2%; the proportion of indium in the solder is 4%; the proportion of copper in the solder is 0.5%. 1 0 · The method for making a lead-free solder as described in item 6 or 7 or 8 of the scope of patent application, wherein the mixing ratio of tin, silver, indium, copper and phosphorus is as follows: The tin ratio in the solder is from 9 1 · 3 9%; the proportion of silver in the solder is 4.1%; the proportion of indium in the solder is 4%; the proportion of copper in the solder is 0.5%; the proportion of phosphorus in the solder is 0.1%. 1 1 · A soldering method using shipless solder, comprising: 88.5% to 93.5% tin; 3.5% to 4.5% silver; 2.0% to 6.0% indium; 0 · 3% to 1.0% copper. 1 2 · The soldering method using lead-free solder as described in item 11 of the scope of patent application, wherein the solder is added with an anti-oxidant or anti-peeling additive of 0.5%. Page 19 _ VI. Scope of Patent Application 1 3 · If the scope of patent application is for welding methods, compounds or elements. 1 4 · As for the method of patent application, in which 4% indium and copper 0 1 5 · As for the method of patent application, tin 9 1 · 3 9% copper 0 · 5% and phosphorus 16 · as applied Patent range Lead-free solder wave soldering method 17 · As in the patent application method, the silver content is 4.1%, and the indium phosphorus is 0. 0 1 ° / 〇. 18 · If you apply for a patent scope method, it can also be applied. The use of lead-free solder as described in item 11 or 12 wherein the additives refer to fillers or other non-metals. The use of lead-free solder as described in item 11 contains tin 91.3%, silver 4.2%, • 5% 〇 The use of lead-free solder as described in item 1 1 or 12 above, wherein the solder used includes silver 4.1%, indium 4.0%, and 0.11%. The method described in item 11 or 12 or 14 can also be used on lead-free solder. The solder used for soldering using lead-free solder as described in item 13 includes tin 9 1 · 39%, 4 · 0%, copper 0.5% and solder using lead-free solder as described in item 13 for use in lead-free solder. Wave-shaped welding method❿ Page 20 9 6 8 2-9 Η Positive charge% 0 b〇on NJ ^ ΓΛ N-) ^ Τλ 2 r Fresh tin temperature: / 〇m ◦ 0.546 0.606 0.767 63 Tin 37 lead soldering time 0.165 0.682 1.034 1.411 99.3 Tin / 0.7 copper 0.74 Η-^ 1.352 2.189 96.5 tin / 3.5 silver 0.244 0.544 0.716 1.156 alloy 349 0,476 0.569 0.791 0.949 Viromet217 0.496 0.587 0.869 1.036 Viromet411 0.597 0.822 1.072 1.758 Viromet 513 0.653 0.814 1.669 3.173 96 · 5 tin / 3.5 silver / 3.0 Bismuth 1.048 1.284 1.946 3.368 95.5 tin / 4.0 silver / 0.5 copper 0.668 0.824 1.235 1 —— * · bo 96 tin / 2.5 silver / 1.0 bismuth / 0.5 copper 59286Γ9 Scream! If schema_Β ______ —tss ^ +99.3 Yi / 0.73ΓI96 · Ϊ / 3Ϊ Mingling 349 — ^ t-viromet 200 —Viromet 400 —I—vlrom & soo-: 96 · 5 Agriculture / 3.5 Choice / 3.0 Huan ——95 · ί 40SS ί / 15 s-2 / ο.ϊ I _ • · 592869 丨 month 丨 said to modify the f 1 mine 'formula i §ίί Jue — Ν3 · υϋ μπ And 20S ^^ Λ ^^ ίΛ 6.51- Page 24 592869 丨 Made 11 丨 Figure 0 (m3 0 25 · 20 · 15 · 1〇t D63s75fe 99l ^ l □ 96Λδβι □ viroit 217 Ming Yin 34SO □ f I 96 · 5 Miao / 3.5 & /0.51Γ □ 95.5 桊 / 4 fee 0.5 stimulus _96 farm / 2.5 £ .5 food / 1 Huan page 26 92 Xiu Weng style picture ¢ 00 ^ ftas Yiyu φ φ slave page Page 592 869 Page 31, 5928 yards Figure ‘Formation Copper dissolution rate in lead-free alloy Copper concentration / Copper dissolution rate 0.2 0.1 S 0.1 0.05 Reference ^ ^ ^ Let Type of solder □ Copper concentration □ Copper solubility Page 12 2 Page 33