JP2005305472A5 - - Google Patents
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- Publication number
- JP2005305472A5 JP2005305472A5 JP2004122892A JP2004122892A JP2005305472A5 JP 2005305472 A5 JP2005305472 A5 JP 2005305472A5 JP 2004122892 A JP2004122892 A JP 2004122892A JP 2004122892 A JP2004122892 A JP 2004122892A JP 2005305472 A5 JP2005305472 A5 JP 2005305472A5
- Authority
- JP
- Japan
- Prior art keywords
- point
- solder material
- conductor
- substrate
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052802 copper Inorganic materials 0.000 claims description 31
- 229910052709 silver Inorganic materials 0.000 claims description 31
- 239000000203 mixture Substances 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 11
- 229910000679 solder Inorganic materials 0.000 claims description 11
- 229910045601 alloy Inorganic materials 0.000 claims description 6
- 239000000956 alloy Substances 0.000 claims description 6
- 238000010586 diagram Methods 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims 6
- 239000000758 substrate Substances 0.000 claims 6
- 238000005476 soldering Methods 0.000 claims 3
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004122892A JP4391299B2 (ja) | 2004-04-19 | 2004-04-19 | はんだ材料およびはんだ付け物品 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004122892A JP4391299B2 (ja) | 2004-04-19 | 2004-04-19 | はんだ材料およびはんだ付け物品 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005305472A JP2005305472A (ja) | 2005-11-04 |
| JP2005305472A5 true JP2005305472A5 (enExample) | 2007-03-29 |
| JP4391299B2 JP4391299B2 (ja) | 2009-12-24 |
Family
ID=35434829
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004122892A Expired - Fee Related JP4391299B2 (ja) | 2004-04-19 | 2004-04-19 | はんだ材料およびはんだ付け物品 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4391299B2 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070138442A1 (en) * | 2005-12-19 | 2007-06-21 | Weiser Martin W | Modified and doped solder alloys for electrical interconnects, methods of production and uses thereof |
| KR101913994B1 (ko) * | 2015-03-10 | 2018-12-28 | 인듐 코포레이션 | 혼합 합금 땜납 페이스트 |
-
2004
- 2004-04-19 JP JP2004122892A patent/JP4391299B2/ja not_active Expired - Fee Related
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