JP4535429B2 - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法 Download PDF

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Publication number
JP4535429B2
JP4535429B2 JP2004158626A JP2004158626A JP4535429B2 JP 4535429 B2 JP4535429 B2 JP 4535429B2 JP 2004158626 A JP2004158626 A JP 2004158626A JP 2004158626 A JP2004158626 A JP 2004158626A JP 4535429 B2 JP4535429 B2 JP 4535429B2
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Japan
Prior art keywords
electrode
layer
solder
semiconductor device
manufacturing
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Expired - Lifetime
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JP2004158626A
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English (en)
Japanese (ja)
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JP2004322213A5 (enExample
JP2004322213A (ja
Inventor
英恵 下川
太佐男 曽我
弘明 奥平
寿治 石田
哲也 中塚
吉治 稲葉
朝雄 西村
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Renesas Electronics Corp
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Renesas Electronics Corp
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Priority to JP2004158626A priority Critical patent/JP4535429B2/ja
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Publication of JP2004322213A5 publication Critical patent/JP2004322213A5/ja
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Publication of JP4535429B2 publication Critical patent/JP4535429B2/ja
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JP2004158626A 2004-05-28 2004-05-28 半導体装置の製造方法 Expired - Lifetime JP4535429B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004158626A JP4535429B2 (ja) 2004-05-28 2004-05-28 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004158626A JP4535429B2 (ja) 2004-05-28 2004-05-28 半導体装置の製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP34681197A Division JP3622462B2 (ja) 1997-12-16 1997-12-16 半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2007278307A Division JP4535464B2 (ja) 2007-10-26 2007-10-26 電子機器の製造方法

Publications (3)

Publication Number Publication Date
JP2004322213A JP2004322213A (ja) 2004-11-18
JP2004322213A5 JP2004322213A5 (enExample) 2005-06-30
JP4535429B2 true JP4535429B2 (ja) 2010-09-01

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ID=33509269

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004158626A Expired - Lifetime JP4535429B2 (ja) 2004-05-28 2004-05-28 半導体装置の製造方法

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JP (1) JP4535429B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009302568A (ja) * 2009-09-17 2009-12-24 Renesas Technology Corp 半導体装置の製造方法および電子機器の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1041621A (ja) * 1996-07-18 1998-02-13 Fujitsu Ltd 錫−ビスマスはんだの接合方法
JPH1093004A (ja) * 1996-09-11 1998-04-10 Matsushita Electron Corp 電子部品およびその製造方法
JP3243195B2 (ja) * 1997-01-28 2002-01-07 古河電気工業株式会社 リフロー半田めっき材およびその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009302568A (ja) * 2009-09-17 2009-12-24 Renesas Technology Corp 半導体装置の製造方法および電子機器の製造方法

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JP2004322213A (ja) 2004-11-18

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