JP2004533327A5 - - Google Patents

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Publication number
JP2004533327A5
JP2004533327A5 JP2003500307A JP2003500307A JP2004533327A5 JP 2004533327 A5 JP2004533327 A5 JP 2004533327A5 JP 2003500307 A JP2003500307 A JP 2003500307A JP 2003500307 A JP2003500307 A JP 2003500307A JP 2004533327 A5 JP2004533327 A5 JP 2004533327A5
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JP
Japan
Prior art keywords
composition
amount
alloy
present
composition according
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Pending
Application number
JP2003500307A
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English (en)
Japanese (ja)
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JP2004533327A (ja
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Priority claimed from PCT/US2001/017491 external-priority patent/WO2002097145A1/en
Publication of JP2004533327A publication Critical patent/JP2004533327A/ja
Publication of JP2004533327A5 publication Critical patent/JP2004533327A5/ja
Pending legal-status Critical Current

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JP2003500307A 2001-05-28 2001-05-28 高温鉛フリーハンダ用組成物、方法およびデバイス Pending JP2004533327A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2001/017491 WO2002097145A1 (en) 2001-05-28 2001-05-28 Compositions, methods and devices for high temperature lead-free solder

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2008332413A Division JP2009148832A (ja) 2008-12-26 2008-12-26 高温鉛フリーハンダ用組成物、方法およびデバイス

Publications (2)

Publication Number Publication Date
JP2004533327A JP2004533327A (ja) 2004-11-04
JP2004533327A5 true JP2004533327A5 (enExample) 2006-01-05

Family

ID=21742612

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003500307A Pending JP2004533327A (ja) 2001-05-28 2001-05-28 高温鉛フリーハンダ用組成物、方法およびデバイス

Country Status (7)

Country Link
EP (2) EP1705258A3 (enExample)
JP (1) JP2004533327A (enExample)
KR (1) KR100700233B1 (enExample)
CN (1) CN100475996C (enExample)
AT (1) ATE351929T1 (enExample)
DE (1) DE60126157T2 (enExample)
WO (1) WO2002097145A1 (enExample)

Families Citing this family (33)

