JP2003200288A5 - - Google Patents

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Publication number
JP2003200288A5
JP2003200288A5 JP2002340281A JP2002340281A JP2003200288A5 JP 2003200288 A5 JP2003200288 A5 JP 2003200288A5 JP 2002340281 A JP2002340281 A JP 2002340281A JP 2002340281 A JP2002340281 A JP 2002340281A JP 2003200288 A5 JP2003200288 A5 JP 2003200288A5
Authority
JP
Japan
Prior art keywords
electronic device
lead
layer
solder
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002340281A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003200288A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2002340281A priority Critical patent/JP2003200288A/ja
Priority claimed from JP2002340281A external-priority patent/JP2003200288A/ja
Publication of JP2003200288A publication Critical patent/JP2003200288A/ja
Publication of JP2003200288A5 publication Critical patent/JP2003200288A5/ja
Pending legal-status Critical Current

Links

JP2002340281A 1996-10-09 2002-11-25 Ｐｂフリーはんだ材料及びそれを用いた電子機器 Pending JP2003200288A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002340281A JP2003200288A (ja) 1996-10-09 2002-11-25 Ｐｂフリーはんだ材料及びそれを用いた電子機器

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP8-268356 1996-10-09
JP26835696 1996-10-09
JP2002340281A JP2003200288A (ja) 1996-10-09 2002-11-25 Ｐｂフリーはんだ材料及びそれを用いた電子機器

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP02240097A Division JP3446517B2 (ja) 1996-10-09 1997-02-05 Ｐｂフリーはんだ材料及びそれを用いた電子機器

Publications (2)

Publication Number Publication Date
JP2003200288A JP2003200288A (ja) 2003-07-15
JP2003200288A5 true JP2003200288A5 (enExample) 2004-10-14

Family

ID=27666096

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002340281A Pending JP2003200288A (ja) 1996-10-09 2002-11-25 Ｐｂフリーはんだ材料及びそれを用いた電子機器

Country Status (1)

Country Link
JP (1) JP2003200288A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005020315A1 (ja) * 2003-08-26 2005-03-03 Tokuyama Corporation 素子接合用基板、素子接合基板及びその製造方法
CN105880872A (zh) * 2016-06-03 2016-08-24 广东昭信照明科技有限公司 一种钎焊材料及其制备方法
CN109732237A (zh) * 2019-01-02 2019-05-10 昆明理工大学 一种SnBiCuAgNiCe低温无铅焊料合金

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