JP4391299B2 - はんだ材料およびはんだ付け物品 - Google Patents

はんだ材料およびはんだ付け物品 Download PDF

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Publication number
JP4391299B2
JP4391299B2 JP2004122892A JP2004122892A JP4391299B2 JP 4391299 B2 JP4391299 B2 JP 4391299B2 JP 2004122892 A JP2004122892 A JP 2004122892A JP 2004122892 A JP2004122892 A JP 2004122892A JP 4391299 B2 JP4391299 B2 JP 4391299B2
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Japan
Prior art keywords
point
solder
solder material
temperature
composition
Prior art date
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Expired - Fee Related
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JP2004122892A
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Japanese (ja)
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JP2005305472A (ja
JP2005305472A5 (enExample
Inventor
彰男 古澤
憲一郎 末次
宏明 高野
正人 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
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Priority to JP2004122892A priority Critical patent/JP4391299B2/ja
Publication of JP2005305472A publication Critical patent/JP2005305472A/ja
Publication of JP2005305472A5 publication Critical patent/JP2005305472A5/ja
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Publication of JP4391299B2 publication Critical patent/JP4391299B2/ja
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Expired - Fee Related legal-status Critical Current

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JP2004122892A 2004-04-19 2004-04-19 はんだ材料およびはんだ付け物品 Expired - Fee Related JP4391299B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004122892A JP4391299B2 (ja) 2004-04-19 2004-04-19 はんだ材料およびはんだ付け物品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004122892A JP4391299B2 (ja) 2004-04-19 2004-04-19 はんだ材料およびはんだ付け物品

Publications (3)

Publication Number Publication Date
JP2005305472A JP2005305472A (ja) 2005-11-04
JP2005305472A5 JP2005305472A5 (enExample) 2007-03-29
JP4391299B2 true JP4391299B2 (ja) 2009-12-24

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ID=35434829

Family Applications (1)

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JP2004122892A Expired - Fee Related JP4391299B2 (ja) 2004-04-19 2004-04-19 はんだ材料およびはんだ付け物品

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JP (1) JP4391299B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070138442A1 (en) * 2005-12-19 2007-06-21 Weiser Martin W Modified and doped solder alloys for electrical interconnects, methods of production and uses thereof
KR101913994B1 (ko) * 2015-03-10 2018-12-28 인듐 코포레이션 혼합 합금 땜납 페이스트

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Publication number Publication date
JP2005305472A (ja) 2005-11-04

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