DE60330422D1 - Verfahren zum Befestigen eines Kameramoduls auf einer Leiterplatte - Google Patents

Verfahren zum Befestigen eines Kameramoduls auf einer Leiterplatte

Info

Publication number
DE60330422D1
DE60330422D1 DE60330422T DE60330422T DE60330422D1 DE 60330422 D1 DE60330422 D1 DE 60330422D1 DE 60330422 T DE60330422 T DE 60330422T DE 60330422 T DE60330422 T DE 60330422T DE 60330422 D1 DE60330422 D1 DE 60330422D1
Authority
DE
Germany
Prior art keywords
attaching
circuit board
printed circuit
camera module
camera
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60330422T
Other languages
German (de)
English (en)
Inventor
Atsushi Nishio
Takashi Kawasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsumi Electric Co Ltd
Original Assignee
Mitsumi Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsumi Electric Co Ltd filed Critical Mitsumi Electric Co Ltd
Application granted granted Critical
Publication of DE60330422D1 publication Critical patent/DE60330422D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49149—Assembling terminal to base by metal fusion bonding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Studio Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
DE60330422T 2002-07-29 2003-07-29 Verfahren zum Befestigen eines Kameramoduls auf einer Leiterplatte Expired - Lifetime DE60330422D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002220085A JP3755149B2 (ja) 2002-07-29 2002-07-29 カメラモジュールの基板への実装方法

Publications (1)

Publication Number Publication Date
DE60330422D1 true DE60330422D1 (de) 2010-01-21

Family

ID=30112902

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60330422T Expired - Lifetime DE60330422D1 (de) 2002-07-29 2003-07-29 Verfahren zum Befestigen eines Kameramoduls auf einer Leiterplatte

Country Status (5)

Country Link
US (1) US6862804B2 (enExample)
EP (1) EP1387442B1 (enExample)
JP (1) JP3755149B2 (enExample)
KR (1) KR100798732B1 (enExample)
DE (1) DE60330422D1 (enExample)

