CN1235717C - 无铅的焊料、其制备方法以及使用该焊料的焊接方法 - Google Patents

无铅的焊料、其制备方法以及使用该焊料的焊接方法 Download PDF

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Publication number
CN1235717C
CN1235717C CNB011326336A CN01132633A CN1235717C CN 1235717 C CN1235717 C CN 1235717C CN B011326336 A CNB011326336 A CN B011326336A CN 01132633 A CN01132633 A CN 01132633A CN 1235717 C CN1235717 C CN 1235717C
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CN
China
Prior art keywords
scolder
lead
solder
present
free solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNB011326336A
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English (en)
Chinese (zh)
Other versions
CN1396039A (zh
Inventor
C·K·瓦
P·W·赤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Quantum Chemical Technologies Singapore Pte Ltd
Singapore Asahi Chemical and Solder Industries Pte Ltd
Original Assignee
Quantum Chemical Technologies Singapore Pte Ltd
Singapore Asahi Chemical and Solder Industries Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Quantum Chemical Technologies Singapore Pte Ltd, Singapore Asahi Chemical and Solder Industries Pte Ltd filed Critical Quantum Chemical Technologies Singapore Pte Ltd
Publication of CN1396039A publication Critical patent/CN1396039A/zh
Application granted granted Critical
Publication of CN1235717C publication Critical patent/CN1235717C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Glass Compositions (AREA)
  • Thermally Insulated Containers For Foods (AREA)
  • Nonmetallic Welding Materials (AREA)
  • Silicates, Zeolites, And Molecular Sieves (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Details Of Resistors (AREA)
CNB011326336A 2001-07-09 2001-09-05 无铅的焊料、其制备方法以及使用该焊料的焊接方法 Expired - Lifetime CN1235717C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SG200104071-6A SG139507A1 (en) 2001-07-09 2001-07-09 Improvements in or relating to solders
SG2001040716 2001-07-09

Publications (2)

Publication Number Publication Date
CN1396039A CN1396039A (zh) 2003-02-12
CN1235717C true CN1235717C (zh) 2006-01-11

Family

ID=20430801

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB011326336A Expired - Lifetime CN1235717C (zh) 2001-07-09 2001-09-05 无铅的焊料、其制备方法以及使用该焊料的焊接方法

Country Status (22)

Country Link
US (1) US6843862B2 (enExample)
EP (1) EP1404483B1 (enExample)
JP (1) JP3795797B2 (enExample)
CN (1) CN1235717C (enExample)
AT (1) ATE278502T1 (enExample)
AU (1) AU2002226534B2 (enExample)
BR (1) BR0210970A (enExample)
CZ (1) CZ303793B6 (enExample)
DE (1) DE60201542T2 (enExample)
DK (1) DK1404483T3 (enExample)
ES (1) ES2230477T3 (enExample)
HU (1) HU229014B1 (enExample)
MX (1) MXPA04000229A (enExample)
MY (1) MY123567A (enExample)
NO (1) NO337878B1 (enExample)
NZ (1) NZ530220A (enExample)
PL (1) PL201507B1 (enExample)
PT (1) PT1404483E (enExample)
RU (1) RU2268126C2 (enExample)
SG (1) SG139507A1 (enExample)
TW (1) TW592869B (enExample)
WO (1) WO2003006200A1 (enExample)

