WO2001072466A3 - Anti-scavenging solders for silver metallization and method - Google Patents

Anti-scavenging solders for silver metallization and method Download PDF

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Publication number
WO2001072466A3
WO2001072466A3 PCT/US2001/009316 US0109316W WO0172466A3 WO 2001072466 A3 WO2001072466 A3 WO 2001072466A3 US 0109316 W US0109316 W US 0109316W WO 0172466 A3 WO0172466 A3 WO 0172466A3
Authority
WO
WIPO (PCT)
Prior art keywords
solder
solders
scavenging
silver
silver metallization
Prior art date
Application number
PCT/US2001/009316
Other languages
French (fr)
Other versions
WO2001072466A2 (en
Inventor
Rong-Fong Huang
Jian-Ku Shang
Ross A Miesem
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Priority to AU2001249378A priority Critical patent/AU2001249378A1/en
Publication of WO2001072466A2 publication Critical patent/WO2001072466A2/en
Publication of WO2001072466A3 publication Critical patent/WO2001072466A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Powder Metallurgy (AREA)

Abstract

Solder and a method of manufacturing the solder are disclosed wherein powdered free silver (15) is added to a solder alloy (12) with a particle size sufficient to preserve silver metallization during use and with a concentration sufficient to maximize the effectiveness and avoid adverse effects on solder reflow characteristics. Preferably, the particle size is in a range of approximately 5 νm to 20 νm and the powdered free silver is added in a concentration of approximately 5 % to 10 %.
PCT/US2001/009316 2000-03-24 2001-03-22 Anti-scavenging solders for silver metallization and method WO2001072466A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2001249378A AU2001249378A1 (en) 2000-03-24 2001-03-22 Anti-scavenging solders for silver metallization and method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US53451500A 2000-03-24 2000-03-24
US09/534,515 2000-03-24

Publications (2)

Publication Number Publication Date
WO2001072466A2 WO2001072466A2 (en) 2001-10-04
WO2001072466A3 true WO2001072466A3 (en) 2002-01-31

Family

ID=24130388

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/009316 WO2001072466A2 (en) 2000-03-24 2001-03-22 Anti-scavenging solders for silver metallization and method

Country Status (2)

Country Link
AU (1) AU2001249378A1 (en)
WO (1) WO2001072466A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010048888A1 (en) * 2000-03-24 2001-12-06 Rong-Fong Huang Anti-scavenging solders for silver metallization and method
US7569164B2 (en) 2007-01-29 2009-08-04 Harima Chemicals, Inc. Solder precoating method
EP1952935B1 (en) * 2007-02-01 2016-05-11 Harima Chemicals, Inc. Solder paste composition and solder precoating method

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2431611A (en) * 1943-03-27 1947-11-25 Metals & Controls Corp Composite metal solder
EP0110307A2 (en) * 1982-11-24 1984-06-13 Samsung Electronics Co., Ltd. Semiconductor die-attach technique and composition therefor
US4740252A (en) * 1986-01-31 1988-04-26 Senju Metal Industry Co., Ltd. Solder paste for electronic parts
JPH01148487A (en) * 1987-12-01 1989-06-09 Uchihashi Estec Co Ltd Cream solder
JPH02207539A (en) * 1989-02-07 1990-08-17 Sanken Electric Co Ltd Semiconductor device
DE19743886A1 (en) * 1997-10-04 1999-04-08 Eurotec Ges Fuer Energiesparte Solder paste contains copper or nickel-plated aluminium balls

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2431611A (en) * 1943-03-27 1947-11-25 Metals & Controls Corp Composite metal solder
EP0110307A2 (en) * 1982-11-24 1984-06-13 Samsung Electronics Co., Ltd. Semiconductor die-attach technique and composition therefor
US4740252A (en) * 1986-01-31 1988-04-26 Senju Metal Industry Co., Ltd. Solder paste for electronic parts
JPH01148487A (en) * 1987-12-01 1989-06-09 Uchihashi Estec Co Ltd Cream solder
JPH02207539A (en) * 1989-02-07 1990-08-17 Sanken Electric Co Ltd Semiconductor device
DE19743886A1 (en) * 1997-10-04 1999-04-08 Eurotec Ges Fuer Energiesparte Solder paste contains copper or nickel-plated aluminium balls

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 013, no. 405 (M - 868) 7 September 1989 (1989-09-07) *
PATENT ABSTRACTS OF JAPAN vol. 014, no. 502 (E - 0997) 2 November 1990 (1990-11-02) *

Also Published As

Publication number Publication date
WO2001072466A2 (en) 2001-10-04
AU2001249378A1 (en) 2001-10-08

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