JP5259044B2 - 金表面へのエポキシ接着を強化する方法 - Google Patents
金表面へのエポキシ接着を強化する方法 Download PDFInfo
- Publication number
- JP5259044B2 JP5259044B2 JP2004324479A JP2004324479A JP5259044B2 JP 5259044 B2 JP5259044 B2 JP 5259044B2 JP 2004324479 A JP2004324479 A JP 2004324479A JP 2004324479 A JP2004324479 A JP 2004324479A JP 5259044 B2 JP5259044 B2 JP 5259044B2
- Authority
- JP
- Japan
- Prior art keywords
- gold
- sulfur
- epoxy
- adhesive
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000010931 gold Substances 0.000 title claims description 43
- 229910052737 gold Inorganic materials 0.000 title claims description 43
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims description 42
- 239000004593 Epoxy Substances 0.000 title description 41
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 28
- 229910052717 sulfur Inorganic materials 0.000 claims description 28
- 239000011593 sulfur Substances 0.000 claims description 28
- 238000000034 method Methods 0.000 claims description 22
- 239000000853 adhesive Substances 0.000 claims description 20
- 230000001070 adhesive effect Effects 0.000 claims description 20
- 239000000758 substrate Substances 0.000 claims description 18
- 239000003795 chemical substances by application Substances 0.000 claims description 16
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical group CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 claims description 6
- 238000002156 mixing Methods 0.000 claims description 4
- 239000004841 bisphenol A epoxy resin Substances 0.000 claims description 3
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 38
- 239000000919 ceramic Substances 0.000 description 15
- 239000002184 metal Substances 0.000 description 15
- 229910052751 metal Inorganic materials 0.000 description 15
- 239000000203 mixture Substances 0.000 description 11
- 239000000126 substance Substances 0.000 description 7
- 239000004020 conductor Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 3
- 238000003491 array Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000000523 sample Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- PZKWCBTXXMNXDV-UHFFFAOYSA-N C(C)O[SiH](OCC)OCC.C1(=CC=CC=C1)PC1=CC=CC=C1 Chemical compound C(C)O[SiH](OCC)OCC.C1(=CC=CC=C1)PC1=CC=CC=C1 PZKWCBTXXMNXDV-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BWGNESOTFCXPMA-UHFFFAOYSA-N Dihydrogen disulfide Chemical compound SS BWGNESOTFCXPMA-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000006098 acoustic absorber Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000000834 fixative Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- NBXZNTLFQLUFES-UHFFFAOYSA-N triethoxy(propyl)silane Chemical compound CCC[Si](OCC)(OCC)OCC NBXZNTLFQLUFES-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/02—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
- C09J2400/163—Metal in the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
- Y10T156/1092—All laminae planar and face to face
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
処理対象 なし P220 D6110 M8500 B2494
表面 0.5 0.9 0.6 1.3 1.5
エポキシ内添加 0.6 1.1 0.6 4.2 4.6
4 信号電極
6 誘電フィルム
8 金属被膜
10 接地電極
12 音響インピーダンス整合層
14 音響減衰性材料
16、18 接着剤の薄層
Claims (5)
- 第一の基材を第二の基材に積層する方法であって、第一及び第二の基材の少なくとも一方の相互に対面している表面が少なくとも部分的に金で被覆されており、当該方法が、
(a)含硫アルコキシシランを含む溶液を混合するステップと、
(b)金に対面している各々の表面を前記溶液で処理するステップと、
(c)接着剤に含硫アルコキシシランを添加するステップと、
(d)前記接着剤を第一及び第二の基材の対面している表面の少なくとも一方に塗布するステップと、
(e)第一及び第二の基材の間に塗布した前記接着剤が硬化している間に第一及び第二の基材を固定した関係に保つするステップと
を含む方法。 - 前記溶液中の含硫アルコキシシランの濃度が0.1%−10%の範囲にある、請求項1に記載の方法。
- 前記接着剤中の含硫アルコキシシランの濃度が0.1%−10%の範囲にある、請求項1又は請求項2に記載の方法。
- 前記含硫アルコキシシランがメルカプトプロピルトリメトキシシラン又はジスルフィドプロピルトリエトキシシランである、請求項1乃至請求項3のいずれか1項に記載の方法。
- 前記接着剤が、脂肪族アミン硬化剤を用いて硬化するビスフェノールAエポキシ樹脂である、請求項1乃至請求項4のいずれか1項に記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/705,266 US7053521B2 (en) | 2003-11-10 | 2003-11-10 | Method for enhancing epoxy adhesion to gold surfaces |
