JP2004322213A5 - - Google Patents
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- Publication number
- JP2004322213A5 JP2004322213A5 JP2004158626A JP2004158626A JP2004322213A5 JP 2004322213 A5 JP2004322213 A5 JP 2004322213A5 JP 2004158626 A JP2004158626 A JP 2004158626A JP 2004158626 A JP2004158626 A JP 2004158626A JP 2004322213 A5 JP2004322213 A5 JP 2004322213A5
- Authority
- JP
- Japan
- Prior art keywords
- electronic device
- electrode
- based layer
- amount
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910020830 Sn-Bi Inorganic materials 0.000 claims 6
- 229910018728 Sn—Bi Inorganic materials 0.000 claims 6
- 229910000679 solder Inorganic materials 0.000 claims 3
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004158626A JP4535429B2 (ja) | 2004-05-28 | 2004-05-28 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004158626A JP4535429B2 (ja) | 2004-05-28 | 2004-05-28 | 半導体装置の製造方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP34681197A Division JP3622462B2 (ja) | 1997-12-16 | 1997-12-16 | 半導体装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007278307A Division JP4535464B2 (ja) | 2007-10-26 | 2007-10-26 | 電子機器の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004322213A JP2004322213A (ja) | 2004-11-18 |
| JP2004322213A5 true JP2004322213A5 (enExample) | 2005-06-30 |
| JP4535429B2 JP4535429B2 (ja) | 2010-09-01 |
Family
ID=33509269
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004158626A Expired - Lifetime JP4535429B2 (ja) | 2004-05-28 | 2004-05-28 | 半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4535429B2 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5061168B2 (ja) * | 2009-09-17 | 2012-10-31 | ルネサスエレクトロニクス株式会社 | 電子機器の製造方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1041621A (ja) * | 1996-07-18 | 1998-02-13 | Fujitsu Ltd | 錫−ビスマスはんだの接合方法 |
| JPH1093004A (ja) * | 1996-09-11 | 1998-04-10 | Matsushita Electron Corp | 電子部品およびその製造方法 |
| JP3243195B2 (ja) * | 1997-01-28 | 2002-01-07 | 古河電気工業株式会社 | リフロー半田めっき材およびその製造方法 |
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2004
- 2004-05-28 JP JP2004158626A patent/JP4535429B2/ja not_active Expired - Lifetime