JP2004533327A - 高温鉛フリーハンダ用組成物、方法およびデバイス - Google Patents

高温鉛フリーハンダ用組成物、方法およびデバイス Download PDF

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Publication number
JP2004533327A
JP2004533327A JP2003500307A JP2003500307A JP2004533327A JP 2004533327 A JP2004533327 A JP 2004533327A JP 2003500307 A JP2003500307 A JP 2003500307A JP 2003500307 A JP2003500307 A JP 2003500307A JP 2004533327 A JP2004533327 A JP 2004533327A
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Japan
Prior art keywords
amount
composition
alloy
present
solder
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Pending
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JP2003500307A
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English (en)
Japanese (ja)
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JP2004533327A5 (enExample
Inventor
ラレーナ，ジヨン
デイーン，ナンシー
ワイザー，マーテイン
Original Assignee
ハネウエル・インターナシヨナル・インコーポレーテツド
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Publication of JP2004533327A publication Critical patent/JP2004533327A/ja
Publication of JP2004533327A5 publication Critical patent/JP2004533327A5/ja
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/264—Bi as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C12/00—Alloys based on antimony or bismuth
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/02—Alloys based on gold
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B23K2035/008—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of silicium
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Die Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
JP2003500307A 2001-05-28 2001-05-28 高温鉛フリーハンダ用組成物、方法およびデバイス Pending JP2004533327A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2001/017491 WO2002097145A1 (en) 2001-05-28 2001-05-28 Compositions, methods and devices for high temperature lead-free solder

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2008332413A Division JP2009148832A (ja) 2008-12-26 2008-12-26 高温鉛フリーハンダ用組成物、方法およびデバイス

Publications (2)

Publication Number Publication Date
JP2004533327A true JP2004533327A (ja) 2004-11-04
JP2004533327A5 JP2004533327A5 (enExample) 2006-01-05

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JP2003500307A Pending JP2004533327A (ja) 2001-05-28 2001-05-28 高温鉛フリーハンダ用組成物、方法およびデバイス

Country Status (7)

Country Link
EP (2) EP1705258A3 (enExample)
JP (1) JP2004533327A (enExample)
KR (1) KR100700233B1 (enExample)
CN (1) CN100475996C (enExample)
AT (1) ATE351929T1 (enExample)
DE (1) DE60126157T2 (enExample)
WO (1) WO2002097145A1 (enExample)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006167790A (ja) * 2004-12-20 2006-06-29 Matsushita Electric Ind Co Ltd はんだ材料の生産方法
WO2009084155A1 (ja) * 2007-12-27 2009-07-09 Panasonic Corporation 接合材料、電子部品および接合構造体
WO2010122795A1 (ja) * 2009-04-22 2010-10-28 パナソニック株式会社 半導体装置
WO2011001818A1 (ja) * 2009-07-01 2011-01-06 株式会社日立製作所 半導体装置および半導体装置の製造方法
WO2011036829A1 (ja) * 2009-09-24 2011-03-31 パナソニック株式会社 半導体装置及びその製造方法
WO2012002173A1 (ja) * 2010-06-30 2012-01-05 千住金属工業株式会社 Bi-Sn系高温はんだ合金
JP2012172178A (ja) * 2011-02-18 2012-09-10 Napra Co Ltd 合金材料、回路基板、電子デバイス及びその製造方法
DE112011102163T5 (de) 2010-06-28 2013-05-16 Sumitomo Metal Mining Co., Ltd. Pb-freie Lotlegierung
DE112011105017T5 (de) 2011-03-08 2013-12-19 Sumitomo Metal Mining Co., Ltd. Pb-freie Lotpaste
JP2014027314A (ja) * 2013-11-05 2014-02-06 Rohm Co Ltd 半導体装置および半導体装置の製造方法
JP2015202507A (ja) * 2014-04-14 2015-11-16 富士電機株式会社 高温はんだ合金
JP2017509489A (ja) * 2014-02-20 2017-04-06 ハネウェル・インターナショナル・インコーポレーテッド 鉛フリーはんだ組成物