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US20080126535A1 (en) * 2006-11-28 2008-05-29 Yinjun Zhu User plane location services over session initiation protocol (SIP)
EP1560272B1 (en) * 2004-01-29 2016-04-27 Panasonic Intellectual Property Management Co., Ltd. Solar cell module
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US7223695B2 (en) * 2004-09-30 2007-05-29 Intel Corporation Methods to deposit metal alloy barrier layers
US6985105B1 (en) * 2004-10-15 2006-01-10 Telecommunication Systems, Inc. Culled satellite ephemeris information based on limiting a span of an inverted cone for locating satellite in-range determinations
GB2406101C (en) * 2004-10-27 2007-09-11 Quantum Chem Tech Singapore Improvements in ro relating to solders
US20060120911A1 (en) * 2004-12-08 2006-06-08 Manoj Gupta Method of forming composite solder by cold compaction and composite solder
US20070036670A1 (en) * 2005-08-12 2007-02-15 John Pereira Solder composition
US20070037004A1 (en) * 2005-08-12 2007-02-15 Antaya Technologies Corporation Multilayer solder article
US20070292708A1 (en) * 2005-08-12 2007-12-20 John Pereira Solder composition
US20080175748A1 (en) * 2005-08-12 2008-07-24 John Pereira Solder Composition
US20070231594A1 (en) * 2005-08-12 2007-10-04 John Pereira Multilayer solder article
US7749336B2 (en) * 2005-08-30 2010-07-06 Indium Corporation Of America Technique for increasing the compliance of tin-indium solders
US20070071634A1 (en) * 2005-09-26 2007-03-29 Indium Corporation Of America Low melting temperature compliant solders
US7825780B2 (en) * 2005-10-05 2010-11-02 Telecommunication Systems, Inc. Cellular augmented vehicle alarm notification together with location services for position of an alarming vehicle
US7907551B2 (en) * 2005-10-06 2011-03-15 Telecommunication Systems, Inc. Voice over internet protocol (VoIP) location based 911 conferencing
US20070172381A1 (en) * 2006-01-23 2007-07-26 Deram Brian T Lead-free solder with low copper dissolution
US8150363B2 (en) 2006-02-16 2012-04-03 Telecommunication Systems, Inc. Enhanced E911 network access for call centers
US8059789B2 (en) 2006-02-24 2011-11-15 Telecommunication Systems, Inc. Automatic location identification (ALI) emergency services pseudo key (ESPK)
US7471236B1 (en) 2006-03-01 2008-12-30 Telecommunication Systems, Inc. Cellular augmented radar/laser detector
US8208605B2 (en) * 2006-05-04 2012-06-26 Telecommunication Systems, Inc. Extended efficient usage of emergency services keys
US20080261619A1 (en) * 2006-09-26 2008-10-23 John Gordon Hines Injection of location object into routing SIP message
US7966013B2 (en) * 2006-11-03 2011-06-21 Telecommunication Systems, Inc. Roaming gateway enabling location based services (LBS) roaming for user plane in CDMA networks without requiring use of a mobile positioning center (MPC)
US20080157910A1 (en) * 2006-12-29 2008-07-03 Park Chang-Min Amorphous soft magnetic layer for on-die inductively coupled wires
US20080167018A1 (en) * 2007-01-10 2008-07-10 Arlene Havlark Wireless telecommunications location based services scheme selection
KR101167549B1 (ko) * 2007-07-18 2012-07-20 센주긴조쿠고교 가부시키가이샤 차재 전자 회로용 Ｉｎ 함유 무납 땜납
GB2455486A (en) * 2008-03-05 2009-06-17 Quantum Chem Tech Singapore A sputtered film, solder spheres and solder paste formed from an Sn-Ag-Cu-In alloy
CN101474728B (zh) * 2009-01-07 2011-06-01 高新锡业（惠州）有限公司 无铅软钎焊料
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CN109702372A (zh) * 2019-03-06 2019-05-03 上海莜玮汽车零部件有限公司 无铅焊料合金及其应用
CN113798725B (zh) * 2021-10-13 2022-10-04 浙江强力控股有限公司 选择性波峰焊用免焊剂无铅焊料及其制备方法

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JPH09326554A (ja) * 1996-06-06 1997-12-16 Matsushita Electric Ind Co Ltd 電子部品接合用電極のはんだ合金及びはんだ付け方法
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JPH11221694A (ja) * 1998-02-06 1999-08-17 Hitachi Ltd 鉛フリーはんだを用いた実装構造体およびそれを用いた実装方法
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Also Published As

Publication number Publication date
NZ530220A (en) 2005-05-27
US20030007886A1 (en) 2003-01-09
PL364627A1 (en) 2004-12-13
NO20040106L (no) 2004-03-09
HK1053278A1 (en) 2003-10-17
MXPA04000229A (es) 2005-03-07
CZ303793B6 (cs) 2013-05-09
BR0210970A (pt) 2004-06-08
DE60201542D1 (de) 2004-11-11
EP1404483B1 (en) 2004-10-06
PT1404483E (pt) 2005-01-31
RU2268126C2 (ru) 2006-01-20
RU2004103629A (ru) 2005-06-10
JP2003039193A (ja) 2003-02-12
TW592869B (en) 2004-06-21
ATE278502T1 (de) 2004-10-15
ES2230477T3 (es) 2005-05-01
CN1396039A (zh) 2003-02-12
MY123567A (en) 2006-05-31
HUP0401432A2 (en) 2004-11-29
WO2003006200A1 (en) 2003-01-23
AU2002226534B2 (en) 2006-11-09
US6843862B2 (en) 2005-01-18
SG139507A1 (en) 2008-02-29
PL201507B1 (pl) 2009-04-30
JP3795797B2 (ja) 2006-07-12
HU229014B1 (en) 2013-07-29
DK1404483T3 (da) 2004-11-22
NO337878B1 (no) 2016-07-04
DE60201542T2 (de) 2005-02-03
EP1404483A1 (en) 2004-04-07
CZ2004209A3 (cs) 2004-09-15

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Granted publication date: 20060111