JP2004063787A5 - - Google Patents

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Publication number
JP2004063787A5
JP2004063787A5 JP2002220085A JP2002220085A JP2004063787A5 JP 2004063787 A5 JP2004063787 A5 JP 2004063787A5 JP 2002220085 A JP2002220085 A JP 2002220085A JP 2002220085 A JP2002220085 A JP 2002220085A JP 2004063787 A5 JP2004063787 A5 JP 2004063787A5
Authority
JP
Japan
Prior art keywords
terminal
camera module
mounting
substrate
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002220085A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004063787A (ja
JP3755149B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2002220085A external-priority patent/JP3755149B2/ja
Priority to JP2002220085A priority Critical patent/JP3755149B2/ja
Priority to KR1020030050944A priority patent/KR100798732B1/ko
Priority to US10/627,918 priority patent/US6862804B2/en
Priority to DE60330422T priority patent/DE60330422D1/de
Priority to EP03017204A priority patent/EP1387442B1/en
Publication of JP2004063787A publication Critical patent/JP2004063787A/ja
Publication of JP2004063787A5 publication Critical patent/JP2004063787A5/ja
Publication of JP3755149B2 publication Critical patent/JP3755149B2/ja
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2002220085A 2002-07-29 2002-07-29 カメラモジュールの基板への実装方法 Expired - Fee Related JP3755149B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2002220085A JP3755149B2 (ja) 2002-07-29 2002-07-29 カメラモジュールの基板への実装方法
KR1020030050944A KR100798732B1 (ko) 2002-07-29 2003-07-24 카메라 모듈의 기판에의 실장 방법
US10/627,918 US6862804B2 (en) 2002-07-29 2003-07-28 Method of mounting camera module on wiring board
EP03017204A EP1387442B1 (en) 2002-07-29 2003-07-29 Method of mounting camera module on wiring board
DE60330422T DE60330422D1 (de) 2002-07-29 2003-07-29 Verfahren zum Befestigen eines Kameramoduls auf einer Leiterplatte

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002220085A JP3755149B2 (ja) 2002-07-29 2002-07-29 カメラモジュールの基板への実装方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2005301610A Division JP3799615B2 (ja) 2005-10-17 2005-10-17 カメラモジュールの基板への実装方法

Publications (3)

Publication Number Publication Date
JP2004063787A JP2004063787A (ja) 2004-02-26
JP2004063787A5 true JP2004063787A5 (enExample) 2005-10-20
JP3755149B2 JP3755149B2 (ja) 2006-03-15

Family

ID=30112902

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002220085A Expired - Fee Related JP3755149B2 (ja) 2002-07-29 2002-07-29 カメラモジュールの基板への実装方法

Country Status (5)