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10147378A1 (de) * 2001-09-26 2003-02-20 Infineon Technologies Ag Bleifreies Weichlot, insbesondere Elektroniklot
JP2005095977A (ja) * 2003-08-26 2005-04-14 Sanyo Electric Co Ltd 回路装置
JP4894758B2 (ja) * 2005-08-11 2012-03-14 千住金属工業株式会社 鉛フリーソルダペーストとその応用
US9260768B2 (en) * 2005-12-13 2016-02-16 Indium Corporation Lead-free solder alloys and solder joints thereof with improved drop impact resistance
WO2007075763A1 (en) * 2005-12-19 2007-07-05 Honeywell International, Inc. Modified and doped solder alloys for electrical interconnects, methods of production and uses thereof
JP2010503538A (ja) * 2006-09-13 2010-02-04 ハネウェル・インターナショナル・インコーポレーテッド 電気的相互接続のための改良されたはんだ合金、その製造方法、およびその使用
JP2009158725A (ja) 2007-12-27 2009-07-16 Panasonic Corp 半導体装置およびダイボンド材
CN101332544A (zh) * 2008-05-28 2008-12-31 广州瀚源电子科技有限公司 高熔点无铅焊料及其生产工艺
CN102017107B (zh) 2008-06-23 2013-05-08 松下电器产业株式会社 接合结构以及电子器件
CN101745752B (zh) * 2009-12-17 2011-12-14 北京有色金属研究总院 一种纳米增强铋基无铅高温焊料及其制备方法
CN102430873B (zh) * 2011-10-26 2015-06-03 浙江亚通焊材有限公司 一种高温电子封装用无铅钎料及其制备方法
CN103014401B (zh) * 2012-12-05 2014-12-03 昆明贵金属研究所 一种金合金及其制备方法
KR20140121211A (ko) * 2013-04-05 2014-10-15 부산대학교 산학협력단 고융점 무연 솔더 조성물, 고융점 무연 솔더 합금 제조방법 및 이의 용도
WO2015041018A1 (ja) * 2013-09-20 2015-03-26 住友金属鉱山株式会社 Ｂｉ基はんだ合金、並びにそれを用いた電子部品のボンディング方法および電子部品実装基板
KR101637288B1 (ko) 2014-11-14 2016-07-07 현대자동차 주식회사 은 페이스트의 접합 방법
CN106001982A (zh) * 2016-07-08 2016-10-12 重庆科技学院 一种高熔点无铅铋银锡钎料及其制备方法
TWI647316B (zh) * 2016-07-15 2019-01-11 Ｊｘ金屬股份有限公司 Solder alloy
CN106914711B (zh) * 2017-04-13 2019-04-23 杭州哈尔斯实业有限公司 一种不锈钢真空容器用无铅焊料及其制造方法和钎焊方法
CN108004429A (zh) * 2017-11-29 2018-05-08 广西厚思品牌策划顾问有限公司 一种低熔点无铅焊料合金及其制备方法
FR3087369B1 (fr) * 2018-10-19 2021-06-04 Dehon Sa Alliage de brasure et utilisation d'un tel alliage
CN114248037A (zh) * 2021-12-28 2022-03-29 昆山市天和焊锡制造有限公司 一种高抗氧化性无铅焊锡材料

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5389160A (en) * 1993-06-01 1995-02-14 Motorola, Inc. Tin bismuth solder paste, and method using paste to form connection having improved high temperature properties
US5368814A (en) * 1993-06-16 1994-11-29 International Business Machines, Inc. Lead free, tin-bismuth solder alloys
EP0787819B1 (de) * 1996-01-31 1999-12-22 LEYBOLD MATERIALS GmbH Sputtertarget aus einer Zinn- oder Zinn-Basislegierung
KR19980068127A (ko) * 1997-02-15 1998-10-15 김광호 납땜용 무연 합금
JP3249774B2 (ja) * 1997-06-05 2002-01-21 トヨタ自動車株式会社 摺動部材
JP3829475B2 (ja) * 1998-05-13 2006-10-04 株式会社村田製作所 Ｃｕ系母材接合用のはんだ組成物
JP2000094181A (ja) * 1998-09-24 2000-04-04 Sony Corp はんだ合金組成物
JP2001121285A (ja) * 1999-10-25 2001-05-08 Sumitomo Metal Mining Co Ltd ダイボンディング用半田合金