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* Cited by examiner, † Cited by third party
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TW200509480A (en) * 2003-08-27 2005-03-01 Mitsumi Electric Co Ltd Connector for camera module
JP2005222876A (ja) 2004-02-09 2005-08-18 Smk Corp モジュール用コネクタ
TWI282873B (en) * 2004-03-12 2007-06-21 Premier Image Technology Corp Lens module and assembling method thereof
KR100568769B1 (ko) 2004-04-23 2006-04-07 앰코 테크놀로지 코리아 주식회사 카메라모듈용 마운트
US7918671B2 (en) * 2004-07-13 2011-04-05 Research In Motion Limited Mounting structure with springs biasing towards a latching edge
CN2749141Y (zh) * 2004-10-25 2005-12-28 富士康(昆山)电脑接插件有限公司 电连接器
JP4091593B2 (ja) * 2004-11-05 2008-05-28 Ｓｍｋ株式会社 オートフォーカス機能付カメラモジュールとモジュール用コネクタの接続構造
CN2766377Y (zh) * 2004-12-04 2006-03-22 富士康(昆山)电脑接插件有限公司 电连接器
JP4562538B2 (ja) * 2005-01-31 2010-10-13 モレックス インコーポレイテド モジュール用ソケット
US20060189216A1 (en) * 2005-02-18 2006-08-24 Ming-Hsun Yang Camera module connector keying structure
TWM271287U (en) * 2005-02-18 2005-07-21 Molex Taiwan Ltd Camera module connector
CN2791967Y (zh) * 2005-03-25 2006-06-28 富士康(昆山)电脑接插件有限公司 电连接器
CN100399637C (zh) * 2005-05-16 2008-07-02 富士康(昆山)电脑接插件有限公司 电连接器
JP4182529B2 (ja) * 2005-07-21 2008-11-19 Ｓｍｋ株式会社 電子部品取付用ソケット及びそれに使用するコンタクトキャリヤ
CN100377434C (zh) * 2005-08-05 2008-03-26 富士康(昆山)电脑接插件有限公司 电连接器组件
CN2831478Y (zh) * 2005-08-11 2006-10-25 富士康(昆山)电脑接插件有限公司 电连接器组件及安装该组件的电子设备
US7121864B1 (en) * 2005-09-30 2006-10-17 Hon Hai Precision Ind. Co., Ltd. Module connector
TWM288979U (en) * 2005-10-03 2006-03-21 Hon Hai Prec Ind Co Ltd Electrical connector
KR101110152B1 (ko) * 2006-01-06 2012-01-31 에스케이플래닛 주식회사 이동통신 단말기를 이용한 원격 수족관 관람 시스템 및방법
TWM304793U (en) * 2006-04-03 2007-01-11 Hon Hai Prec Ind Co Ltd Electrical connector assembly
KR100772601B1 (ko) * 2006-06-14 2007-11-01 서울전자통신(주) 카메라모듈 실장방법
CN2932759Y (zh) * 2006-07-04 2007-08-08 富士康(昆山)电脑接插件有限公司 电连接器组件
CN200941518Y (zh) * 2006-08-01 2007-08-29 富士康(昆山)电脑接插件有限公司 电连接器
TWM310502U (en) * 2006-11-17 2007-04-21 Molex Taiwan Ltd Electrical connection device
JP3926380B1 (ja) 2006-12-07 2007-06-06 マイルストーン株式会社 撮像レンズ
JP3929479B1 (ja) * 2006-12-21 2007-06-13 マイルストーン株式会社 撮像レンズ
JP3946245B1 (ja) * 2007-03-08 2007-07-18 マイルストーン株式会社 撮像レンズ
CN101295848B (zh) * 2007-04-27 2010-06-09 鸿富锦精密工业（深圳）有限公司 电连接器及具有该电连接器的相机装置
JP4022246B1 (ja) * 2007-05-09 2007-12-12 マイルストーン株式会社 撮像レンズ
JP3976781B1 (ja) * 2007-05-17 2007-09-19 マイルストーン株式会社 撮像レンズ
JP3976780B1 (ja) * 2007-05-17 2007-09-19 マイルストーン株式会社 撮像レンズ
JP3976782B1 (ja) 2007-05-17 2007-09-19 マイルストーン株式会社 撮像レンズ
JP2009017234A (ja) * 2007-07-04 2009-01-22 Sharp Corp カメラ装置
KR101594831B1 (ko) 2009-03-26 2016-02-17 삼성전자 주식회사 바이오 드라이브에서의 카메라 모듈 고정 구조
KR20110002266A (ko) * 2009-07-01 2011-01-07 삼성테크윈 주식회사 촬상 모듈
DE102010023293B4 (de) 2010-06-10 2023-04-27 HELLA GmbH & Co. KGaA Kamera für ein Kraftfahrzeug
US8958212B2 (en) 2011-01-05 2015-02-17 Asustek Computer Inc. Electronic device
KR102375465B1 (ko) 2015-05-22 2022-03-21 주식회사 탑 엔지니어링 카메라 모듈 실장 장치
JP1565463S (enExample) * 2016-03-01 2016-12-19
JP1565462S (enExample) * 2016-03-01 2016-12-19
JP6390664B2 (ja) * 2016-05-20 2018-09-19 Smk株式会社 光学電子部品とソケットの接続構造

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US5046953A (en) * 1990-05-25 1991-09-10 Hewlett-Packard Company Method and apparatus for mounting an integrated circuit on a printed circuit board
US5046954A (en) 1991-01-31 1991-09-10 Amp Incorporated Planar electrical connector
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JP3630096B2 (ja) 2000-11-30 2005-03-16 三菱電機株式会社 撮像装置搭載携帯電話機

Also Published As

Publication number Publication date
US6862804B2 (en) 2005-03-08
KR20040011360A (ko) 2004-02-05
US20040068868A1 (en) 2004-04-15
EP1387442A1 (en) 2004-02-04
JP2004063787A (ja) 2004-02-26
KR100798732B1 (ko) 2008-01-29
EP1387442B1 (en) 2009-12-09
JP3755149B2 (ja) 2006-03-15

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Legal Events

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