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DE10147378A1 (de) * 2001-09-26 2003-02-20 Infineon Technologies Ag Bleifreies Weichlot, insbesondere Elektroniklot
JP2005095977A (ja) * 2003-08-26 2005-04-14 Sanyo Electric Co Ltd 回路装置
JP4639791B2 (ja) * 2004-12-20 2011-02-23 パナソニック株式会社 はんだ材料の生産方法
US8227536B2 (en) * 2005-08-11 2012-07-24 Senju Metal Industry Co., Ltd. Lead-free solder paste and its use
US9260768B2 (en) * 2005-12-13 2016-02-16 Indium Corporation Lead-free solder alloys and solder joints thereof with improved drop impact resistance
US20070138442A1 (en) * 2005-12-19 2007-06-21 Weiser Martin W Modified and doped solder alloys for electrical interconnects, methods of production and uses thereof
US20080118761A1 (en) * 2006-09-13 2008-05-22 Weiser Martin W Modified solder alloys for electrical interconnects, methods of production and uses thereof
JP2009158725A (ja) 2007-12-27 2009-07-16 Panasonic Corp 半導体装置およびダイボンド材
US20100294550A1 (en) * 2007-12-27 2010-11-25 Akio Furusawa Bonding material, electronic component and bonded structure
CN101332544A (zh) * 2008-05-28 2008-12-31 广州瀚源电子科技有限公司 高熔点无铅焊料及其生产工艺
WO2009157130A1 (ja) 2008-06-23 2009-12-30 パナソニック株式会社 接合構造および電子部品
WO2010122795A1 (ja) * 2009-04-22 2010-10-28 パナソニック株式会社 半導体装置
JP2011014705A (ja) * 2009-07-01 2011-01-20 Hitachi Ltd 半導体装置および半導体装置の製造方法
JP2011071152A (ja) * 2009-09-24 2011-04-07 Panasonic Corp 半導体装置及びその製造方法
CN101745752B (zh) * 2009-12-17 2011-12-14 北京有色金属研究总院 一种纳米增强铋基无铅高温焊料及其制备方法
JP4807465B1 (ja) 2010-06-28 2011-11-02 住友金属鉱山株式会社 Ｐｂフリーはんだ合金
EP2589459B1 (en) * 2010-06-30 2017-08-09 Senju Metal Industry Co., Ltd Bi-Sn-BASED HIGH-TEMPERATURE SOLDER ALLOY
JP5667467B2 (ja) * 2011-02-18 2015-02-12 有限会社 ナプラ 合金材料、回路基板、電子デバイス及びその製造方法
JP5093373B2 (ja) 2011-03-08 2012-12-12 住友金属鉱山株式会社 Ｐｂフリーはんだペースト
US10046417B2 (en) 2011-08-17 2018-08-14 Honeywell International Inc. Lead-free solder compositions
CN102430873B (zh) * 2011-10-26 2015-06-03 浙江亚通焊材有限公司 一种高温电子封装用无铅钎料及其制备方法
CN103014401B (zh) * 2012-12-05 2014-12-03 昆明贵金属研究所 一种金合金及其制备方法
KR20140121211A (ko) * 2013-04-05 2014-10-15 부산대학교 산학협력단 고융점 무연 솔더 조성물, 고융점 무연 솔더 합금 제조방법 및 이의 용도
EP3047937A4 (en) * 2013-09-20 2017-05-17 Sumitomo Metal Mining Co., Ltd. Bi GROUP SOLDER ALLOY, METHOD FOR BONDING ELECTRONIC PART USING SAME, AND ELECTRONIC PART MOUNTING SUBSTRATE
JP5852080B2 (ja) * 2013-11-05 2016-02-03 ローム株式会社 半導体装置
JP6543890B2 (ja) * 2014-04-14 2019-07-17 富士電機株式会社 高温はんだ合金
KR101637288B1 (ko) * 2014-11-14 2016-07-07 현대자동차 주식회사 은 페이스트의 접합 방법
CN106001982A (zh) * 2016-07-08 2016-10-12 重庆科技学院 一种高熔点无铅铋银锡钎料及其制备方法
TWI647316B (zh) * 2016-07-15 2019-01-11 Ｊｘ金屬股份有限公司 Solder alloy
CN106914711B (zh) * 2017-04-13 2019-04-23 杭州哈尔斯实业有限公司 一种不锈钢真空容器用无铅焊料及其制造方法和钎焊方法
CN108004429A (zh) * 2017-11-29 2018-05-08 广西厚思品牌策划顾问有限公司 一种低熔点无铅焊料合金及其制备方法
FR3087369B1 (fr) * 2018-10-19 2021-06-04 Dehon Sa Alliage de brasure et utilisation d'un tel alliage
CN114248037A (zh) * 2021-12-28 2022-03-29 昆山市天和焊锡制造有限公司 一种高抗氧化性无铅焊锡材料

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US5389160A (en) * 1993-06-01 1995-02-14 Motorola, Inc. Tin bismuth solder paste, and method using paste to form connection having improved high temperature properties
US5368814A (en) * 1993-06-16 1994-11-29 International Business Machines, Inc. Lead free, tin-bismuth solder alloys
ES2142008T3 (es) * 1996-01-31 2000-04-01 Leybold Materials Gmbh Blanco para proyeccion ionica constituido por estaño o una aleacion a base de estaño.
KR19980068127A (ko) * 1997-02-15 1998-10-15 김광호 납땜용 무연 합금
JP3249774B2 (ja) * 1997-06-05 2002-01-21 トヨタ自動車株式会社 摺動部材
JP3829475B2 (ja) * 1998-05-13 2006-10-04 株式会社村田製作所 Ｃｕ系母材接合用のはんだ組成物
JP2000094181A (ja) * 1998-09-24 2000-04-04 Sony Corp はんだ合金組成物
JP2001121285A (ja) * 1999-10-25 2001-05-08 Sumitomo Metal Mining Co Ltd ダイボンディング用半田合金

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