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006167790A (ja) * 2004-12-20 2006-06-29 Matsushita Electric Ind Co Ltd はんだ材料の生産方法
WO2009084155A1 (ja) * 2007-12-27 2009-07-09 Panasonic Corporation 接合材料、電子部品および接合構造体
JP5383795B2 (ja) * 2009-04-22 2014-01-08 パナソニック株式会社 半導体装置
WO2010122795A1 (ja) * 2009-04-22 2010-10-28 パナソニック株式会社 半導体装置
US8691377B2 (en) 2009-04-22 2014-04-08 Panasonic Corporation Semiconductor device
WO2011001818A1 (ja) * 2009-07-01 2011-01-06 株式会社日立製作所 半導体装置および半導体装置の製造方法
WO2011036829A1 (ja) * 2009-09-24 2011-03-31 パナソニック株式会社 半導体装置及びその製造方法
US9199339B2 (en) 2010-06-28 2015-12-01 Sumitomo Metal Mining Co., Ltd. Pb-free solder alloy
DE112011102163T5 (de) 2010-06-28 2013-05-16 Sumitomo Metal Mining Co., Ltd. Pb-freie Lotlegierung
DE112011102163B4 (de) * 2010-06-28 2015-09-24 Sumitomo Metal Mining Co., Ltd. Pb-freie Lotlegierung
JP5278616B2 (ja) * 2010-06-30 2013-09-04 千住金属工業株式会社 Ｂｉ−Ｓｎ系高温はんだ合金
WO2012002173A1 (ja) * 2010-06-30 2012-01-05 千住金属工業株式会社 Bi-Sn系高温はんだ合金
US9205513B2 (en) 2010-06-30 2015-12-08 Senju Metal Industry Co., Ltd. Bi—Sn based high-temperature solder alloy
JP2012172178A (ja) * 2011-02-18 2012-09-10 Napra Co Ltd 合金材料、回路基板、電子デバイス及びその製造方法
DE112011105017T5 (de) 2011-03-08 2013-12-19 Sumitomo Metal Mining Co., Ltd. Pb-freie Lotpaste
US9227273B2 (en) 2011-03-08 2016-01-05 Sumitomo Metal Mining Co., Ltd. Pb-free solder paste
DE112011105017B4 (de) * 2011-03-08 2016-07-07 Sumitomo Metal Mining Co., Ltd. Pb-freie Lotpaste
US10046417B2 (en) 2011-08-17 2018-08-14 Honeywell International Inc. Lead-free solder compositions
US10661393B2 (en) 2011-08-17 2020-05-26 Honeywell International Inc. Lead-free solder compositions
JP2014027314A (ja) * 2013-11-05 2014-02-06 Rohm Co Ltd 半導体装置および半導体装置の製造方法
JP2017509489A (ja) * 2014-02-20 2017-04-06 ハネウェル・インターナショナル・インコーポレーテッド 鉛フリーはんだ組成物
JP2015202507A (ja) * 2014-04-14 2015-11-16 富士電機株式会社 高温はんだ合金

Also Published As

Publication number Publication date
DE60126157D1 (de) 2007-03-08
ATE351929T1 (de) 2007-02-15
EP1399600B1 (en) 2007-01-17
EP1399600A4 (en) 2005-05-04
EP1705258A2 (en) 2006-09-27
WO2002097145A1 (en) 2002-12-05
EP1399600A1 (en) 2004-03-24
WO2002097145B1 (en) 2004-05-27
KR100700233B1 (ko) 2007-03-26
EP1705258A3 (en) 2007-01-17
KR20030096420A (ko) 2003-12-24
DE60126157T2 (de) 2007-12-13
CN100475996C (zh) 2009-04-08
CN1507499A (zh) 2004-06-23

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