Country Link
US (1) US6862804B2 (enExample)
EP (1) EP1387442B1 (enExample)
JP (1) JP3755149B2 (enExample)
KR (1) KR100798732B1 (enExample)
DE (1) DE60330422D1 (enExample)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200509480A (en) * 2003-08-27 2005-03-01 Mitsumi Electric Co Ltd Connector for camera module
JP2005222876A (ja) 2004-02-09 2005-08-18 Smk Corp モジュール用コネクタ
TWI282873B (en) * 2004-03-12 2007-06-21 Premier Image Technology Corp Lens module and assembling method thereof
KR100568769B1 (ko) 2004-04-23 2006-04-07 앰코 테크놀로지 코리아 주식회사 카메라모듈용 마운트
US7918671B2 (en) * 2004-07-13 2011-04-05 Research In Motion Limited Mounting structure with springs biasing towards a latching edge
CN2749141Y (zh) * 2004-10-25 2005-12-28 富士康(昆山)电脑接插件有限公司 电连接器
JP4091593B2 (ja) * 2004-11-05 2008-05-28 Ｓｍｋ株式会社 オートフォーカス機能付カメラモジュールとモジュール用コネクタの接続構造
CN2766377Y (zh) * 2004-12-04 2006-03-22 富士康(昆山)电脑接插件有限公司 电连接器
JP4562538B2 (ja) * 2005-01-31 2010-10-13 モレックス インコーポレイテド モジュール用ソケット
US20060189216A1 (en) * 2005-02-18 2006-08-24 Ming-Hsun Yang Camera module connector keying structure
TWM271287U (en) * 2005-02-18 2005-07-21 Molex Taiwan Ltd Camera module connector
CN2791967Y (zh) * 2005-03-25 2006-06-28 富士康(昆山)电脑接插件有限公司 电连接器
CN100399637C (zh) * 2005-05-16 2008-07-02 富士康(昆山)电脑接插件有限公司 电连接器
JP4182529B2 (ja) * 2005-07-21 2008-11-19 Ｓｍｋ株式会社 電子部品取付用ソケット及びそれに使用するコンタクトキャリヤ
CN100377434C (zh) * 2005-08-05 2008-03-26 富士康(昆山)电脑接插件有限公司 电连接器组件
CN2831478Y (zh) * 2005-08-11 2006-10-25 富士康(昆山)电脑接插件有限公司 电连接器组件及安装该组件的电子设备
US7121864B1 (en) * 2005-09-30 2006-10-17 Hon Hai Precision Ind. Co., Ltd. Module connector
TWM288979U (en) * 2005-10-03 2006-03-21 Hon Hai Prec Ind Co Ltd Electrical connector
KR101110152B1 (ko) * 2006-01-06 2012-01-31 에스케이플래닛 주식회사 이동통신 단말기를 이용한 원격 수족관 관람 시스템 및방법
TWM304793U (en) * 2006-04-03 2007-01-11 Hon Hai Prec Ind Co Ltd Electrical connector assembly
KR100772601B1 (ko) * 2006-06-14 2007-11-01 서울전자통신(주) 카메라모듈 실장방법
CN2932759Y (zh) * 2006-07-04 2007-08-08 富士康(昆山)电脑接插件有限公司 电连接器组件
CN200941518Y (zh) * 2006-08-01 2007-08-29 富士康(昆山)电脑接插件有限公司 电连接器
TWM310502U (en) * 2006-11-17 2007-04-21 Molex Taiwan Ltd Electrical connection device
JP3926380B1 (ja) 2006-12-07 2007-06-06 マイルストーン株式会社 撮像レンズ
JP3929479B1 (ja) * 2006-12-21 2007-06-13 マイルストーン株式会社 撮像レンズ
JP3946245B1 (ja) * 2007-03-08 2007-07-18 マイルストーン株式会社 撮像レンズ
CN101295848B (zh) * 2007-04-27 2010-06-09 鸿富锦精密工业（深圳）有限公司 电连接器及具有该电连接器的相机装置
JP4022246B1 (ja) * 2007-05-09 2007-12-12 マイルストーン株式会社 撮像レンズ
JP3976781B1 (ja) * 2007-05-17 2007-09-19 マイルストーン株式会社 撮像レンズ
JP3976780B1 (ja) * 2007-05-17 2007-09-19 マイルストーン株式会社 撮像レンズ
JP3976782B1 (ja) 2007-05-17 2007-09-19 マイルストーン株式会社 撮像レンズ
JP2009017234A (ja) * 2007-07-04 2009-01-22 Sharp Corp カメラ装置
KR101594831B1 (ko) 2009-03-26 2016-02-17 삼성전자 주식회사 바이오 드라이브에서의 카메라 모듈 고정 구조
KR20110002266A (ko) * 2009-07-01 2011-01-07 삼성테크윈 주식회사 촬상 모듈
DE102010023293B4 (de) 2010-06-10 2023-04-27 HELLA GmbH & Co. KGaA Kamera für ein Kraftfahrzeug
US8958212B2 (en) 2011-01-05 2015-02-17 Asustek Computer Inc. Electronic device
KR102375465B1 (ko) 2015-05-22 2022-03-21 주식회사 탑 엔지니어링 카메라 모듈 실장 장치
JP1565463S (enExample) * 2016-03-01 2016-12-19
JP1565462S (enExample) * 2016-03-01 2016-12-19
JP6390664B2 (ja) * 2016-05-20 2018-09-19 Smk株式会社 光学電子部品とソケットの接続構造

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5046953A (en) * 1990-05-25 1991-09-10 Hewlett-Packard Company Method and apparatus for mounting an integrated circuit on a printed circuit board
US5046954A (en) 1991-01-31 1991-09-10 Amp Incorporated Planar electrical connector
US5302778A (en) * 1992-08-28 1994-04-12 Eastman Kodak Company Semiconductor insulation for optical devices
US5358412A (en) * 1993-04-26 1994-10-25 Eastman Kodak Company Method and apparatus for assembling a flexible circuit to an LCD module
US5825560A (en) * 1995-02-28 1998-10-20 Canon Kabushiki Xaisha Optical apparatus
JP4129071B2 (ja) * 1998-03-20 2008-07-30 富士通株式会社 半導体部品および半導体実装装置
JP3607160B2 (ja) 2000-04-07 2005-01-05 三菱電機株式会社 撮像装置
US6603107B2 (en) 2000-04-10 2003-08-05 Mitsubishi Denki Kabushiki Kaisha Image pickup device and portable telephone
JP4405062B2 (ja) 2000-06-16 2010-01-27 株式会社ルネサステクノロジ 固体撮像装置
JP3630096B2 (ja) 2000-11-30 2005-03-16 三菱電機株式会社 撮像装置搭載携帯電話機

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