US10/705,266 | 2003-11-10 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2005139458A JP2005139458A (ja) | 2005-06-02 |
JP2005139458A5 JP2005139458A5 (ja) | 2007-12-27 |
JP5259044B2 true JP5259044B2 (ja) | 2013-08-07 |
Family
ID=34552320
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004324479A Expired - Fee Related JP5259044B2 (ja) | 2003-11-10 | 2004-11-09 | 金表面へのエポキシ接着を強化する方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7053521B2 (ja) |
JP (1) | JP5259044B2 (ja) |
DE (1) | DE102004054295A1 (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8764664B2 (en) * | 2005-11-28 | 2014-07-01 | Vizyontech Imaging, Inc. | Methods and apparatus for conformable medical data acquisition pad and configurable imaging system |
JP5135575B2 (ja) * | 2006-08-28 | 2013-02-06 | 国立大学法人岩手大学 | 機能性分子接着剤と分子接着性樹脂表面とその作成法並びに樹脂めっき製品もしくはプリント配線板の製造法 |
US7598119B2 (en) * | 2007-03-12 | 2009-10-06 | Texas Instruments Incorporated | System and method for inhibiting and containing resin bleed-out from adhesive materials used in assembly of semiconductor devices |
JP5315547B2 (ja) | 2007-05-30 | 2013-10-16 | 国立大学法人 香川大学 | 接着方法並びにそれを用いて作製したバイオケミカルチップ及び光学部品 |
JP2009001754A (ja) | 2007-06-25 | 2009-01-08 | Kagawa Univ | 接着構造、封止構造及びそれを用いた電子部品、接着方法並びに封止方法 |
JP2009130235A (ja) * | 2007-11-27 | 2009-06-11 | Panasonic Corp | 圧電デバイスとこれを用いた電子機器、及び自動車 |
JP5346182B2 (ja) * | 2008-07-30 | 2013-11-20 | 富士フイルム株式会社 | 体腔内超音波探触子 |
EP2403141B1 (en) * | 2009-02-27 | 2018-10-24 | Seiko Epson Corporation | Surface acoustic wave resonator, surface acoustic wave oscillator, and electronic device |
DE102012000063B4 (de) | 2012-01-03 | 2018-04-05 | Festo Ag & Co. Kg | Piezoelektrische Baugruppe und Verfahren zu ihrer Herstellung |
WO2023111849A2 (en) * | 2021-12-17 | 2023-06-22 | 3M Innovative Properties Company | Nozzle for dispensing adhesive and methods of dispensing adhesive |
WO2023111839A2 (en) * | 2021-12-17 | 2023-06-22 | 3M Innovative Properties Company | Apparatus for dispensing adhesive and methods of dispensing adhesive |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6015654B2 (ja) * | 1980-11-18 | 1985-04-20 | 日本電解株式会社 | 銅箔のクロメ−ト処理層と樹脂基材との接着方法 |
JPS60133083A (ja) * | 1983-12-20 | 1985-07-16 | Toagosei Chem Ind Co Ltd | アルミニウムの接着方法 |
JP2663173B2 (ja) * | 1989-05-26 | 1997-10-15 | 日本電信電話株式会社 | 接着促進剤及びその使用方法 |
JP2509773B2 (ja) * | 1991-12-05 | 1996-06-26 | 住友ベークライト株式会社 | 異方導電フィルムの製造方法 |
JPH06122766A (ja) * | 1992-09-24 | 1994-05-06 | Mitsubishi Kasei Corp | 改質ポリフェニレンサルファイド樹脂及びこれからなるコネクター |
JPH06334287A (ja) * | 1993-05-19 | 1994-12-02 | Furukawa Electric Co Ltd:The | アルミベースプリント配線板およびその製造方法 |
JPH07140348A (ja) * | 1993-11-16 | 1995-06-02 | Hitachi Cable Ltd | 光導波路モジュールの製造方法 |
JP2991942B2 (ja) * | 1994-12-28 | 1999-12-20 | 信越化学工業株式会社 | プライマー組成物 |
GB9700904D0 (en) * | 1997-01-17 | 1997-03-05 | Dow Corning | Reactive silicone/alkylenimine barrier laminating adhesives and applications thereof |
JP4016409B2 (ja) * | 1997-12-12 | 2007-12-05 | Jsr株式会社 | 液状硬化性樹脂組成物 |
JP2001123144A (ja) * | 1999-10-28 | 2001-05-08 | Hitachi Chem Co Ltd | 難燃化接着剤、その製造法、難燃化接着部材、難燃化接着部材を備えた半導体搭載用配線基板及びこれを用いた半導体装置 |
JP4633236B2 (ja) * | 2000-07-19 | 2011-02-16 | 株式会社クラレ | 歯科用接着性組成物 |
JP4165065B2 (ja) * | 2001-12-27 | 2008-10-15 | 日立化成工業株式会社 | 接着剤、接着剤の製造方法及びそれを用いた回路接続構造体の製造方法 |
-
2003
- 2003-11-10 US US10/705,266 patent/US7053521B2/en not_active Expired - Fee Related
-
2004
- 2004-11-09 JP JP2004324479A patent/JP5259044B2/ja not_active Expired - Fee Related
- 2004-11-09 DE DE102004054295A patent/DE102004054295A1/de active Pending
Also Published As
Publication number | Publication date |
---|---|
US20050099089A1 (en) | 2005-05-12 |
US7053521B2 (en) | 2006-05-30 |
DE102004054295A1 (de) | 2005-06-09 |
JP2005139458A (ja) | 2005-06-02 |
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