JP2005288529A5 - - Google Patents

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Publication number
JP2005288529A5
JP2005288529A5 JP2004110860A JP2004110860A JP2005288529A5 JP 2005288529 A5 JP2005288529 A5 JP 2005288529A5 JP 2004110860 A JP2004110860 A JP 2004110860A JP 2004110860 A JP2004110860 A JP 2004110860A JP 2005288529 A5 JP2005288529 A5 JP 2005288529A5
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JP
Japan
Prior art keywords
point
solder material
conductor
substrate
material according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004110860A
Other languages
English (en)
Japanese (ja)
Other versions
JP4351107B2 (ja
JP2005288529A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004110860A priority Critical patent/JP4351107B2/ja
Priority claimed from JP2004110860A external-priority patent/JP4351107B2/ja
Publication of JP2005288529A publication Critical patent/JP2005288529A/ja
Publication of JP2005288529A5 publication Critical patent/JP2005288529A5/ja
Application granted granted Critical
Publication of JP4351107B2 publication Critical patent/JP4351107B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2004110860A 2004-04-05 2004-04-05 はんだ材料およびはんだ付け物品 Expired - Fee Related JP4351107B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004110860A JP4351107B2 (ja) 2004-04-05 2004-04-05 はんだ材料およびはんだ付け物品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004110860A JP4351107B2 (ja) 2004-04-05 2004-04-05 はんだ材料およびはんだ付け物品

Publications (3)

Publication Number Publication Date
JP2005288529A JP2005288529A (ja) 2005-10-20
JP2005288529A5 true JP2005288529A5 (enExample) 2007-03-29
JP4351107B2 JP4351107B2 (ja) 2009-10-28

Family

ID=35322069

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004110860A Expired - Fee Related JP4351107B2 (ja) 2004-04-05 2004-04-05 はんだ材料およびはんだ付け物品

Country Status (1)

Country Link
JP (1) JP4351107B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200732082A (en) * 2005-11-11 2007-09-01 Senju Metal Industry Co Soldering paste and solder joints
EP2589459B1 (en) * 2010-06-30 2017-08-09 Senju Metal Industry Co., Ltd Bi-Sn-BASED HIGH-TEMPERATURE SOLDER ALLOY

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3347512B2 (ja) * 1995-03-17 2002-11-20 富士通株式会社 低温接合用はんだ合金、これを用いた電子機器およびその製造方法
JP3671815B2 (ja) * 2000-06-12 2005-07-13 株式会社村田製作所 はんだ組成物およびはんだ付け物品
JP2004034134A (ja) * 2002-07-08 2004-02-05 Hitachi Ltd 線はんだおよび電子機器の製造方法

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