JP2005139458A5 - - Google Patents

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Publication number
JP2005139458A5
JP2005139458A5 JP2004324479A JP2004324479A JP2005139458A5 JP 2005139458 A5 JP2005139458 A5 JP 2005139458A5 JP 2004324479 A JP2004324479 A JP 2004324479A JP 2004324479 A JP2004324479 A JP 2004324479A JP 2005139458 A5 JP2005139458 A5 JP 2005139458A5
Authority
JP
Japan
Prior art keywords
gold
many
epoxy
metal layer
environmental stability
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004324479A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005139458A (ja
JP5259044B2 (ja
Filing date
Publication date
Priority claimed from US10/705,266 external-priority patent/US7053521B2/en
Application filed filed Critical
Publication of JP2005139458A publication Critical patent/JP2005139458A/ja
Publication of JP2005139458A5 publication Critical patent/JP2005139458A5/ja
Application granted granted Critical
Publication of JP5259044B2 publication Critical patent/JP5259044B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2004324479A 2003-11-10 2004-11-09 金表面へのエポキシ接着を強化する方法 Expired - Fee Related JP5259044B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/705,266 2003-11-10
US10/705,266 US7053521B2 (en) 2003-11-10 2003-11-10 Method for enhancing epoxy adhesion to gold surfaces

Publications (3)

Publication Number Publication Date
JP2005139458A JP2005139458A (ja) 2005-06-02
JP2005139458A5 true JP2005139458A5 (enExample) 2007-12-27
JP5259044B2 JP5259044B2 (ja) 2013-08-07

Family

ID=34552320

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004324479A Expired - Fee Related JP5259044B2 (ja) 2003-11-10 2004-11-09 金表面へのエポキシ接着を強化する方法

Country Status (3)

Country Link
US (1) US7053521B2 (enExample)
JP (1) JP5259044B2 (enExample)
DE (1) DE102004054295A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8764664B2 (en) * 2005-11-28 2014-07-01 Vizyontech Imaging, Inc. Methods and apparatus for conformable medical data acquisition pad and configurable imaging system
JP5135575B2 (ja) * 2006-08-28 2013-02-06 国立大学法人岩手大学 機能性分子接着剤と分子接着性樹脂表面とその作成法並びに樹脂めっき製品もしくはプリント配線板の製造法
US7598119B2 (en) * 2007-03-12 2009-10-06 Texas Instruments Incorporated System and method for inhibiting and containing resin bleed-out from adhesive materials used in assembly of semiconductor devices
JP5315547B2 (ja) 2007-05-30 2013-10-16 国立大学法人 香川大学 接着方法並びにそれを用いて作製したバイオケミカルチップ及び光学部品
JP2009001754A (ja) 2007-06-25 2009-01-08 Kagawa Univ 接着構造、封止構造及びそれを用いた電子部品、接着方法並びに封止方法
JP2009130235A (ja) * 2007-11-27 2009-06-11 Panasonic Corp 圧電デバイスとこれを用いた電子機器、及び自動車
JP5346182B2 (ja) * 2008-07-30 2013-11-20 富士フイルム株式会社 体腔内超音波探触子
JP5257799B2 (ja) * 2009-02-27 2013-08-07 セイコーエプソン株式会社 弾性表面波共振子、弾性表面波発振器、及び電子機器
DE102012000063B4 (de) * 2012-01-03 2018-04-05 Festo Ag & Co. Kg Piezoelektrische Baugruppe und Verfahren zu ihrer Herstellung
US20250058333A1 (en) * 2021-12-17 2025-02-20 3M Innovative Properties Company Nozzle for dispensing adhesive and methods of dispensing adhesive
WO2023111839A2 (en) * 2021-12-17 2023-06-22 3M Innovative Properties Company Apparatus for dispensing adhesive and methods of dispensing adhesive

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6015654B2 (ja) * 1980-11-18 1985-04-20 日本電解株式会社 銅箔のクロメ−ト処理層と樹脂基材との接着方法
JPS60133083A (ja) * 1983-12-20 1985-07-16 Toagosei Chem Ind Co Ltd アルミニウムの接着方法
JP2663173B2 (ja) * 1989-05-26 1997-10-15 日本電信電話株式会社 接着促進剤及びその使用方法
JP2509773B2 (ja) * 1991-12-05 1996-06-26 住友ベークライト株式会社 異方導電フィルムの製造方法
JPH06122766A (ja) * 1992-09-24 1994-05-06 Mitsubishi Kasei Corp 改質ポリフェニレンサルファイド樹脂及びこれからなるコネクター
JPH06334287A (ja) * 1993-05-19 1994-12-02 Furukawa Electric Co Ltd:The アルミベースプリント配線板およびその製造方法
JPH07140348A (ja) * 1993-11-16 1995-06-02 Hitachi Cable Ltd 光導波路モジュールの製造方法
JP2991942B2 (ja) * 1994-12-28 1999-12-20 信越化学工業株式会社 プライマー組成物
GB9700904D0 (en) * 1997-01-17 1997-03-05 Dow Corning Reactive silicone/alkylenimine barrier laminating adhesives and applications thereof
JP4016409B2 (ja) * 1997-12-12 2007-12-05 Ｊｓｒ株式会社 液状硬化性樹脂組成物
JP2001123144A (ja) * 1999-10-28 2001-05-08 Hitachi Chem Co Ltd 難燃化接着剤、その製造法、難燃化接着部材、難燃化接着部材を備えた半導体搭載用配線基板及びこれを用いた半導体装置
JP4633236B2 (ja) * 2000-07-19 2011-02-16 株式会社クラレ 歯科用接着性組成物
JP4165065B2 (ja) * 2001-12-27 2008-10-15 日立化成工業株式会社 接着剤、接着剤の製造方法及びそれを用いた回路接続構造体の製造方法

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